CA1121479A - Dip carrier and socket - Google Patents
Dip carrier and socketInfo
- Publication number
- CA1121479A CA1121479A CA000343013A CA343013A CA1121479A CA 1121479 A CA1121479 A CA 1121479A CA 000343013 A CA000343013 A CA 000343013A CA 343013 A CA343013 A CA 343013A CA 1121479 A CA1121479 A CA 1121479A
- Authority
- CA
- Canada
- Prior art keywords
- carrier
- dip
- socket
- receiving cavity
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
Abstract
ABSTRACT OF THE DISCLOSURE
A DIP carrier and socket including a generally rectangular socket and mating DIP carrier in which the socket component includes a plurality of contacts disposed along two sides thereof with the terminal portion of each contact extending through the bottom of the socket and the contact portion extending through the side wall and into a carrier-receiving inner receptacle formed in the top of the body. Each end of the socket is provided with keyways. The external perimeter of the carrier body is configured to be matingly received within the socket receptacle and is adapted to receive a DIP in inverted disposition in the bottom thereof. The carrier includes vertical slots formed in each side for receiving the DIP legs in recessed disposition, and a longitudinal extending beam which forms a detent for locking the carrier within the socket. The ends of the carrier are keyed to match the socket keyways and a pull tab is formed on the upper side of the carrier body for facil-itating insertion and removal of the carrier into and out of the socket. When the carrier is inserted into the socket, the socket contacts locate in the side slots of the carrier and engage the DIP legs.
A DIP carrier and socket including a generally rectangular socket and mating DIP carrier in which the socket component includes a plurality of contacts disposed along two sides thereof with the terminal portion of each contact extending through the bottom of the socket and the contact portion extending through the side wall and into a carrier-receiving inner receptacle formed in the top of the body. Each end of the socket is provided with keyways. The external perimeter of the carrier body is configured to be matingly received within the socket receptacle and is adapted to receive a DIP in inverted disposition in the bottom thereof. The carrier includes vertical slots formed in each side for receiving the DIP legs in recessed disposition, and a longitudinal extending beam which forms a detent for locking the carrier within the socket. The ends of the carrier are keyed to match the socket keyways and a pull tab is formed on the upper side of the carrier body for facil-itating insertion and removal of the carrier into and out of the socket. When the carrier is inserted into the socket, the socket contacts locate in the side slots of the carrier and engage the DIP legs.
Description
7~
l ~ .
41 BACKGROUND OF THE :[NVENTION
I
6 ~ Field of the Invention 7 I The present invention relates generally to integrated 81 circuit component connector apparatus and more particularly to 9 ¦ an improved carrier and socket device for facilitating the 10 ¦ connection and disconnection of DIP packaged integrated circuits 11¦ in electronic apparatus.
12 ¦ Description of the Prior Art 13 ¦ Heretofore, integrated circuit components packaged in 14 ¦ dual in-line packages (DIPs~ have been either soldered directly 15 ¦ to a printed circuit board or have been mounted on a multi-pronged 16 ¦ carrier which is in turn plugged into a fixture on a circuit 17 board. Although such connection is suitable for certain 18 applications, it is not suitable for those applications in which 19 ¦ static discharge presents a problem relativè to the integrity of 20 ¦ the packaged integrated circuit. For example/ in circuits such 21 ¦ as ROM devices, static charge transferred from the fingers of 22 ¦ one picking up the device to the conductive legs thereof is 23 ¦ capable of aestroying either the device or the data stored therei , 24 ¦ or perhaps even both.
25 ¦ Whereas a DIP permanently soldered to a circuit board 26 ¦ is not normally susceptable to static discharge problems, it is 27 not readily removable from the board for testing or replacement.
28 On the other hand, whereas a DIP mounted to a standard plugable 29 carrier is readily removable from the supporting circuit board, it is not free from static discharge problems because the plugabl 31 prongs to which it is connected are exposed to the touch of 32 one holding the carrier.
l ~ .
41 BACKGROUND OF THE :[NVENTION
I
6 ~ Field of the Invention 7 I The present invention relates generally to integrated 81 circuit component connector apparatus and more particularly to 9 ¦ an improved carrier and socket device for facilitating the 10 ¦ connection and disconnection of DIP packaged integrated circuits 11¦ in electronic apparatus.
12 ¦ Description of the Prior Art 13 ¦ Heretofore, integrated circuit components packaged in 14 ¦ dual in-line packages (DIPs~ have been either soldered directly 15 ¦ to a printed circuit board or have been mounted on a multi-pronged 16 ¦ carrier which is in turn plugged into a fixture on a circuit 17 board. Although such connection is suitable for certain 18 applications, it is not suitable for those applications in which 19 ¦ static discharge presents a problem relativè to the integrity of 20 ¦ the packaged integrated circuit. For example/ in circuits such 21 ¦ as ROM devices, static charge transferred from the fingers of 22 ¦ one picking up the device to the conductive legs thereof is 23 ¦ capable of aestroying either the device or the data stored therei , 24 ¦ or perhaps even both.
25 ¦ Whereas a DIP permanently soldered to a circuit board 26 ¦ is not normally susceptable to static discharge problems, it is 27 not readily removable from the board for testing or replacement.
28 On the other hand, whereas a DIP mounted to a standard plugable 29 carrier is readily removable from the supporting circuit board, it is not free from static discharge problems because the plugabl 31 prongs to which it is connected are exposed to the touch of 32 one holding the carrier.
-2-7~
SU~ARY OF THE INVENTION
It is -therefore a principal object of the present invention to provide a novel socket and removable DIP carrier which protects the DIP from static discharge during handling.
Another object of the present invention is to provide a socket for attachment to a circuit board and a mating DIP
carrier which is adapted to be readily insertable and removable from the socket.
sriefly~ a preferred embodiment of the present invention includes a generally rectangular socket and mating DIP carrier in which the socket component includes a plurality of contacts disposed along two sides thereof with the terminal portion of each contact extending through the bottom of the socket and the contact portion extending through the side wall and into a carrier-receiving inner receptacle formed in the top of the body.
Each end of the socket is provided with keyways. The external perimeter of the carrier body is configured to be matingly received within the socket receptacle and is adapted to receive a DIP in inverted disposition in the bottom thereof. The carrier includes vertical slots formed in each side for receiving the DIP legs in recessed disposition, and a longitudinally extending beam which forms a detent for locking the carrier within the socket. The ends of the carrier are keyed to match the socket keyways and a pull tab is formed on the upper side of the carrier body for facilitating insertion and removal of the carrier into and out of the socket. When the carrier is inserted into the socket, the socket contacts are received within the side slots of the carrier and engage the DIP legs.
In accordance with~the present invention there is pro-vided apparatus for removably connect;ng a dual in-line packaged ~ 3 -7~
integrated circuit (DIP) to a circuit boarcl comprising: (a) a socket member _omprised of (i) a first body having a carrier-receiving cavity formed therein, said first hody constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier-receiving cavi-ty, each of said contact members having a pronged portion projecting outwardly from said first body for attacnment to the circuit board, and a resilient portion extending into said carrier-receiving cavity; and (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removably mating reception within said carrier cavity, with a DIP
receiving cavity formed in the undersurface of said carrier member, said DIP receiving cavity adapted to therein receive the chip portion of the DIP with the conductive legs of the DIP locating along said side portions of said carrier member, so that when said carrier member is inserted into said socket member, the chip portion of the DIP is held therebetween, with the DIP in an inverted position, i.e., with the conductive legs 2Q of the DIP pointing away from the circuit board.
In accordance with the present invention there is also provided a dual in-line packaged integrated circuit (DIP) for removable attachment to a circuit board, comprising: (a) a socket member comprised of (i) a first body having a carrier receiving cavity formed therein, said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier receiving cavity, each of said contact members having a pronged portion projectin~ outwardly from said first body for 3Q attachment to the circuit board, and a resilient portion : ~ 3a -extending into said carrier receiving cavity; (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removable mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member; and (c) a DIP comprised of a chip portion and conductive legs extending from said chip, said chip mounted in said DIP receiving cavity, with said conductive legs of the DIP located along said side portions of said carrier member, so that when said carrier member is mounted in said carrier receiving cavit~ of said socket member, said chip portion of said DIP is enclosed between said socket member and carrier member with said DIP in an in-verted position, namely, with said conductive legs of said DIP
pointing away from the circuit board.
Among the many advantages of the present invention are that it provides a means for making a DIP readily interchangeable - 3b -l,~
!
I in a functional circuit.
21 Another advantage of the present inven-tion is tha-t it 31 enables a DIP to be readily removed for tes-ting or substitution.
4¦ Still another advantage of the present invention is that 51 the carrier protects the DIP leads from contact with the fingers 61 of a holder and therefore isolates the contained integrated 71 circuit from static charge.
81 These and other objects and advantages of the present 91 invention will no doubt become apparent to those skilled ln 10 ¦ the art after having read the following detailed description of 11¦ a preferred embodiment which is illustrated in the several 12 ¦ figures of the drawing.
13 I .
14 ¦ IN THE DRA~ING
15 ¦ Fig. l is an exploded perspective view showing a socket 16 ¦ and DIP carrier in accordance with the present invention;
17 Fig. 2 is a side elevation of a DIP carrier broken 18 ¦ along the line 2-2 shown in Fig. l;
19 ¦ Fig. 3 is a cross-sectional view of the DIP carrier 20 ¦ taken along the lines 3-3 of Figs. l and 2;
21 ¦ Fig. 4 is a side elevational view of the socket broken 22 ¦ away along the line 4-4 as shown in Fig. l;
23 ¦ Fig. 5 is a cross-sectional view of the socket taken 24 ¦ along the lines 5-5 of Figs. l and 4; and Fig. 6 is a broken segment of a bottom plan view of the 26 socket shown in Figs. 1, 4 and 5.
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32 .
I DETAILED DESCRIPTION OF TH~ PREFERRED EM~ODIMENT
2 I Referrin~ now to Fig. 1 of the drawing, there is shown
SU~ARY OF THE INVENTION
It is -therefore a principal object of the present invention to provide a novel socket and removable DIP carrier which protects the DIP from static discharge during handling.
Another object of the present invention is to provide a socket for attachment to a circuit board and a mating DIP
carrier which is adapted to be readily insertable and removable from the socket.
sriefly~ a preferred embodiment of the present invention includes a generally rectangular socket and mating DIP carrier in which the socket component includes a plurality of contacts disposed along two sides thereof with the terminal portion of each contact extending through the bottom of the socket and the contact portion extending through the side wall and into a carrier-receiving inner receptacle formed in the top of the body.
Each end of the socket is provided with keyways. The external perimeter of the carrier body is configured to be matingly received within the socket receptacle and is adapted to receive a DIP in inverted disposition in the bottom thereof. The carrier includes vertical slots formed in each side for receiving the DIP legs in recessed disposition, and a longitudinally extending beam which forms a detent for locking the carrier within the socket. The ends of the carrier are keyed to match the socket keyways and a pull tab is formed on the upper side of the carrier body for facilitating insertion and removal of the carrier into and out of the socket. When the carrier is inserted into the socket, the socket contacts are received within the side slots of the carrier and engage the DIP legs.
In accordance with~the present invention there is pro-vided apparatus for removably connect;ng a dual in-line packaged ~ 3 -7~
integrated circuit (DIP) to a circuit boarcl comprising: (a) a socket member _omprised of (i) a first body having a carrier-receiving cavity formed therein, said first hody constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier-receiving cavi-ty, each of said contact members having a pronged portion projecting outwardly from said first body for attacnment to the circuit board, and a resilient portion extending into said carrier-receiving cavity; and (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removably mating reception within said carrier cavity, with a DIP
receiving cavity formed in the undersurface of said carrier member, said DIP receiving cavity adapted to therein receive the chip portion of the DIP with the conductive legs of the DIP locating along said side portions of said carrier member, so that when said carrier member is inserted into said socket member, the chip portion of the DIP is held therebetween, with the DIP in an inverted position, i.e., with the conductive legs 2Q of the DIP pointing away from the circuit board.
In accordance with the present invention there is also provided a dual in-line packaged integrated circuit (DIP) for removable attachment to a circuit board, comprising: (a) a socket member comprised of (i) a first body having a carrier receiving cavity formed therein, said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier receiving cavity, each of said contact members having a pronged portion projectin~ outwardly from said first body for 3Q attachment to the circuit board, and a resilient portion : ~ 3a -extending into said carrier receiving cavity; (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removable mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member; and (c) a DIP comprised of a chip portion and conductive legs extending from said chip, said chip mounted in said DIP receiving cavity, with said conductive legs of the DIP located along said side portions of said carrier member, so that when said carrier member is mounted in said carrier receiving cavit~ of said socket member, said chip portion of said DIP is enclosed between said socket member and carrier member with said DIP in an in-verted position, namely, with said conductive legs of said DIP
pointing away from the circuit board.
Among the many advantages of the present invention are that it provides a means for making a DIP readily interchangeable - 3b -l,~
!
I in a functional circuit.
21 Another advantage of the present inven-tion is tha-t it 31 enables a DIP to be readily removed for tes-ting or substitution.
4¦ Still another advantage of the present invention is that 51 the carrier protects the DIP leads from contact with the fingers 61 of a holder and therefore isolates the contained integrated 71 circuit from static charge.
81 These and other objects and advantages of the present 91 invention will no doubt become apparent to those skilled ln 10 ¦ the art after having read the following detailed description of 11¦ a preferred embodiment which is illustrated in the several 12 ¦ figures of the drawing.
13 I .
14 ¦ IN THE DRA~ING
15 ¦ Fig. l is an exploded perspective view showing a socket 16 ¦ and DIP carrier in accordance with the present invention;
17 Fig. 2 is a side elevation of a DIP carrier broken 18 ¦ along the line 2-2 shown in Fig. l;
19 ¦ Fig. 3 is a cross-sectional view of the DIP carrier 20 ¦ taken along the lines 3-3 of Figs. l and 2;
21 ¦ Fig. 4 is a side elevational view of the socket broken 22 ¦ away along the line 4-4 as shown in Fig. l;
23 ¦ Fig. 5 is a cross-sectional view of the socket taken 24 ¦ along the lines 5-5 of Figs. l and 4; and Fig. 6 is a broken segment of a bottom plan view of the 26 socket shown in Figs. 1, 4 and 5.
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32 .
I DETAILED DESCRIPTION OF TH~ PREFERRED EM~ODIMENT
2 I Referrin~ now to Fig. 1 of the drawing, there is shown
3 a socket 10 and a mating DIP carrier 12 with the carrier 12
4 being positioned in exploded relationship above the mating recep-tacle 14 formed in the top of socket 10. For purposes of 6 illustration, socket 10 is shown disposed above a printed circuit 7 board 16 onto which it is to be mounted.
8 I Referring now additionally to Figs. 4 and 5, it will be 9 noted that socket 10 is generally rectangular in configuration 10¦ with the exception that the end wall 18 has an offset 20 for 11 accommodating a pair of keyways 22 and 24. At the opposite~
12¦ end of socket 10, a pair of laterally-extending keyways 26, one 13 of which is not shown, are also provided. The side walls 28 14¦ and 30 are provided with exterior slots 32 and intersecting 15¦ interior slots 34 which receive contact members 36 as shown in 16¦ Fig. 5. As indicated in the broken segment of a bottom plan 17¦ view sho~.~n in Fig. 6, the contact receiving slots 34 are T-shaped 18 ¦ in cross-sectional configuration. Contact members 36 are of 19¦ conventional configuration and includes tapered lower extremities 20¦ for engaging PC board apertures 17, a widened upper section, 21 ¦ illustrated by the dashed lines 38 in Fig. 4, and a cantilevered 22 ¦ spring contact arm 40 which after insertion into the slot 23 ¦ extends into the cavity 14. The widened portion 38 includes 24 a resilient lock tab 42 which springs into the slot 32 as a 25 ¦ member 36 is pushed into slot 34 from the bottom and serves 26 ¦ to lock the member 36 in place.
27 ¦ The bottom surface of socket 10 is flat except for the 28 ¦ integrally formed transverse ribs 33 which extend thereacross to 29 ¦ strengthen the socket struc-ture. In addition, the ribs 33 serve 33ol as standoffs for raising the main body of the socket above the _5_ 2~
I ¦ board surface to which the device is mounted. The inside surface 2 ¦ of the socket bottom is plain except for an arrowhead 35 which 3 ¦ is molded therein as an alignment reminder. An identical 4 I arrowhead 35A is molded into the carrier 12.
Carrier 12 is also generally rectangular in external 6 configuration except that at one end it is provided with protrudir g 7 key projections 50 and 52 which are adapted to mate with the 8 keyways 22 and 24, respectively, of socket lO, and at the other 9 end it is provided with laterally extending key projections 54 and 56 which mate with the keyways 26 at the corresponding end 11 of socket lO. As illustrated in Figs. 2 and 3, the bottom of 12 carrier 12 is provided with a rectangular cavity 57 defined by 13 the interior side walls 58, end walls 60 and the bottom surface 14 62 of a web 64 that extends along the length of the carrier.
The purpose of the cavity is to provide a chamber for receiving 16 the body of a DIP 66 as shown by the dashed lines in Figs. 2 17 and 3.
18 The sides of the carrier 12 are configured to include 19 a detent beam 68 which extends along the length of each side wall, and a plurality of upstanding posts or ribs 70. The 21 ribs 70 are narrow and shallow from beam 68 to the junction of 22 web 64 so as to prov-de wide openings 74 (Fig. 2) for receiving 23 the knee portion of the DIP legs 76, but are wider and deeper 24 above web 64 so as to provide narrow slots 72 for receiving the tips of the DIP legs as indicated at 78 (~igs. 2 and 3).
26 As indicated in Fig. 3, the junction of web 64 with the 27 ribs 70 is made with an upward flare so that the edge portion 28 provides a camming sur~ace 80 for guiding the DIP legs into the 29 slots 72 as the DIP body is inserted into the chamber 57. The upper extremity of the flared portion 82 also provides a shoulder ' ~1 l ver which the ex~remity 73 of the DIP legs ma~ be ~ormed to 2 both secure the DIP in the carrier and cause a flat side contact 31 sur~ace to be presented within the slots 72 and 74.
4¦ Formed in the central portion of web 64 is a pull tab 83 51 having flanges 84 on either end to ~rovide a gripping surface 6 ¦ with which the carrier may be held between the thumb and index 71 finger of a use. In order to provide additional clearance for 81 the thumb and index finger, apertures 86 are provided in the 91 web 64 on each side of the pull tab 83. The center of pull 10¦ tab 83 is recessed both top and bottom to provide a thin web 88 11¦ having a rectangular aperture 90 formed therein. The aperture 90 12 provides entry way for an auxiliary lifting tool (not shown).
13 In order to use such tool, which might, for example, have an 14 ¦ inverted T-shaped lower extremity, the T-shaped portion would be inserted through slot ~0 and the tool rotated so as to engage 16¦ the lower surfaces 92 of web 88 and thereby allow carrier 12 17¦ to be lifted out of engagement with socket 10.
18 Note by comparing Fig. 2 to Fig. 4 that the slots 72 19 ¦ and 74 of carrier 12 are aligned with the contacts 36 in socket 20 ¦ 10, and by comparing Fig. 3 to Fig. 5 that thé contact arms 40 21 ¦ extend into the path taken by carrier 12 as it mates with 22 ¦ socket 10. This, of course, means that as the carrier is insertel 1 23 into the cavity 14 the arms 40 will cam over the beams 68 and 24 ¦ spring into slots 74 to engage the DIP legs 76. In Fig. 5, a 25 ¦ partially broken carrier 12 is shown in phantom lines in mating 26 ¦ relationship with socket 10 so as to illustrate the manner in 27 ¦ which the contacts 40 engage the legs of the DIP 66.
28 The beam 68 also provides a detent that cooperates with 29 ¦ contact arms 40 to maintain the carrier locked in engagement 30 ¦ with the socket.
I In accordance with the present invention, the spring 21 force of contact arms 40 is sel~cted so that a~proximately three 3 pounds of withdrawal force must be applied to tab 83 before the 41 carrier will separate from the socket. This also insures that adequate contact engaging force is applied between arms 40 and 61 DIP legs 76.
¦ In the preferred embodiment the carrier 12 is molded 81 f a glass and carbon-filled polymeric thermo-plastic or thermo-s~ t 91 material such as nylon or polypropylene material having approxi-10¦ mately 105 ohms/sq of surface resistivity. By using such materia 11 static charge will be dissipated by the material without damaging 12 the integrated circuit contained in the DIP but will provide 13¦ adequate insulation betwe-en the DIP legs. The carrier 12 is 14¦ a monolithically molded unit. and with the exception of the conta It 15¦ pins 40, so is the socket 10. The only manufacturing step 16 ¦ required in completing socket 10 after it is molded is to insert 17¦ the contact pins 40 into the openings 34 provided in the bottom 18¦ sur~ace.
19 ¦ In use, the socket 10 is mounted to a printed circuit 20 ¦ ~oard 16 or the like by inserting the contact pins 36 into 21 ¦ openings 17 as illustrated in Fig. 1 and appropriately soldering 22 ¦ the pins to leads formed on the lower side of the board. Socket 23 ¦ 10 will rest directly upon the surface of the board but will be 24 ¦ slightly separated therefrom by the ribs 33. It will be appreciat e~
25 ¦ that once the pins 36 are securel~soldered to the underside of the 26 ¦ board 16, socket 10 will be rigidly secured thereto.
27 ¦ Insofar as the carrier is concerned, any desired type of 28 integrated circuit (e.g., computer chip, ROM, RAM or otherwise) 29 ¦ which is packaged in a standard DIP package may be inserted into 3 ¦ the carrier by simply inserting the DIP "legs up" into the cavity I ////
I of the ~ottom of the carrier. As the legs 76 enyage surface 80, 2~ they will be guided into slots 72 as the base of the DIP bottoms 31 out against the underside of web 64 The legs are then deformed 41 around the shoulder 82 and the mounling is complete, and the devi e 51 is ready to be plugged into a socket.
61 It is important -to note that since the width of the 71 slots 74 is small (typically about .070 inches) and the DIP legs 81 are recessed within the slots, one holding the carrier in his 91 hand will not touch the DIP legs even if he should improperly 10 1 grip the carrier. And even if he were to squeeze the carrier 11 hard enough to cause his skin to touch the DIP legs, any differenc e 12 ~ in static charge between that of his body and the carrier will 13 ¦ have already been dissipated by the semiconductive carrier niateric 1.
14 ¦ Use of the present invention makes it possible to easily 15 ¦ change the electronic functional or storage capability of any 16 ¦ modern electronic device. Furthermore, it makes the removal for 17 testing of a particular circuit component quite simple. And 18 ¦ since the volume of space required to accommodate the socket and 19 1 carrier is only slightly larger than that required by the DIP
20 ¦ itself, the device has nearly universal application.
21 I Although the present invention has been described above 22 ¦ in terms of presently preferred embodiments, it is to be understo( )d 23 ¦ that such disclosure is by way of example only and is not intende 24 ¦ to be considered as limiting. Accordingly, it is intended that 2~ the appended claims are to be interpreted as covering all 26 alterations and modifications as fall within the true spirit 27 and scope of the invention.
28 ~ What is claimed is:
8 I Referring now additionally to Figs. 4 and 5, it will be 9 noted that socket 10 is generally rectangular in configuration 10¦ with the exception that the end wall 18 has an offset 20 for 11 accommodating a pair of keyways 22 and 24. At the opposite~
12¦ end of socket 10, a pair of laterally-extending keyways 26, one 13 of which is not shown, are also provided. The side walls 28 14¦ and 30 are provided with exterior slots 32 and intersecting 15¦ interior slots 34 which receive contact members 36 as shown in 16¦ Fig. 5. As indicated in the broken segment of a bottom plan 17¦ view sho~.~n in Fig. 6, the contact receiving slots 34 are T-shaped 18 ¦ in cross-sectional configuration. Contact members 36 are of 19¦ conventional configuration and includes tapered lower extremities 20¦ for engaging PC board apertures 17, a widened upper section, 21 ¦ illustrated by the dashed lines 38 in Fig. 4, and a cantilevered 22 ¦ spring contact arm 40 which after insertion into the slot 23 ¦ extends into the cavity 14. The widened portion 38 includes 24 a resilient lock tab 42 which springs into the slot 32 as a 25 ¦ member 36 is pushed into slot 34 from the bottom and serves 26 ¦ to lock the member 36 in place.
27 ¦ The bottom surface of socket 10 is flat except for the 28 ¦ integrally formed transverse ribs 33 which extend thereacross to 29 ¦ strengthen the socket struc-ture. In addition, the ribs 33 serve 33ol as standoffs for raising the main body of the socket above the _5_ 2~
I ¦ board surface to which the device is mounted. The inside surface 2 ¦ of the socket bottom is plain except for an arrowhead 35 which 3 ¦ is molded therein as an alignment reminder. An identical 4 I arrowhead 35A is molded into the carrier 12.
Carrier 12 is also generally rectangular in external 6 configuration except that at one end it is provided with protrudir g 7 key projections 50 and 52 which are adapted to mate with the 8 keyways 22 and 24, respectively, of socket lO, and at the other 9 end it is provided with laterally extending key projections 54 and 56 which mate with the keyways 26 at the corresponding end 11 of socket lO. As illustrated in Figs. 2 and 3, the bottom of 12 carrier 12 is provided with a rectangular cavity 57 defined by 13 the interior side walls 58, end walls 60 and the bottom surface 14 62 of a web 64 that extends along the length of the carrier.
The purpose of the cavity is to provide a chamber for receiving 16 the body of a DIP 66 as shown by the dashed lines in Figs. 2 17 and 3.
18 The sides of the carrier 12 are configured to include 19 a detent beam 68 which extends along the length of each side wall, and a plurality of upstanding posts or ribs 70. The 21 ribs 70 are narrow and shallow from beam 68 to the junction of 22 web 64 so as to prov-de wide openings 74 (Fig. 2) for receiving 23 the knee portion of the DIP legs 76, but are wider and deeper 24 above web 64 so as to provide narrow slots 72 for receiving the tips of the DIP legs as indicated at 78 (~igs. 2 and 3).
26 As indicated in Fig. 3, the junction of web 64 with the 27 ribs 70 is made with an upward flare so that the edge portion 28 provides a camming sur~ace 80 for guiding the DIP legs into the 29 slots 72 as the DIP body is inserted into the chamber 57. The upper extremity of the flared portion 82 also provides a shoulder ' ~1 l ver which the ex~remity 73 of the DIP legs ma~ be ~ormed to 2 both secure the DIP in the carrier and cause a flat side contact 31 sur~ace to be presented within the slots 72 and 74.
4¦ Formed in the central portion of web 64 is a pull tab 83 51 having flanges 84 on either end to ~rovide a gripping surface 6 ¦ with which the carrier may be held between the thumb and index 71 finger of a use. In order to provide additional clearance for 81 the thumb and index finger, apertures 86 are provided in the 91 web 64 on each side of the pull tab 83. The center of pull 10¦ tab 83 is recessed both top and bottom to provide a thin web 88 11¦ having a rectangular aperture 90 formed therein. The aperture 90 12 provides entry way for an auxiliary lifting tool (not shown).
13 In order to use such tool, which might, for example, have an 14 ¦ inverted T-shaped lower extremity, the T-shaped portion would be inserted through slot ~0 and the tool rotated so as to engage 16¦ the lower surfaces 92 of web 88 and thereby allow carrier 12 17¦ to be lifted out of engagement with socket 10.
18 Note by comparing Fig. 2 to Fig. 4 that the slots 72 19 ¦ and 74 of carrier 12 are aligned with the contacts 36 in socket 20 ¦ 10, and by comparing Fig. 3 to Fig. 5 that thé contact arms 40 21 ¦ extend into the path taken by carrier 12 as it mates with 22 ¦ socket 10. This, of course, means that as the carrier is insertel 1 23 into the cavity 14 the arms 40 will cam over the beams 68 and 24 ¦ spring into slots 74 to engage the DIP legs 76. In Fig. 5, a 25 ¦ partially broken carrier 12 is shown in phantom lines in mating 26 ¦ relationship with socket 10 so as to illustrate the manner in 27 ¦ which the contacts 40 engage the legs of the DIP 66.
28 The beam 68 also provides a detent that cooperates with 29 ¦ contact arms 40 to maintain the carrier locked in engagement 30 ¦ with the socket.
I In accordance with the present invention, the spring 21 force of contact arms 40 is sel~cted so that a~proximately three 3 pounds of withdrawal force must be applied to tab 83 before the 41 carrier will separate from the socket. This also insures that adequate contact engaging force is applied between arms 40 and 61 DIP legs 76.
¦ In the preferred embodiment the carrier 12 is molded 81 f a glass and carbon-filled polymeric thermo-plastic or thermo-s~ t 91 material such as nylon or polypropylene material having approxi-10¦ mately 105 ohms/sq of surface resistivity. By using such materia 11 static charge will be dissipated by the material without damaging 12 the integrated circuit contained in the DIP but will provide 13¦ adequate insulation betwe-en the DIP legs. The carrier 12 is 14¦ a monolithically molded unit. and with the exception of the conta It 15¦ pins 40, so is the socket 10. The only manufacturing step 16 ¦ required in completing socket 10 after it is molded is to insert 17¦ the contact pins 40 into the openings 34 provided in the bottom 18¦ sur~ace.
19 ¦ In use, the socket 10 is mounted to a printed circuit 20 ¦ ~oard 16 or the like by inserting the contact pins 36 into 21 ¦ openings 17 as illustrated in Fig. 1 and appropriately soldering 22 ¦ the pins to leads formed on the lower side of the board. Socket 23 ¦ 10 will rest directly upon the surface of the board but will be 24 ¦ slightly separated therefrom by the ribs 33. It will be appreciat e~
25 ¦ that once the pins 36 are securel~soldered to the underside of the 26 ¦ board 16, socket 10 will be rigidly secured thereto.
27 ¦ Insofar as the carrier is concerned, any desired type of 28 integrated circuit (e.g., computer chip, ROM, RAM or otherwise) 29 ¦ which is packaged in a standard DIP package may be inserted into 3 ¦ the carrier by simply inserting the DIP "legs up" into the cavity I ////
I of the ~ottom of the carrier. As the legs 76 enyage surface 80, 2~ they will be guided into slots 72 as the base of the DIP bottoms 31 out against the underside of web 64 The legs are then deformed 41 around the shoulder 82 and the mounling is complete, and the devi e 51 is ready to be plugged into a socket.
61 It is important -to note that since the width of the 71 slots 74 is small (typically about .070 inches) and the DIP legs 81 are recessed within the slots, one holding the carrier in his 91 hand will not touch the DIP legs even if he should improperly 10 1 grip the carrier. And even if he were to squeeze the carrier 11 hard enough to cause his skin to touch the DIP legs, any differenc e 12 ~ in static charge between that of his body and the carrier will 13 ¦ have already been dissipated by the semiconductive carrier niateric 1.
14 ¦ Use of the present invention makes it possible to easily 15 ¦ change the electronic functional or storage capability of any 16 ¦ modern electronic device. Furthermore, it makes the removal for 17 testing of a particular circuit component quite simple. And 18 ¦ since the volume of space required to accommodate the socket and 19 1 carrier is only slightly larger than that required by the DIP
20 ¦ itself, the device has nearly universal application.
21 I Although the present invention has been described above 22 ¦ in terms of presently preferred embodiments, it is to be understo( )d 23 ¦ that such disclosure is by way of example only and is not intende 24 ¦ to be considered as limiting. Accordingly, it is intended that 2~ the appended claims are to be interpreted as covering all 26 alterations and modifications as fall within the true spirit 27 and scope of the invention.
28 ~ What is claimed is:
Claims (8)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. Apparatus for removably connecting a dual in-line packaged integrated circuit (DIP) to a circuit board comprising:
(a) a socket member comprised of (i) a first body having a carrier-receiving cavity formed therein said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier-receiving cavity, each of said contact members having a pronged portion projecting outwardly from said body for attachment to the cir-cuit board, and a resilient portion extending into said carrier-receiving cavity; and (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removably mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member, said DIP receiving cavity adapted to therein receive the chip portion of the DIP with the conductive legs of the DIP locating along said side portions of said carrier member, so that when said carrier member is inserted into said socket member, the chip portion of the DIP is held therebetween, with the DIP in an inverted position, i.e., with the conductive legs of the DIP pointing away from the circuit board.
(a) a socket member comprised of (i) a first body having a carrier-receiving cavity formed therein said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier-receiving cavity, each of said contact members having a pronged portion projecting outwardly from said body for attachment to the cir-cuit board, and a resilient portion extending into said carrier-receiving cavity; and (b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removably mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member, said DIP receiving cavity adapted to therein receive the chip portion of the DIP with the conductive legs of the DIP locating along said side portions of said carrier member, so that when said carrier member is inserted into said socket member, the chip portion of the DIP is held therebetween, with the DIP in an inverted position, i.e., with the conductive legs of the DIP pointing away from the circuit board.
2. Apparatus as recited in claim 1, wherein the DIP has conductive legs with relatively wider proximal knee portions and relatively narrower distal leg portions, and wherein said resilient portions of said electrically conductive contact mem-bers are positioned near the bottom of said carrier receiving cavity so as to engage only said wider proximal knee portions of said conductive DIP legs during insertion and removal of said carrier from said carrier receiving cavity.
3. Apparatus as recited in claim 1, wherein said carrier member has a recess formed between said side portions, and wherein said carrier member includes a handle portion projecting out of said recess whereby said carrier member may be grasped manually for insertion and removal of the carrier and DIP from the socket.
4. Apparatus as recited in claim 1, wherein said side portions are shorter than the conductive DIP legs, so that the ends of the DIP legs may be bent over the edges of said side portions to hold the DIP in said DIP receiving cavity.
5. A dual in-line packaged integrated circuit (DIP) for removable attachment to a circuit board, comprising:
(a) a socket member comprised of (i) a first body having a carrier receiving cavity formed therein, said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier receiving cavity, each of said contact members having a pronged portion projecting outwardly from said first body for attachment to the circuit board,, and a resilient portion extending into said carrier receiving cavity;
(b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removable mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member; and (c) a DIP comprised of a chip portion and conductive legs extending from said chip, said chip mounted in said DIP
receiving cavity, with said conductive legs of the DIP located along said side portions of said carrier member, so that when said carrier member is mounted in said carrier receiving cavity of said socket member, said chip portion of said DIP is enclosed between said socket member and carrier member with said DIP in an inverted position, namely, with said conductive legs of said DIP pointing away from the circuit board.
(a) a socket member comprised of (i) a first body having a carrier receiving cavity formed therein, said first body constructed of an insulating material, and (ii) a plurality of electrically conductive contact members disposed along opposite sides of said carrier receiving cavity, each of said contact members having a pronged portion projecting outwardly from said first body for attachment to the circuit board,, and a resilient portion extending into said carrier receiving cavity;
(b) a carrier member formed of an insulating material, having side portions and an external configuration dimensioned for removable mating reception within said carrier cavity, with a DIP receiving cavity formed in the undersurface of said carrier member; and (c) a DIP comprised of a chip portion and conductive legs extending from said chip, said chip mounted in said DIP
receiving cavity, with said conductive legs of the DIP located along said side portions of said carrier member, so that when said carrier member is mounted in said carrier receiving cavity of said socket member, said chip portion of said DIP is enclosed between said socket member and carrier member with said DIP in an inverted position, namely, with said conductive legs of said DIP pointing away from the circuit board.
6. Apparatus as recited in claim 5, wherein said DIP is secured in said DIP receiving cavity by bending the legs of said conductive DIP legs inwardly over said side portions.
7. Apparatus as recited in claim 5, wherein said conductive legs of said DIP have relatively wider proximal knee portions and relatively narrower distal leg portions, and wherein said resilient portions of said electrically conductive contact mem-bers are positioned near the bottom of said carrier receiving cavity, so as to engage only said wider proximal knee portions of said conductive DIP legs during insertion and removal of said carrier from said carrier receiving cavity.
8. Apparatus as recited in claim 5, wherein the upper surface of said carrier member has a recess formed therein between said side portions, and wherein said carrier member includes a handle portion projecting out of said recess, whereby said carrier member can be grasped manually for insertion and removal of the carrier member and DIP from the socket.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US122679A | 1979-01-05 | 1979-01-05 | |
| US1,226 | 1979-01-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1121479A true CA1121479A (en) | 1982-04-06 |
Family
ID=21695000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000343013A Expired CA1121479A (en) | 1979-01-05 | 1980-01-03 | Dip carrier and socket |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5593684A (en) |
| CA (1) | CA1121479A (en) |
| DE (1) | DE2952599C2 (en) |
| FR (1) | FR2446019A1 (en) |
| GB (1) | GB2040604B (en) |
| NL (1) | NL179773C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6060893U (en) * | 1983-10-03 | 1985-04-27 | 星電器製造株式会社 | IC socket |
| DE4015238A1 (en) * | 1990-05-10 | 1991-11-14 | Krone Ag | CONNECTION BAR FOR TELECOMMUNICATION TECHNOLOGY |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1152765A (en) * | 1967-01-24 | 1969-05-21 | Amp Inc | An Electrical Circuit Assembly |
| US3409861A (en) * | 1967-09-28 | 1968-11-05 | Barnes Corp | Integrated circuit carrier |
| US3701077A (en) * | 1969-12-29 | 1972-10-24 | Tech Inc K | Electronic components |
| US3732529A (en) * | 1970-12-22 | 1973-05-08 | Aries Electronics | Integrated circuit socket |
| US3710299A (en) * | 1971-06-01 | 1973-01-09 | Aries Electronics | Low profile socket for integrated circuit pack |
| US3846734A (en) * | 1973-02-06 | 1974-11-05 | Amp Inc | Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates |
| US4245877A (en) * | 1976-12-30 | 1981-01-20 | Burndy Corporation | Circuit package receptacle with movable base separation means |
-
1979
- 1979-12-28 JP JP17057279A patent/JPS5593684A/en active Granted
- 1979-12-28 DE DE19792952599 patent/DE2952599C2/en not_active Expired
- 1979-12-28 GB GB7944425A patent/GB2040604B/en not_active Expired
-
1980
- 1980-01-03 FR FR8000079A patent/FR2446019A1/en active Granted
- 1980-01-03 CA CA000343013A patent/CA1121479A/en not_active Expired
- 1980-01-04 NL NL8000053A patent/NL179773C/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5593684A (en) | 1980-07-16 |
| FR2446019A1 (en) | 1980-08-01 |
| DE2952599C2 (en) | 1984-02-02 |
| NL8000053A (en) | 1980-07-08 |
| GB2040604B (en) | 1983-02-09 |
| FR2446019B1 (en) | 1985-04-19 |
| JPS6343875B2 (en) | 1988-09-01 |
| NL179773B (en) | 1986-06-02 |
| GB2040604A (en) | 1980-08-28 |
| NL179773C (en) | 1986-11-03 |
| DE2952599A1 (en) | 1980-07-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |