CA1185327A - Biomedical electrodes sputter metallized with platinum group - Google Patents
Biomedical electrodes sputter metallized with platinum groupInfo
- Publication number
- CA1185327A CA1185327A CA000402157A CA402157A CA1185327A CA 1185327 A CA1185327 A CA 1185327A CA 000402157 A CA000402157 A CA 000402157A CA 402157 A CA402157 A CA 402157A CA 1185327 A CA1185327 A CA 1185327A
- Authority
- CA
- Canada
- Prior art keywords
- electrode
- layer
- titanium
- electrode assembly
- improvement according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/056—Transvascular endocardial electrode systems
- A61N1/0565—Electrode heads
Landscapes
- Health & Medical Sciences (AREA)
- Heart & Thoracic Surgery (AREA)
- Vascular Medicine (AREA)
- Cardiology (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Radiology & Medical Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Electrotherapy Devices (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
Disclosed is a body implantable lead having an electrode with a thin layer of a biocompatible precious metal exposed to body tissue. The electrode structure is of a relatively inexpen-sive base metal such as titanium, which is considered biocom-patible for use as a cathode. A thin layer of titanium is sputtered over the distal tip of the electrode assembly. A thin outer layer of a precious metal from the plantinum group is sputtered over the sputtered titanium layer. The completed electrode assembly is used in the fabrication of a body implant-able lead using standard assembly practices.
Disclosed is a body implantable lead having an electrode with a thin layer of a biocompatible precious metal exposed to body tissue. The electrode structure is of a relatively inexpen-sive base metal such as titanium, which is considered biocom-patible for use as a cathode. A thin layer of titanium is sputtered over the distal tip of the electrode assembly. A thin outer layer of a precious metal from the plantinum group is sputtered over the sputtered titanium layer. The completed electrode assembly is used in the fabrication of a body implant-able lead using standard assembly practices.
Description
The present inven-tion relates generally to body implantable electronic equipment and more specifically relates to body implantable electrodes.
I-t is common to use plantinum and plantinum iridium electrodes in body implantable leads for cardiac pacing. This is desirable because -the platinum and platinum iridium alloy (usually 90% platinum and 10% iridium) have a high resistance to corrosion within the implant environment. These materials are also desir-able for the construction of electrodes because of the relatively low polarization associated with electrodes from this material.
The major disadvantage to this technique, however, is that a solid platinum or platinum iridium electrode is quite e~pensive to fabricate because of the high raw material cost.
A second approach to electrode fabrica-tion is discussed by Williamson in United States Patent No. 3,749,101 issued on July 31, 1973. Williamson describes an electrode having a basic titanium structure with a platinum insert. Williamson teaches that by plantinizing (i.e., plating platinum onto) the platinum insert to produce platinum black, a non polarizing muscle stimulating electrode is fabricated. This technique, though not in and of itselE popularly used, does teach the coating of a titanium electrode housing with a layer of a noble metal, in this case platinum. Notice, however, in the teaching of Williamson, -the titanium is not totally covered and therefore is also avail-able as a stimulation surface. This factor is brought out very clearly at column 4, lines 5-7 in which Williamson states that his lead "features a second electrode housing which is itself capable of carrying the stimulating current should -there be any malfunction of -the platinum".
A further problem that is found in Williamson is the difficulty in attaching the platinum sleeve or coil reliably to the titanium electrode assembly. Williamson does not go into any great detail in this matter, but those of ordinary s]cill in the art will be able to see that there is some difficulty in establishing and maintaining reliable attachment over several years' use. It is well known in -the scientific community that platinum black is very fragile such that in a cardiac electrode application, it would be susceptible to detachment simply by insertion into the heart. It is also established that platinum black is very susceptible to chemical contamination which would -tend to nega-te its non-polarization properties.
A topic not addressed by Wllliamson is that other metals within the platinum group (i.e., rhoclium and iridium) may in fact be more desirable as electrode surfaces than is platinum or an alloy of 90% platinum and 10% iridium. Little experiment-ation has been conducted with these materials since they, in fact, are too hard to be easily manufactured in-to electrodes of implantable size using techniques conventionally used to manu-facture electrodes.
SUMMARY OF THE INVENTION
The present invention teaches a body implantable lead having an electrode which overcomes these problems stated in the prior art. That is to say, the present invention utilizes a very tiny amount of precious metal to be placed in a very thin layer 5~3~','7 over the top of a base elec-trode assembly. This technique is very important in reducing -the raw material cost of the electrode assembly.
The second major advantage of the present invention is that the sputtering of the sur-face material over a]ayer of sputtered titanium, which is itselE sputtered over the base metal, provides reliable adhesion of the noble metal electrode surface. A third important and interesting aspect of the present invention is that it permits use of materials for the electrode surface which are not currently useful in the prior art electrodes. This is because the basic shape and characteristic form of the electrode assembly are created by common manufacturing techniques applied to the base metal electrode assembly. The material used for the stimulating surface, because it is merely sputtered on, need not be machined or worked in any way to establish its basic form. The basic form is established by the base metal electrode assembly. For this reason, materials having very desirable corrosion resistance and low polari~ation properties such as rhodium and iridium may now be used on body implantable leads without the difficulties associated with machining and forming such materials.
Thus~ in accordance with a broad aspect of the invention, there is provided, in a body implantable lead having a connector at a proximal end, an insulating sheath between said proximal end and a distal end, an electrode located near said distal end and having an exposed electrode surface for contacting body tissue, and a conductor extending from said connector to said electrode, within said insulating sheath, the improvement to said electrode comprising:
an electrode assembly :Eabricated of a first material;
a second material from the group consisting o~ platinum, iridium, ~g5~
rhodium, and alloys thereof, covering said exposed surface of said first material; and a layer of reactive metal comprising titanium intermediate said first material and said second material.
In accordance ~ith another broad aspect of the invention there is provided, in a body implantable lead having a proximal end, a distal end, a connector at said proximal end, an insulating sheath between said proximal end and said distal end, a conductor extending from said connector within said insulating sheath, and an electrode having an exposed surface for contacting body tissue located near said distal end and coupled to said conductor, the improvement to said electrode comprising:
an electrode assembly of a first material; and a second material from the group consisting of iridium, rhodium and alloys thereof covering said exposed surface of said first material.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a plan view of a body implantable lead of the unipolar type incorporating the present invention.
Figure 2 is a cross sectional view of the electrode assembly employing the present invention incorporated within the body implantable lead of Figure 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The presen-t invention is described in relation to the preferred mode of its practice. This involves the construction of a unipolar tined lead for stimulation and sensing using a cardiac pacer within the right ventricle. Those of ordinary skill in the art however, will be readily able to apply the invention as taught herein to other types of body implantable leads.
~ igure 1 is a plan view of a body implantable lead 10 incorporating the present invention. A-t the proximal end of the body implantable lead 10, a conductive terminal pin 16, which is attached to and used to conduct a stimulation pu:Lse from an implantable pulse generator (not sho-~l) to the body imPlarltablelead, is attached to a length of coiled wire conductor 11.
An insulator sheath 12 is formed about a portion of the pin 16 and the electrical conductor 11. O-rings 14 formed from the insulator 12 are used to establish a proper seal between connector sleeve 12 and the implantable pulse generator to prevent the ingress of - 4a -L~8~32~7 body fluids.
The conductor ll within the main body of body implant-able lead lO is covered with a insulating sheath 20. Insulating sheath 20 is preferably of polyurethane material. However, other commonly used body compatible insulators such as silicone rubber may be used. Insulating sheath 20 is stretched or formed at is distal end to cover the entire electrode assembly at enlargement 22.
Non-conducting tines 18 are employed to assist in acute fixation in the manner common in the art. The stimulating sur-face of body implantable lead lO is at the very distal tip. The distal tip 30 directly contacts body stimulatable tissue during pacing. The lead as described is similar to that shown and described in the commonly assigned United States Patent No.
3,902/501.
Figure 2 is a side sectional view of the electrode employed in body implantable lead 10 of the present invention.
Imaginary line 32 has been drawn to show the extent to which distal tip 30 is exposed~ That is, that par-t of the electrode assembly which is proximal ~to the right) of imaginary line 32 is covered by the stretched portion 22 of outer sheath 20 (shown in Figure 1). That portion of the electrode assembly in Figure 2 which is distal of dashed line 32 is the exposed distal tip 30.
The electrode assembly has a longitudinal lumen 34 into which the conductor coil 11 of the body implantable lead is inserted. This body implantable lead coil 11 is attached, using methods common in the ar-t in the manner shown, for example, in 353;~
the above-referenced patents. Shoulders 36 are used to ensure tha-t outer sheath 20 is properly gripped by the electrode assembly to ensure that the outer sheath 20 is reliably attached. The entire electrode assembly 38 is fabricated from a single piece of commercially pure grade titanium.
A distal lumen 44 is used for the insertion of a round piece of insulating material. This material reduces the overall effective stimulating surface and thereby increases effective current density of the electrode. Transverse lumen 40 is used to attach -the non-conducting material which is inserted into distal lumen 44.
Layer 50 is a layer of reactive metal (e.g., titanium, niobium, etc.) which is sputtered over the distal tip of titanium electrode assembly 38. This layer is on the order of 1,000 to 10,000 A in thickness for the preferred titanium although thicknesses of as much as 50,000 A are readily achievable in relatively short sputtering cycles. This layer of sputtered titanium (or other reactive metal) coats surface 42 of titanium electrode assembly 38. The sputtered layer 50 adheres to sur-face 42 of titanium electrode assembly 38, because a material ischosen which exhibits high chemical reactivity. In the preferred mode, this coincidentally produces a titanium/titanium interface at surface 42. However, sputtered layer 50 may be niobium or other highly reactive metal.
A layer of precious metal 60 is next sputtered over the sputtered titanium layer 50. The thickness of layer 60 may be as much as 50,000 A although a thickness of 1,000 A to 10,000 A
~ ~853;~7 is preferred. Because layer 60 is sputtered over layer 50, and layer 50 has been activated by the previous sputtering operation, excellent adhesion is established between precious metal layer 60 and reactive metal layer 50. Layer 60 may be selected from the yroup comprising platinum, rhodium, iridium, or alloys thereof.
Of course, Figure 2 shows layers 50 and 60 much larger than scale. However, they are shown in this manner for -the purpose of visualizing the present invention.
The sputtering process is accomplished using a Perkin-Elmer Model 2400 Sputtering System. This device has thecapability for both AC and Magnetron modes. Experience has shown that the Magnetron mode produces a higher sputtering rate, being on the order of 10,000 to 100,000 A per hour because of the magnetic field present. However, the AC mode which has a slower sputtering rate is preferred because it produces much more uniform target ware~
Although the controlling of pressure within the sput-tering chamber controls porosity and therefore, the presence of pinholes, the resulting produc-t will almost always contain some significant number of pinholes. It is therefore very important to use a material for electrode housing 38, which is of itself a body compatible cathode material such as titanium.
Attempts were made to fabricate similar electrocles using vacuum deposition techniques. Because the target in the vacuum deposition process is not self-cleaning as it is in the sputtering process, results obtained were not nearly as satisfy-ing. The vacuum deposition electrodes showed less adhesion because the target was not self-cleaning and because -the technique S3~
inherently provides less control over the porosity of -the surface.
The present invention as -taught herein is readily applied in the preferred mode to endocardial pacing electrodes.
Those of ordinary skill in the art will be readily able to apply the teachings herein to body implantable leads of other configur-ations and applica-tions.
I-t is common to use plantinum and plantinum iridium electrodes in body implantable leads for cardiac pacing. This is desirable because -the platinum and platinum iridium alloy (usually 90% platinum and 10% iridium) have a high resistance to corrosion within the implant environment. These materials are also desir-able for the construction of electrodes because of the relatively low polarization associated with electrodes from this material.
The major disadvantage to this technique, however, is that a solid platinum or platinum iridium electrode is quite e~pensive to fabricate because of the high raw material cost.
A second approach to electrode fabrica-tion is discussed by Williamson in United States Patent No. 3,749,101 issued on July 31, 1973. Williamson describes an electrode having a basic titanium structure with a platinum insert. Williamson teaches that by plantinizing (i.e., plating platinum onto) the platinum insert to produce platinum black, a non polarizing muscle stimulating electrode is fabricated. This technique, though not in and of itselE popularly used, does teach the coating of a titanium electrode housing with a layer of a noble metal, in this case platinum. Notice, however, in the teaching of Williamson, -the titanium is not totally covered and therefore is also avail-able as a stimulation surface. This factor is brought out very clearly at column 4, lines 5-7 in which Williamson states that his lead "features a second electrode housing which is itself capable of carrying the stimulating current should -there be any malfunction of -the platinum".
A further problem that is found in Williamson is the difficulty in attaching the platinum sleeve or coil reliably to the titanium electrode assembly. Williamson does not go into any great detail in this matter, but those of ordinary s]cill in the art will be able to see that there is some difficulty in establishing and maintaining reliable attachment over several years' use. It is well known in -the scientific community that platinum black is very fragile such that in a cardiac electrode application, it would be susceptible to detachment simply by insertion into the heart. It is also established that platinum black is very susceptible to chemical contamination which would -tend to nega-te its non-polarization properties.
A topic not addressed by Wllliamson is that other metals within the platinum group (i.e., rhoclium and iridium) may in fact be more desirable as electrode surfaces than is platinum or an alloy of 90% platinum and 10% iridium. Little experiment-ation has been conducted with these materials since they, in fact, are too hard to be easily manufactured in-to electrodes of implantable size using techniques conventionally used to manu-facture electrodes.
SUMMARY OF THE INVENTION
The present invention teaches a body implantable lead having an electrode which overcomes these problems stated in the prior art. That is to say, the present invention utilizes a very tiny amount of precious metal to be placed in a very thin layer 5~3~','7 over the top of a base elec-trode assembly. This technique is very important in reducing -the raw material cost of the electrode assembly.
The second major advantage of the present invention is that the sputtering of the sur-face material over a]ayer of sputtered titanium, which is itselE sputtered over the base metal, provides reliable adhesion of the noble metal electrode surface. A third important and interesting aspect of the present invention is that it permits use of materials for the electrode surface which are not currently useful in the prior art electrodes. This is because the basic shape and characteristic form of the electrode assembly are created by common manufacturing techniques applied to the base metal electrode assembly. The material used for the stimulating surface, because it is merely sputtered on, need not be machined or worked in any way to establish its basic form. The basic form is established by the base metal electrode assembly. For this reason, materials having very desirable corrosion resistance and low polari~ation properties such as rhodium and iridium may now be used on body implantable leads without the difficulties associated with machining and forming such materials.
Thus~ in accordance with a broad aspect of the invention, there is provided, in a body implantable lead having a connector at a proximal end, an insulating sheath between said proximal end and a distal end, an electrode located near said distal end and having an exposed electrode surface for contacting body tissue, and a conductor extending from said connector to said electrode, within said insulating sheath, the improvement to said electrode comprising:
an electrode assembly :Eabricated of a first material;
a second material from the group consisting o~ platinum, iridium, ~g5~
rhodium, and alloys thereof, covering said exposed surface of said first material; and a layer of reactive metal comprising titanium intermediate said first material and said second material.
In accordance ~ith another broad aspect of the invention there is provided, in a body implantable lead having a proximal end, a distal end, a connector at said proximal end, an insulating sheath between said proximal end and said distal end, a conductor extending from said connector within said insulating sheath, and an electrode having an exposed surface for contacting body tissue located near said distal end and coupled to said conductor, the improvement to said electrode comprising:
an electrode assembly of a first material; and a second material from the group consisting of iridium, rhodium and alloys thereof covering said exposed surface of said first material.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a plan view of a body implantable lead of the unipolar type incorporating the present invention.
Figure 2 is a cross sectional view of the electrode assembly employing the present invention incorporated within the body implantable lead of Figure 1.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
The presen-t invention is described in relation to the preferred mode of its practice. This involves the construction of a unipolar tined lead for stimulation and sensing using a cardiac pacer within the right ventricle. Those of ordinary skill in the art however, will be readily able to apply the invention as taught herein to other types of body implantable leads.
~ igure 1 is a plan view of a body implantable lead 10 incorporating the present invention. A-t the proximal end of the body implantable lead 10, a conductive terminal pin 16, which is attached to and used to conduct a stimulation pu:Lse from an implantable pulse generator (not sho-~l) to the body imPlarltablelead, is attached to a length of coiled wire conductor 11.
An insulator sheath 12 is formed about a portion of the pin 16 and the electrical conductor 11. O-rings 14 formed from the insulator 12 are used to establish a proper seal between connector sleeve 12 and the implantable pulse generator to prevent the ingress of - 4a -L~8~32~7 body fluids.
The conductor ll within the main body of body implant-able lead lO is covered with a insulating sheath 20. Insulating sheath 20 is preferably of polyurethane material. However, other commonly used body compatible insulators such as silicone rubber may be used. Insulating sheath 20 is stretched or formed at is distal end to cover the entire electrode assembly at enlargement 22.
Non-conducting tines 18 are employed to assist in acute fixation in the manner common in the art. The stimulating sur-face of body implantable lead lO is at the very distal tip. The distal tip 30 directly contacts body stimulatable tissue during pacing. The lead as described is similar to that shown and described in the commonly assigned United States Patent No.
3,902/501.
Figure 2 is a side sectional view of the electrode employed in body implantable lead 10 of the present invention.
Imaginary line 32 has been drawn to show the extent to which distal tip 30 is exposed~ That is, that par-t of the electrode assembly which is proximal ~to the right) of imaginary line 32 is covered by the stretched portion 22 of outer sheath 20 (shown in Figure 1). That portion of the electrode assembly in Figure 2 which is distal of dashed line 32 is the exposed distal tip 30.
The electrode assembly has a longitudinal lumen 34 into which the conductor coil 11 of the body implantable lead is inserted. This body implantable lead coil 11 is attached, using methods common in the ar-t in the manner shown, for example, in 353;~
the above-referenced patents. Shoulders 36 are used to ensure tha-t outer sheath 20 is properly gripped by the electrode assembly to ensure that the outer sheath 20 is reliably attached. The entire electrode assembly 38 is fabricated from a single piece of commercially pure grade titanium.
A distal lumen 44 is used for the insertion of a round piece of insulating material. This material reduces the overall effective stimulating surface and thereby increases effective current density of the electrode. Transverse lumen 40 is used to attach -the non-conducting material which is inserted into distal lumen 44.
Layer 50 is a layer of reactive metal (e.g., titanium, niobium, etc.) which is sputtered over the distal tip of titanium electrode assembly 38. This layer is on the order of 1,000 to 10,000 A in thickness for the preferred titanium although thicknesses of as much as 50,000 A are readily achievable in relatively short sputtering cycles. This layer of sputtered titanium (or other reactive metal) coats surface 42 of titanium electrode assembly 38. The sputtered layer 50 adheres to sur-face 42 of titanium electrode assembly 38, because a material ischosen which exhibits high chemical reactivity. In the preferred mode, this coincidentally produces a titanium/titanium interface at surface 42. However, sputtered layer 50 may be niobium or other highly reactive metal.
A layer of precious metal 60 is next sputtered over the sputtered titanium layer 50. The thickness of layer 60 may be as much as 50,000 A although a thickness of 1,000 A to 10,000 A
~ ~853;~7 is preferred. Because layer 60 is sputtered over layer 50, and layer 50 has been activated by the previous sputtering operation, excellent adhesion is established between precious metal layer 60 and reactive metal layer 50. Layer 60 may be selected from the yroup comprising platinum, rhodium, iridium, or alloys thereof.
Of course, Figure 2 shows layers 50 and 60 much larger than scale. However, they are shown in this manner for -the purpose of visualizing the present invention.
The sputtering process is accomplished using a Perkin-Elmer Model 2400 Sputtering System. This device has thecapability for both AC and Magnetron modes. Experience has shown that the Magnetron mode produces a higher sputtering rate, being on the order of 10,000 to 100,000 A per hour because of the magnetic field present. However, the AC mode which has a slower sputtering rate is preferred because it produces much more uniform target ware~
Although the controlling of pressure within the sput-tering chamber controls porosity and therefore, the presence of pinholes, the resulting produc-t will almost always contain some significant number of pinholes. It is therefore very important to use a material for electrode housing 38, which is of itself a body compatible cathode material such as titanium.
Attempts were made to fabricate similar electrocles using vacuum deposition techniques. Because the target in the vacuum deposition process is not self-cleaning as it is in the sputtering process, results obtained were not nearly as satisfy-ing. The vacuum deposition electrodes showed less adhesion because the target was not self-cleaning and because -the technique S3~
inherently provides less control over the porosity of -the surface.
The present invention as -taught herein is readily applied in the preferred mode to endocardial pacing electrodes.
Those of ordinary skill in the art will be readily able to apply the teachings herein to body implantable leads of other configur-ations and applica-tions.
Claims (10)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In a body implantable lead having a connector at a proximal end, and insulating sheath between said proximal end and a distal end, an electrode located near said distal end and having an exposed electrode surface for contacting body tissue, and a conductor extending from said connector to said electrode, within said insulating sheath, the improvement to said electrode comprising:
an electrode assembly fabricated of a first material;
a second material from the group consisting of platinum, iridium, rhodium, and alloys thereof, covering said exposed surface of said first material; and a layer of reactive metal comprising titanium intermediate said first material and said second material.
an electrode assembly fabricated of a first material;
a second material from the group consisting of platinum, iridium, rhodium, and alloys thereof, covering said exposed surface of said first material; and a layer of reactive metal comprising titanium intermediate said first material and said second material.
2. An improvement according to claim 1 wherein said layer of reactive metal is sputtered over said first material of said electrode assembly and wherein said second material is sputtered over said layer of reactive metal.
3. An improvement according to claim 1 or claim 2 wherein said first material is titanium.
4. In a body implantable lead having a proximal end, a distal end, a connector at said proximal end, an insulating sheath between said proximal end and said distal end, a conductor extending from said connector within said insulating sheath, and an electrode having an exposed surface for contacting body tissue located near said distal end and coupled to said conductor, the improvement to said electrode comprising:
an electrode assembly of a first material, and a second material from the group consisting of iridium, rhodium and alloys thereof covering said exposed surface of said first material.
an electrode assembly of a first material, and a second material from the group consisting of iridium, rhodium and alloys thereof covering said exposed surface of said first material.
5. An improvement according to claim 3 or claim 4 wherein said second material has a thickness no greater than 50,000 .ANG..
6. An improvement according to claim 3 or claim 4 wherein said second material has a thickness of approximately 1000 .ANG. to 10,000 .ANG..
7. An improvement according to claim 4 further comprising a layer of reactive metal intermediate said first material and said second material.
8. An improvement according to claim 2 or claim 7 wherein said layer of reactive metal is 1000 .ANG. to 10,000 .ANG. in thickness.
9. An improvement according to claim 7 wherein said layer of reactive metal is titanium.
10. An improvement according to claim 7 wherein said reactive layer is sputtered over said electrode assembly and wherein said second material is sputtered over said reactive layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26053281A | 1981-05-04 | 1981-05-04 | |
| US260,532 | 1981-05-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1185327A true CA1185327A (en) | 1985-04-09 |
Family
ID=22989547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000402157A Expired CA1185327A (en) | 1981-05-04 | 1982-05-03 | Biomedical electrodes sputter metallized with platinum group |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0064289B2 (en) |
| JP (1) | JPS57193852U (en) |
| AU (1) | AU552129B2 (en) |
| CA (1) | CA1185327A (en) |
| DE (1) | DE3270065D1 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4408604A (en) * | 1981-04-06 | 1983-10-11 | Teletronics Pty, Limited | Porous pacemaker electrode tip |
| DE3134896C2 (en) * | 1981-09-03 | 1985-03-28 | W.C. Heraeus Gmbh, 6450 Hanau | Cable feed for pacemaker electrodes |
| EP0120893A4 (en) * | 1982-10-01 | 1985-06-06 | Keith William Jeffcoat | Electric healing device. |
| DE3300668A1 (en) * | 1983-01-11 | 1984-07-12 | Siemens AG, 1000 Berlin und 8000 München | ELECTRODE FOR MEDICAL APPLICATIONS |
| US4502492A (en) * | 1983-04-28 | 1985-03-05 | Medtronic, Inc. | Low-polarization low-threshold electrode |
| DE3345990A1 (en) * | 1983-12-20 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING AN IMPLANTABLE ELECTRODE |
| FR2616072B1 (en) * | 1987-06-04 | 1990-12-14 | Ela Medical Sa | IMPROVEMENTS AT THE CONDUCTIVE END OF CARDIAC STIMULATION PROBES |
| US5074313A (en) * | 1989-03-20 | 1991-12-24 | Cardiac Pacemakers, Inc. | Porous electrode with enhanced reactive surface |
| DE4231600B4 (en) * | 1992-09-17 | 2004-08-12 | Biotronik Meß- und Therapiegeräte GmbH & Co. Ingenieurbüro Berlin | Implantable defibrillation system |
| US5411544A (en) * | 1993-11-02 | 1995-05-02 | Ventritex, Inc. | Defibrillation lead with improved mechanical and electrical characteristics |
| US7690953B2 (en) * | 2007-05-03 | 2010-04-06 | Deringer-Ney, Inc. | Stackable electrical connection apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3749101A (en) * | 1972-02-09 | 1973-07-31 | Cordis Corp | Nonpolarizable muscle stimulating electrode |
| US3813258A (en) * | 1972-04-27 | 1974-05-28 | Ver Flugtechnische Werke | Method for evaporating silver on titanium and its alloys |
| IT1128813B (en) * | 1980-06-19 | 1986-06-04 | Sorin Biomedica Spa | ELECTRODE FOR HEART STIMULATORS AND PROCEDURE FOR ITS MANUFACTURE |
| EP0054781B1 (en) * | 1980-12-23 | 1984-10-10 | Kontron Ag | Implantable electrode |
-
1982
- 1982-05-01 JP JP6400982U patent/JPS57193852U/ja active Pending
- 1982-05-03 CA CA000402157A patent/CA1185327A/en not_active Expired
- 1982-05-03 EP EP19820103777 patent/EP0064289B2/en not_active Expired
- 1982-05-03 DE DE8282103777T patent/DE3270065D1/en not_active Expired
- 1982-05-04 AU AU83244/82A patent/AU552129B2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57193852U (en) | 1982-12-08 |
| AU552129B2 (en) | 1986-05-22 |
| DE3270065D1 (en) | 1986-04-30 |
| EP0064289B1 (en) | 1986-03-26 |
| EP0064289A2 (en) | 1982-11-10 |
| AU8324482A (en) | 1982-11-11 |
| EP0064289B2 (en) | 1990-05-02 |
| EP0064289A3 (en) | 1983-05-18 |
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