CA1113288A - Modular piezoelectric transducer component for audible signaling - Google Patents
Modular piezoelectric transducer component for audible signalingInfo
- Publication number
- CA1113288A CA1113288A CA312,518A CA312518A CA1113288A CA 1113288 A CA1113288 A CA 1113288A CA 312518 A CA312518 A CA 312518A CA 1113288 A CA1113288 A CA 1113288A
- Authority
- CA
- Canada
- Prior art keywords
- component
- piezoelectric
- audible signal
- housing
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
ABSTRACT OF THE DISCLOSURE
A modular piezoelectric transducer component of the type which includes a vibrating substrate and a piezoelectric ceramic element coupled to the substrate which when driven by appropriate electronic circuitry produces an audible signal provides a housing severable from required electronic circuitry for energizing the piezoelectric component having at least one side forming a compartment wherein the piezoelectric component is mounted, the housing including and element for mechanically coupling the housing in spaced relation to a printed circuit board assembly which includes the electronic circuitry utilizing a minimum of circuit board surface area, elements for electrically coupling the piezoelectric component to the electronic circuitry, an element for mounting the piezoeletric component to the housing at a fundamental mode of the component, and structure for providing acoustical enhancement of the audible signal produced by the piezo-electric transducer component.
A modular piezoelectric transducer component of the type which includes a vibrating substrate and a piezoelectric ceramic element coupled to the substrate which when driven by appropriate electronic circuitry produces an audible signal provides a housing severable from required electronic circuitry for energizing the piezoelectric component having at least one side forming a compartment wherein the piezoelectric component is mounted, the housing including and element for mechanically coupling the housing in spaced relation to a printed circuit board assembly which includes the electronic circuitry utilizing a minimum of circuit board surface area, elements for electrically coupling the piezoelectric component to the electronic circuitry, an element for mounting the piezoeletric component to the housing at a fundamental mode of the component, and structure for providing acoustical enhancement of the audible signal produced by the piezo-electric transducer component.
Description
BACKGROUND OF THE IN~ENTION
1. Field of t~e Invention The present invention generally relates to piezoelectric transducer components of the type which include a vibrating substrate and a piezo-electric ceramic element coupled to such substrate which when appropriately driven by electronic circuitry produces an audible signal, and more specifically to the separate packaging of such component so that it may be easily coupled to printed circuit boards and other microcircuits which have integrated therein the necessary circuitry to drive the transducer component.
Generally speaking, the modular piezoelectric transducer component of the present invention includes a means for housing the transducer-component, means for mounting the component to the housing, means for electrically and mechanically coupling the component and the module to a substrate including the necessary electronic drive circuitry to produce an audible signal and means for providing acoustic enhancement of the audible signal produced by the piezoelectric transducer component if desired.
1. Field of t~e Invention The present invention generally relates to piezoelectric transducer components of the type which include a vibrating substrate and a piezo-electric ceramic element coupled to such substrate which when appropriately driven by electronic circuitry produces an audible signal, and more specifically to the separate packaging of such component so that it may be easily coupled to printed circuit boards and other microcircuits which have integrated therein the necessary circuitry to drive the transducer component.
Generally speaking, the modular piezoelectric transducer component of the present invention includes a means for housing the transducer-component, means for mounting the component to the housing, means for electrically and mechanically coupling the component and the module to a substrate including the necessary electronic drive circuitry to produce an audible signal and means for providing acoustic enhancement of the audible signal produced by the piezoelectric transducer component if desired.
2. Description of the Prior Art As disclosed by Louis P. Sweany in United States Patent No. 3,879,726, ` issued April 22, 1975, and assigned to P. R. Mallory & Co. Inc., piezo-; electric transducer components for producing audible signals have hereto-fore been included along with a printed circuit board assembly including electronic circuitry to energize the transducer component in a single module.
However, in many applications where a piezoelectric transducer component ' is used to produce an audible signal or alarm it may be desirable and in many cases more economical to physically separate the transducer component from the electronic circuitry used to energize the transducer component.
- It may be particularly advantageous or desirous to separate the trans-ducer component from its drive circuitry where the electronic drive .~
circuitry is to be integrated with other electronic circuitry in a prefabricated integrated circuit package or on printed circuit board assembly.
As disclosed by John 0. Renskers et al in United States Patent No. 3,735,214, issued May 22, 1973, various means for mounting circuit elements which lend themselves to printed or integrated circuit fabri-cation have been developed in the prior art. However, these prior art modules have been developed for typical circuit elements i.e. inductive elements, resistors, etc. which neither provide audible outputs nor require special mounting to allow motion associated with their operation.
Various means for housing piezoelectric crystals by themselves so as to operate as resonators or band-pass filters have been developed in the prior art as disclosed in United States Patent Nos. 3,073,975, issued December 23, 1958 to Radio Corporation of America and 3,931,388, issued January 6, 1976 to Erich Hafner and John R. Vig. However, the primary objective of these prior art housing means has been to provide protection for the piezoelectric crystal from such environmental conditions as humidity, temperature, vibration and shock and consequently to ~
improve the crystal's stability and reliability. -Accordingly, as illustrated by the above prior art a means for housing a piezoelectric transducer component for producing an audible signal which may be utilized with prefabricated cirucitry does not exist.
It is therefore, a primary purpose of this invention to provide a separately packaged piezoelectric transducer component which includes means for mechanically mounting the individual module to prefabricated circuitry, means for providing acoustical enhancement of the audible signal pro-duced by the transducer and means for electrically coupling the trans-ducer component to electronic drive circuitry which may be integrated with other microcircuitry on a printed circuit board. The separately packaged transducer component is a versatile module which may be utilized with any suitable electronic drive circuit which may be integrated with other electronic circuitry in an integrated circuit package.
-~ 2 ~, , .. ~ . , SUMMARY OF THE INVENTION
In accordance with the present invention in its broadest concept '. ~ ~`'-'~`- ' , .
. ~
~; , '~,~ ''. ' ;,', ' ,' ~ ` . ~, .; ~ .
~s~
`
.' '~
.
-2a-- . -: ~ :., , ~ .
.
^~ 3L3L1 3~ 3 there is provided a modular piezoelectric transducer component for pro-ducing an audib1e signal which is adaptable for use with prefabricated circuitry of the type which may be included in an integrated circuit package or on a printed circuit board assembly.
It is therefore an object of the present invention to provide a piezoelectric transducer component for providing an audible signal which is separately packaged from associated electronic drive circuitry and adaptable for use with prefabricated microcircuitry.
It is yet another object of the present invention to provide a piezoelectric transducer component module which may be mechanically coupled to a printed circuit board assembly utilizing a minimum of space on the printed circuit board.
It is still yet another object of the present invention to pro-vide a modular piezoelectric electrical transducer component for producing an audible signal which may be utilized with any suitable electronic drive circuitry.
It is a further object of the present invention to provide a modular piezoelectr;c transducer component for producing an audible signal having means for providing acoustical enhancement of the audible signal -20 produced by the piezoelectric transducer component.
Other features and advantages of the present invention will be - apparent from the following detailed description of a preferred embodiment thereof which description should be considered in conjunct1on with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
tIGURE 1 is a cross sectional view in elevation of the modular ~ - transducer component of the present invention.
'~ FI6URE 2 is a view looking at the output end of the modular ,l transducer component shown in FIGURE 1.
. ~ ,.. . .
~ 30 FIGURE 3 1s a view look1ng at the input end of the modular .
, .
However, in many applications where a piezoelectric transducer component ' is used to produce an audible signal or alarm it may be desirable and in many cases more economical to physically separate the transducer component from the electronic circuitry used to energize the transducer component.
- It may be particularly advantageous or desirous to separate the trans-ducer component from its drive circuitry where the electronic drive .~
circuitry is to be integrated with other electronic circuitry in a prefabricated integrated circuit package or on printed circuit board assembly.
As disclosed by John 0. Renskers et al in United States Patent No. 3,735,214, issued May 22, 1973, various means for mounting circuit elements which lend themselves to printed or integrated circuit fabri-cation have been developed in the prior art. However, these prior art modules have been developed for typical circuit elements i.e. inductive elements, resistors, etc. which neither provide audible outputs nor require special mounting to allow motion associated with their operation.
Various means for housing piezoelectric crystals by themselves so as to operate as resonators or band-pass filters have been developed in the prior art as disclosed in United States Patent Nos. 3,073,975, issued December 23, 1958 to Radio Corporation of America and 3,931,388, issued January 6, 1976 to Erich Hafner and John R. Vig. However, the primary objective of these prior art housing means has been to provide protection for the piezoelectric crystal from such environmental conditions as humidity, temperature, vibration and shock and consequently to ~
improve the crystal's stability and reliability. -Accordingly, as illustrated by the above prior art a means for housing a piezoelectric transducer component for producing an audible signal which may be utilized with prefabricated cirucitry does not exist.
It is therefore, a primary purpose of this invention to provide a separately packaged piezoelectric transducer component which includes means for mechanically mounting the individual module to prefabricated circuitry, means for providing acoustical enhancement of the audible signal pro-duced by the transducer and means for electrically coupling the trans-ducer component to electronic drive circuitry which may be integrated with other microcircuitry on a printed circuit board. The separately packaged transducer component is a versatile module which may be utilized with any suitable electronic drive circuit which may be integrated with other electronic circuitry in an integrated circuit package.
-~ 2 ~, , .. ~ . , SUMMARY OF THE INVENTION
In accordance with the present invention in its broadest concept '. ~ ~`'-'~`- ' , .
. ~
~; , '~,~ ''. ' ;,', ' ,' ~ ` . ~, .; ~ .
~s~
`
.' '~
.
-2a-- . -: ~ :., , ~ .
.
^~ 3L3L1 3~ 3 there is provided a modular piezoelectric transducer component for pro-ducing an audib1e signal which is adaptable for use with prefabricated circuitry of the type which may be included in an integrated circuit package or on a printed circuit board assembly.
It is therefore an object of the present invention to provide a piezoelectric transducer component for providing an audible signal which is separately packaged from associated electronic drive circuitry and adaptable for use with prefabricated microcircuitry.
It is yet another object of the present invention to provide a piezoelectric transducer component module which may be mechanically coupled to a printed circuit board assembly utilizing a minimum of space on the printed circuit board.
It is still yet another object of the present invention to pro-vide a modular piezoelectric electrical transducer component for producing an audible signal which may be utilized with any suitable electronic drive circuitry.
It is a further object of the present invention to provide a modular piezoelectr;c transducer component for producing an audible signal having means for providing acoustical enhancement of the audible signal -20 produced by the piezoelectric transducer component.
Other features and advantages of the present invention will be - apparent from the following detailed description of a preferred embodiment thereof which description should be considered in conjunct1on with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
tIGURE 1 is a cross sectional view in elevation of the modular ~ - transducer component of the present invention.
'~ FI6URE 2 is a view looking at the output end of the modular ,l transducer component shown in FIGURE 1.
. ~ ,.. . .
~ 30 FIGURE 3 1s a view look1ng at the input end of the modular .
, .
-3=
~l,:,, ...
~ - :
~ L~L~L;~2~3'~3 transducer component shown in FIGURE 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring now to the drawings~and more particularly to FIGURES
I and 2, there is shown a module 10 for housing a piezoelectric trans-ducer component 32. As illustrated, module 10 includes housing means 12 which may be fabricated utilizing any suitable insulative material, such as plastic. In the preferred embodiment, housing means 12 is circular . ,,~,, and includes at least one side 14 which forms a compartment 15 within which piezoelectric transducer component 32 is mounted. Furthermore, -housing means 12 includes an opening 23 for transmitting and dispersing -the audible signal produced by transducer component 32 and for providing the capability to enhance the acoustics of the audible signal; means 16, 18, and 20 for mechanically coupling the module 10 to a substrate 2 such as a printed circuit board assembly utilizing a minimum of circu;t board surface area and for electrically coupling the transducer component 32 to electronic circuitry (not shown) which may be included on the substrate 2', and means 26 for mounting the transducer component 32 to housing means 12 which allows the transducer component to vibrate i~n response to ;
an electrical signal produced by electronic circuitry (not shown) on the substrate 2. Means 16, 18, and 20 may include~any solderable wire each solidly coupled to the side 14 of housing means 12. ~leans 169 18, and . 20 should furthermore be of sufficient length and be provided with prefab--ricated stop means 17 such that housing means 12 is elevated a predetermined optimum fixed distance off the circuit board surface area thereby allowing ; for maximum use of such surface area for electronic circuitry. As illus-trated in FIGURES 1 and 2 the audible signal output opening 23 may have coupled thereto an acoustic enhancement means 25. The acoustic enhancement means 25 may include such devices as an aperture termination, a resonant :
!'' chamber, slots, or a horn. As illustrated in the preferred embodiment, l 30 acoustic enhancement means 25 lncludes a resonant chamber 22 and an ~ .' - ' '' .' ;' .
.............. ,. ; . .
. . -4-" ' ' ' '' ~ ' ' ' Z~3~
aperture termination 24. Acoustic enhancement means 25 may be included in the mold of housing means 12 or may be a separate means attached to housing means 12 after molding. It should be noted that since various means may be adaptable to the module 10 of the present invention to enhance the acoustics of the sound provided by piezoelectric transducer component 32 the present invention'is not intended to be limited to the utili~ation of the particular acoustic enhancement means 25 illustrated in FIGURES 1 and 2 as described hereinabove.
Referring now to FIGURES 1 and 3, any piezoelectric transducer component 32 for providing an audible signal may be housed in the module 10; however, a sound producing piezoelectric transducer typically in-cludes a vibrating substrate 28 comprising brass, a piezoelectric ceramic element 30 mechanically coupled to the substrate and at least two elec-trodes 40 and 42 (not shown'in FIGURE l? carried by the piezoelectric ceramic element 30. By way of example, illustrated in FIGURES 1 and 3 .
is a pie~oelectric transducer component 32 for providing an audible 'signal which includes three (3) electrodes, two of wh;ch are shown as 40 ' and 42 ;n FIGURE 2. The third electrode (not shown) is typically in-cluded between the piezoelectric ceramic element 30 and the vibrat;ng substrate 28 such that the electronic drive circuitry is electrically coupled thereto by coupling an electrical lead 38 to the substrate 28.
Furthermore, electrodes 40 and 42'are electrically coupled to the elec-tronic drive circuitry by means of leads 34 and 36 respectively. As illustrated in FIGURE 1, leads 34, 36, and 38 are electrically coupled to means l6, 18, and 20 for mechanically coupling the module to the substrate 2.' Although not shown, ;t w;ll be understood by those skilled ;n the art that if substrate'2 is a printed c;rcuit board assembly, by solder;ng means 16, 18, and 20 to the substrate 2 an electr;cal connect;on is made between means 16, 18~ and 20 and various circuitry'included on ' 30 the .ubstrate 2. Accordingly, by coupllng leads 34, 36 and 38 to means " . . .
. . .
.
. .
1~328~
16, 18, and 20 the piezoelectric tr,ansducer component 32 is electrical-ly coupled to electronic dr~ve circuitry included on substrate 2. Piezoelec-tric transducer component 32 further includes a fundamental nodal diameter 44 (as shown in FIGURE 2) at which point there are no vibrations when transducer component 32 ;s driven at its fundamental resonant frequency. Transducer component'32 is therefore mounted to housing means 12 at its fundamental nodal diameter 44 by mounting means 26 as ' illustrated in FIGURE l. For purposes of thi~s embodiment, mounting means 26 may be any resilient adhes-ive material. Furthermore, as shown in FIGURE i compartment 15 of housing means 12 may be further enclosed by coupling a plate 39 to the bottom or input portion of housing means 12 and extending the leads 34, 36, and 38 through the plate 39 to provide the necessary electrical connections.
' In view of'the above description it will be seen that the several objects of the invention are achieved and other advantageous re-sults attained and that further modifications can be made to the invention without departing from its sp~rit and scope as described in the appended claims. ' ' '' , ' ..
"
.
' ~: .-. ., ,~ . , , ' . ' .
; ~ ~ . ' . , ' ' ,: ' . . ' " i , . :
. ' ' ' ' ' . ' .
,. . .
. . : ., .1: ..
. , . , ~ , .
.. .
.
:_ _ _ _ __ .;
~l,:,, ...
~ - :
~ L~L~L;~2~3'~3 transducer component shown in FIGURE 1.
DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring now to the drawings~and more particularly to FIGURES
I and 2, there is shown a module 10 for housing a piezoelectric trans-ducer component 32. As illustrated, module 10 includes housing means 12 which may be fabricated utilizing any suitable insulative material, such as plastic. In the preferred embodiment, housing means 12 is circular . ,,~,, and includes at least one side 14 which forms a compartment 15 within which piezoelectric transducer component 32 is mounted. Furthermore, -housing means 12 includes an opening 23 for transmitting and dispersing -the audible signal produced by transducer component 32 and for providing the capability to enhance the acoustics of the audible signal; means 16, 18, and 20 for mechanically coupling the module 10 to a substrate 2 such as a printed circuit board assembly utilizing a minimum of circu;t board surface area and for electrically coupling the transducer component 32 to electronic circuitry (not shown) which may be included on the substrate 2', and means 26 for mounting the transducer component 32 to housing means 12 which allows the transducer component to vibrate i~n response to ;
an electrical signal produced by electronic circuitry (not shown) on the substrate 2. Means 16, 18, and 20 may include~any solderable wire each solidly coupled to the side 14 of housing means 12. ~leans 169 18, and . 20 should furthermore be of sufficient length and be provided with prefab--ricated stop means 17 such that housing means 12 is elevated a predetermined optimum fixed distance off the circuit board surface area thereby allowing ; for maximum use of such surface area for electronic circuitry. As illus-trated in FIGURES 1 and 2 the audible signal output opening 23 may have coupled thereto an acoustic enhancement means 25. The acoustic enhancement means 25 may include such devices as an aperture termination, a resonant :
!'' chamber, slots, or a horn. As illustrated in the preferred embodiment, l 30 acoustic enhancement means 25 lncludes a resonant chamber 22 and an ~ .' - ' '' .' ;' .
.............. ,. ; . .
. . -4-" ' ' ' '' ~ ' ' ' Z~3~
aperture termination 24. Acoustic enhancement means 25 may be included in the mold of housing means 12 or may be a separate means attached to housing means 12 after molding. It should be noted that since various means may be adaptable to the module 10 of the present invention to enhance the acoustics of the sound provided by piezoelectric transducer component 32 the present invention'is not intended to be limited to the utili~ation of the particular acoustic enhancement means 25 illustrated in FIGURES 1 and 2 as described hereinabove.
Referring now to FIGURES 1 and 3, any piezoelectric transducer component 32 for providing an audible signal may be housed in the module 10; however, a sound producing piezoelectric transducer typically in-cludes a vibrating substrate 28 comprising brass, a piezoelectric ceramic element 30 mechanically coupled to the substrate and at least two elec-trodes 40 and 42 (not shown'in FIGURE l? carried by the piezoelectric ceramic element 30. By way of example, illustrated in FIGURES 1 and 3 .
is a pie~oelectric transducer component 32 for providing an audible 'signal which includes three (3) electrodes, two of wh;ch are shown as 40 ' and 42 ;n FIGURE 2. The third electrode (not shown) is typically in-cluded between the piezoelectric ceramic element 30 and the vibrat;ng substrate 28 such that the electronic drive circuitry is electrically coupled thereto by coupling an electrical lead 38 to the substrate 28.
Furthermore, electrodes 40 and 42'are electrically coupled to the elec-tronic drive circuitry by means of leads 34 and 36 respectively. As illustrated in FIGURE 1, leads 34, 36, and 38 are electrically coupled to means l6, 18, and 20 for mechanically coupling the module to the substrate 2.' Although not shown, ;t w;ll be understood by those skilled ;n the art that if substrate'2 is a printed c;rcuit board assembly, by solder;ng means 16, 18, and 20 to the substrate 2 an electr;cal connect;on is made between means 16, 18~ and 20 and various circuitry'included on ' 30 the .ubstrate 2. Accordingly, by coupllng leads 34, 36 and 38 to means " . . .
. . .
.
. .
1~328~
16, 18, and 20 the piezoelectric tr,ansducer component 32 is electrical-ly coupled to electronic dr~ve circuitry included on substrate 2. Piezoelec-tric transducer component 32 further includes a fundamental nodal diameter 44 (as shown in FIGURE 2) at which point there are no vibrations when transducer component 32 ;s driven at its fundamental resonant frequency. Transducer component'32 is therefore mounted to housing means 12 at its fundamental nodal diameter 44 by mounting means 26 as ' illustrated in FIGURE l. For purposes of thi~s embodiment, mounting means 26 may be any resilient adhes-ive material. Furthermore, as shown in FIGURE i compartment 15 of housing means 12 may be further enclosed by coupling a plate 39 to the bottom or input portion of housing means 12 and extending the leads 34, 36, and 38 through the plate 39 to provide the necessary electrical connections.
' In view of'the above description it will be seen that the several objects of the invention are achieved and other advantageous re-sults attained and that further modifications can be made to the invention without departing from its sp~rit and scope as described in the appended claims. ' ' '' , ' ..
"
.
' ~: .-. ., ,~ . , , ' . ' .
; ~ ~ . ' . , ' ' ,: ' . . ' " i , . :
. ' ' ' ' ' . ' .
,. . .
. . : ., .1: ..
. , . , ~ , .
.. .
.
:_ _ _ _ __ .;
Claims (10)
1. A modular piezoelectric transducer component of the type which includes a vibrating substrate and a piezoelectric ceramic element coupled to said substrate which when driven by appropriate electronic circuitry produces an audible signal, comprising: housing means physi-cally separated from required electronic circuitry for energizing said piezoelectric component having at least one side forming a compartment wherein said piezoelectric component is mounted, said housing means in-cluding means for mechanically coupling said housing means to a printed circuit board assembly which includes said electronic circuitry utiliz-ing a minimum of circuit board surface area, means for electrically coupling said piezoelectric component to said electronic circuitry, means for mounting said piezoelectric component to said housing means at a fundamental node of said component, and means for providing acqustical enhancement of said audible signal produced by said piezoelectric trans-ducer component.
2. The modular piezoelectric transducer component as recited in claim 1 wherein said housing means is circular and said means for electrically coupling said piezoelectric component to said electronic circuitry includes said means for mechanically coupling said housing to said printed circuit board assembly.
3. The modular piezoelectric transducer component as recited in claim 2 wherein said means for mechanically coupling said housing means to said printed circuit board assembly elevates said housing means off said circuit board surface area a predetermined optimum fixed distance.
4. The modular piezoelectric transducer component as recited in claim 3 wherein said means for providing acoustical enhancement of said audible signal includes an opening in at least one end of said housing means through which said audible signal is transmitted.
5. The modular piezoelectric transducer component as recited in claim 1 wherein said housing means further includes means coupled to said housing means for enhancing the acoustics of said audible signal.
6. The modular piezoelectric transducer component as recited in claim 5 wherein said means for enhancing the acoustics of said audible signal includes an aperture termination in spaced relation to said means for providing acoustical enhancement.
7. The modular piezoelectric transducer component as recited in claim 6 wherein said means for enhancing the acoustics of said audible signal further includes a resonant chamber coupled to said means for providing acoustical enhancement.
8. In combination with a printed circuit board assembly of the type which includes electronic circuitry electrically and mechanically coupled thereto, the improvement which comprises: a piezoelectric trans-ducer component module for producing an audible signal separately packaged from said printed circuit board assembly and said electronic circuitry included thereon, said module including housing means having at least one side forming a compartment wherein said piezoelectric transducer com-ponent is mounted, means for mechanically coupling said module to said printed circuit board assembly utilizing a minimum of circuit board sur-face area, means for electrically coupling said piezoelectric transducer component to said electronic circuitry, means for mounting said piezo-electric transducer component to said housing means at a fundamental node of said component, and means for providing acoustical enhancement of said audible signal produced by said piezoelectric transducer component.
9. The combination as recited in claim 8 wherein said module further includes means coupled to said housing means for enhancing the acoustics of said audible signal.
10. The combination as recited in claim 9 wherein said means for enhancing the acoustics of said audible signal includes an aperture termination in spaced relation to said means for providing acoustical enhancement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US85006477A | 1977-11-09 | 1977-11-09 | |
| US850,064 | 1977-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1113288A true CA1113288A (en) | 1981-12-01 |
Family
ID=25307175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA312,518A Expired CA1113288A (en) | 1977-11-09 | 1978-10-02 | Modular piezoelectric transducer component for audible signaling |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5476133A (en) |
| CA (1) | CA1113288A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4700177A (en) * | 1983-12-23 | 1987-10-13 | Nippondenso Co., Ltd. | Sound generating apparatus with sealed air chamber between two sounding plates |
-
1978
- 1978-10-02 CA CA312,518A patent/CA1113288A/en not_active Expired
- 1978-11-09 JP JP13838978A patent/JPS5476133A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4700177A (en) * | 1983-12-23 | 1987-10-13 | Nippondenso Co., Ltd. | Sound generating apparatus with sealed air chamber between two sounding plates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5476133A (en) | 1979-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100383877B1 (en) | Piezoelectric acoustic components and method of manufacturing the same | |
| US3354413A (en) | Electromechanical filter for low frequencies | |
| JPS62173814A (en) | Mounting unit for surface acoustic wave element | |
| US5541468A (en) | Monolithic transducer array case and method for its manufacture | |
| US4736128A (en) | Surface acoustic wave device | |
| GB1254037A (en) | Ultrasonic transducer employing suspended piezoelectric plate | |
| EP0094971B1 (en) | Sound generator | |
| JPH05315885A (en) | Chip oscillator and oscillation circuit using the oscillator | |
| WO1989005199A1 (en) | An acoustic emission transducer and an electrical oscillator | |
| CA1113288A (en) | Modular piezoelectric transducer component for audible signaling | |
| US3931600A (en) | Mechanical filter | |
| CA1074003A (en) | Acoustic transducer with a dual purpose piezoelectric element | |
| US6414604B1 (en) | Piezoelectric transducer assembly adapted for enhanced functionality | |
| KR950035058A (en) | Surface Wave (SAW) Device | |
| GB1370164A (en) | Piezoelectric transducer | |
| US5369399A (en) | Tolerance accumulating circuit supporting mechanical shock isolator | |
| KR950703265A (en) | ELECTRONIC COMPONENT | |
| JPS6358384B2 (en) | ||
| JPS59119911A (en) | Piezoelectric oscillator | |
| GB1232115A (en) | ||
| US6297581B1 (en) | Piezoelectric element and electronic component including same | |
| JP2002064356A (en) | Piezoelectric vibrator | |
| JPS6225039Y2 (en) | ||
| JP2000305573A (en) | Piezoelectric sound part | |
| JPH04334202A (en) | Piezoelectric oscillator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |