CA1233911A - Dispositifs a couche de polymere conducteur - Google Patents
Dispositifs a couche de polymere conducteurInfo
- Publication number
- CA1233911A CA1233911A CA000472607A CA472607A CA1233911A CA 1233911 A CA1233911 A CA 1233911A CA 000472607 A CA000472607 A CA 000472607A CA 472607 A CA472607 A CA 472607A CA 1233911 A CA1233911 A CA 1233911A
- Authority
- CA
- Canada
- Prior art keywords
- electrodes
- laminar element
- conductive polymer
- laminar
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920001940 conductive polymer Polymers 0.000 title claims description 27
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- 230000004224 protection Effects 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims description 18
- 238000001125 extrusion Methods 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 2
- 229910052729 chemical element Inorganic materials 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000007639 printing Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 238000011084 recovery Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000306 component Substances 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 102000006835 Lamins Human genes 0.000 description 1
- 108010047294 Lamins Proteins 0.000 description 1
- 229920000339 Marlex Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 210000005053 lamin Anatomy 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- MYSWGNHLJGOCPT-UHFFFAOYSA-N methyl prop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C=C MYSWGNHLJGOCPT-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009022 nonlinear effect Effects 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/146—Conductive polymers, e.g. polyethylene, thermoplastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/13—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current responsive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/006—Heaters using a particular layout for the resistive material or resistive elements using interdigitated electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Thermistors And Varistors (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57309984A | 1984-01-23 | 1984-01-23 | |
| US62894584A | 1984-07-10 | 1984-07-10 | |
| US628,945 | 1984-07-10 | ||
| US573,099 | 1990-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1233911A true CA1233911A (fr) | 1988-03-08 |
Family
ID=27076028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000472607A Expired CA1233911A (fr) | 1984-01-23 | 1985-01-22 | Dispositifs a couche de polymere conducteur |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP0158410A1 (fr) |
| CA (1) | CA1233911A (fr) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4884163A (en) * | 1985-03-14 | 1989-11-28 | Raychem Corporation | Conductive polymer devices |
| EP0209224B1 (fr) * | 1985-05-17 | 1992-08-05 | RAYCHEM CORPORATION (a Delaware corporation) | Eléments chauffants en forme de feuille |
| US4722853A (en) * | 1985-08-12 | 1988-02-02 | Raychem Corporation | Method of printing a polymer thick film ink |
| US4689475A (en) * | 1985-10-15 | 1987-08-25 | Raychem Corporation | Electrical devices containing conductive polymers |
| GB8529867D0 (en) * | 1985-12-04 | 1986-01-15 | Emi Plc Thorn | Temperature sensitive device |
| GB8604519D0 (en) * | 1986-02-24 | 1986-04-03 | Raychem Sa Nv | Electrical devices |
| EP0307200B1 (fr) * | 1987-09-09 | 1993-11-18 | Raychem A/S | Article thermorétractable |
| US4882466A (en) * | 1988-05-03 | 1989-11-21 | Raychem Corporation | Electrical devices comprising conductive polymers |
| US4885457A (en) * | 1988-09-30 | 1989-12-05 | Raychem Corporation | Method of making a conductive polymer sheet |
| JPH0732084B2 (ja) * | 1989-03-29 | 1995-04-10 | 株式会社村田製作所 | 有機正特性サーミスタ |
| JP2626041B2 (ja) * | 1989-04-06 | 1997-07-02 | 株式会社村田製作所 | 有機正特性サーミスタ |
| SE470081B (sv) * | 1992-05-19 | 1993-11-01 | Gustavsson Magnus Peter M | Elektriskt uppvärmt plagg eller liknande |
| TW309619B (fr) | 1995-08-15 | 1997-07-01 | Mourns Multifuse Hong Kong Ltd | |
| EP0845148B1 (fr) | 1995-08-15 | 2000-01-19 | Bourns Multifuse (Hong Kong), Ltd. | Dispositifs polymeriques conducteurs pour montage en surface et procede de fabrication |
| FR2761204B1 (fr) * | 1997-03-24 | 1999-05-14 | Siemens Automotive Sa | Dispositif de distribution d'energie electrique dans plusieurs circuits alimentes en paralleles, et procede de fabrication de ce dispositif |
| US6020808A (en) | 1997-09-03 | 2000-02-01 | Bourns Multifuse (Hong Kong) Ltd. | Multilayer conductive polymer positive temperature coefficent device |
| US6172591B1 (en) | 1998-03-05 | 2001-01-09 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
| US6236302B1 (en) | 1998-03-05 | 2001-05-22 | Bourns, Inc. | Multilayer conductive polymer device and method of manufacturing same |
| US6242997B1 (en) | 1998-03-05 | 2001-06-05 | Bourns, Inc. | Conductive polymer device and method of manufacturing same |
| WO2000019455A1 (fr) | 1998-09-25 | 2000-04-06 | Bourns, Inc. | Procede en deux etapes pour preparer des matieres polymeres a coefficient de temperature positif |
| US6429533B1 (en) | 1999-11-23 | 2002-08-06 | Bourns Inc. | Conductive polymer device and method of manufacturing same |
| EP3215869B1 (fr) | 2014-11-03 | 2021-12-08 | Illinois Tool Works Inc. | Dispositif de chauffage de face avant transmissif pour système de capteur de véhicule |
| DE102016105774A1 (de) * | 2016-03-30 | 2017-10-05 | Jenoptik Advanced Systems Gmbh | Beheizbares Flächenelement und Verfahren zum Herstellen desselben |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4177446A (en) * | 1975-12-08 | 1979-12-04 | Raychem Corporation | Heating elements comprising conductive polymers capable of dimensional change |
| US4034207A (en) * | 1976-01-23 | 1977-07-05 | Murata Manufacturing Co., Ltd. | Positive temperature coefficient semiconductor heating element |
| US4037082A (en) * | 1976-04-30 | 1977-07-19 | Murata Manufacturing Co., Ltd. | Positive temperature coefficient semiconductor heating device |
| US4426339B1 (en) * | 1976-12-13 | 1993-12-21 | Raychem Corp. | Method of making electrical devices comprising conductive polymer compositions |
| DE2946842C2 (de) * | 1979-11-20 | 1983-04-14 | Siemens AG, 1000 Berlin und 8000 München | Aus einem wabenförmigen Körper bestehendes Heizleiterelement aus Kaltleitermaterial |
| DE3175202D1 (en) * | 1980-04-21 | 1986-10-02 | Raychem Corp | Conductive polymer compositions containing fillers |
| US4481498A (en) * | 1982-02-17 | 1984-11-06 | Raychem Corporation | PTC Circuit protection device |
-
1985
- 1985-01-22 CA CA000472607A patent/CA1233911A/fr not_active Expired
- 1985-01-22 EP EP19850300415 patent/EP0158410A1/fr not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0158410A1 (fr) | 1985-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |