CA1092205A - Electrolytic capacitor with self-retaining lead assembly - Google Patents
Electrolytic capacitor with self-retaining lead assemblyInfo
- Publication number
- CA1092205A CA1092205A CA270,639A CA270639A CA1092205A CA 1092205 A CA1092205 A CA 1092205A CA 270639 A CA270639 A CA 270639A CA 1092205 A CA1092205 A CA 1092205A
- Authority
- CA
- Canada
- Prior art keywords
- anode
- lead
- resin
- strip
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
- H05K2201/10833—Flat leads having a curved or folded cross-section
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/168—Wrong mounting prevention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
ELECTROLYTIC CAPACITOR WITH
SELF RETAINING LEAD ASSEMBLY
Abstract of the Disclosure A resin coated electrolytic capacitor having a relatively narrow strip-like terminal lead conductor and a relatively wide strip-like lead conductor indicative of opposite polarities formed from a thin sheet of resilient, solderable metal, the wider of the strip-like portions being configured to provide engagement with a circuit board aperture.
S P E C I F I C A T I O N
1.
SELF RETAINING LEAD ASSEMBLY
Abstract of the Disclosure A resin coated electrolytic capacitor having a relatively narrow strip-like terminal lead conductor and a relatively wide strip-like lead conductor indicative of opposite polarities formed from a thin sheet of resilient, solderable metal, the wider of the strip-like portions being configured to provide engagement with a circuit board aperture.
S P E C I F I C A T I O N
1.
Description
l~ZZOS 9996 The present invention relates to resin coated electrolytic capacitors having terminal conductors con-figured to facilitate mounting and engagement with circuit boards and the like.
Resin coated solid state electrolytic capacitors are well known to the art and are described in United States patent 3,646,404 issued February 29, 1972, which also describes a terminal conductor configuration generally suitable for circuit board installation. However, the terminal conductor configuration of this patent, and other previously known configurations, are not completely satis-factory in several important aspects e.g. the avoidance of accidental polarity reversal during installation, retention prior to soldering, uniformity of installation, and other aspects.
It is therefore an ob;ect of the present invention to provide an electrolytic capacitor having terminal leads which can be readily affixed and which are especially suited for circuit board engagements.
Other objects will be apparent from the following ~ -description and claims taken in conjunction with the drawing in which Figure 1 shows a cross-sectional elevation view of an electrolytic capacitor in accordance with the present -invention.
Figure l(a) shows a bottom view of the capacitor.
Figures 2 through 4 illustrate steps during the manufacturing of capacitors of the type shown in Figure 1 and Figures 5(a), 5(b) and 5(c) illustrate certain terminal lead arrangements adapted for circuit board engagement which can be substituted for the anode lead terminal of Figure l(a).
Resin coated solid state electrolytic capacitors are well known to the art and are described in United States patent 3,646,404 issued February 29, 1972, which also describes a terminal conductor configuration generally suitable for circuit board installation. However, the terminal conductor configuration of this patent, and other previously known configurations, are not completely satis-factory in several important aspects e.g. the avoidance of accidental polarity reversal during installation, retention prior to soldering, uniformity of installation, and other aspects.
It is therefore an ob;ect of the present invention to provide an electrolytic capacitor having terminal leads which can be readily affixed and which are especially suited for circuit board engagements.
Other objects will be apparent from the following ~ -description and claims taken in conjunction with the drawing in which Figure 1 shows a cross-sectional elevation view of an electrolytic capacitor in accordance with the present -invention.
Figure l(a) shows a bottom view of the capacitor.
Figures 2 through 4 illustrate steps during the manufacturing of capacitors of the type shown in Figure 1 and Figures 5(a), 5(b) and 5(c) illustrate certain terminal lead arrangements adapted for circuit board engagement which can be substituted for the anode lead terminal of Figure l(a).
2.
999~
lO~ZOS
The present invention will be more fully unter-stood with reference to Figure 1 of the drawing which shows a sintered capacitor anode 10 made from tantalum, aluminum or other film forming metal having an attached metal lead out rod 20. An oxide layer is electrolytically provided on the surface of anode 10 and a cathode layer, e.g. silver, is applied on the oxide layer following con-ventional, known procedures. Anode and cathode terminal leads, indicated at 30 and 40 respectively, are bonded to -the capacitor body by welding, as indicated at 35, and solder, as indicated at 45, and the assembly is enclosed within a resin envelope as indicated at 50 by conventional techniques. With further reference to Figure 1, cathode terminal lead 40 comprises a relatively narrow portion 60 which is arranged to loosely fit in the slightly larger aperture 62 of the conventional circuit board indicated at 64. Intermediate lateral portion 66 of cathode lead 40 is in contact with circuit board 64 as is the corresponding lateral portion 68 of anode lead 30. The longitudinal portion 70 of cathode lead 40 is bonded by solder to the cathode of the capacitor as previously described. Anode lead 30 is formed of a resiliently deformable metal 8uch as "nickel silve~r' which is~we~Idabre~ to ~t-an~alum~
and solderable (typicaL composition:55%Cu,26.75%Zn,18V/ONi, .2570Mn) and has a relatively wide strip-like portion 72,a : :
transve~e "shou~er" portion 68 at the same ~elas ~e transverse .
9g96 portion 66.of cathode lead 40, a longitudinal portion 74, and a transverse portion 76 which i8 welded at 35 to anode lead out rod 20. As can be seen from Figure l(a), the relatively wide portion ?2 of anode_lead 30 has an end portion 78 which, upon entry into aperture 80 of circuit board 64, is resiliently deformed by the sides 83 of aperture 80, as indicated at 82, due to the relatively narrow width of aperture 80. Upon passing through aper-ture 80, resilient end portion 78 returns to its initial shape and engages the capacitor to circuit board 64 as shown at 85 in Figure l(a). The resilient deformation of locking conf'iguration 78 is facilitated by~ lance cuts, as indicated'a't 84, in're~'ative'ly'wide''strip-like~ member 72.
Upon insertion of the capacitor into circuit board 64, as described above, which can be done manually or auto-matically by machine, the capacitor is firmly held to circuit board 64 by the engagement of end portion 78 of arode terminal lead 30,and the c~ntact of lateral portions 66 and 68 of the cathode and anode terminal leads. The - ' capacitor can thus be conveniently joined to conductors : ' 86 and 88 as indicated in Figure 1 by solder connections 90 and 92. :
The capacitor body of the present invention i~
engaged to circuit board 64 b.y'aligning the relatively ' narrow strip-like cathode terminal lead 40 with the rela-tively smaller aperture 62 of circult board 64. End portion 60 of cathode lead 40 is surrounded by aperture 62 but fits~ -lOSZ2()S
loosely in aperture 62. The end portion 78 of relatively wide strip-like anode terminal lead 30 is spaced ~ pre-determined distance from portion 60 of cathode lead 40 so as to be aligned with ap~-rture 80 of circuit board 64.
The width of aperture 80 is narrower than the overall width 81 of end portion 78. Thus, end portion 78 is resil-iently deformed upon passing through aperture 80 and is returned to its original shape after passing through aper-ture 80 and thus engages circuit board 64. In view of the substantially different widths of the anode tenminal lead 30 and cathode terminal lead 40, the likelihood of reversing the desired polarity upon engagement with circuit board 64 is obviated. In addition to ease of installation, the capacitor of the present invention is firmly engaged so that it will not fall free of the circuit board 64 prior to or during soldering.
- With reference to Figure 2, a thin sheet of resilient, solderable metal such as previously mentioned hereinabove, about 0.010 inch to 0.020 inch thick, is suitabl~ punched to obtain the configuration shown having a pluralit~ of conductor pairs 100 attached to strip 110.
The configuration of Figure 2 is subsequently subjected ~: -. to a lancing operation to provide the lance cuts indicated at 84 in Figure 3, and a progressive die punch press opera- :
~ tion to deform end portion 78 as shown in Figure 3 and 3A.
lO 9 Z 2 ~ 5 9996 Thereafter capacitors 10 are attached as shown in Figure 4, to anode leads 30 by welding lead out rods 20 thereto as indicated at 35. Subsequently, the assembly is conventionally dipped in molten solder to bond the cathode leads 40 to capacitors 10 and provide the solder coating shown at 45 in Figure 1.
Following the solder-dipping step, the assembly is conventionally dipped in liquid resin, e.g. epoxy resin to provide a resin envelope as indicated at 50 in Figure 1 which encloses the capacitor 10, anode lead out rod 20 and most of the longitudinal portions of anote terminal lead 30 and cathode terminal lead 40. After forming the resin envelope 50, the conductor pairs 100 are cut at line 120 to obtain individual completed capacitors of the type shown in Figure 1.
With reference to Figures 5(a), 5(b) and 5(c), these figures show different embodiments of end portion or locking c~nfiguration 78, which can be formed by conventional metal working techniques. In Figure 5(b), the embodiment disclosed engages circuit board 64 in a manner similar to the embodiment of Figure 1, i.e. the end portion 78" is resiliently deformed and passes completely through aperture 80" and thereafter returns :
to its original shape to engage circuit board 64. In the embodiment of Figure 5(a), end portion 78' is ' lO ~ Z ~ O S 9996 resiliently deformed and compressed and engages circuit board 64 by being "wedged" in aperture 80' which is suitably of a circular, rather than elongate cross-section. In the embodiment of Figure 5(c), end portion 78 " ' is tapered as shown at 81, suitably from about 5 to 10, and is wedged in aperture 80 " ' without any substantial deformation of end portion 78 " '. m e slight taper of end portion 78 " ' enables a firm engagement with circuit board 64, particular~y when the circuit board material is a thermosetting resin such as phenolic and glass epoxy materials.
While in the foregoing description, the anode tenminal lead conductor has been described as having a relatively wide strip-like portion and a locking configuration, and the cathode terminal lead conductor as having a relatively narrow strip-like portion, it is within the scope of this invention that this arxangement be reversed. That is, the cathode lead terminal conductor can have a relatively wide strip-like portion and locking configuration while the anode terminal lead conductor has a relatively narrow strip-like portion.
999~
lO~ZOS
The present invention will be more fully unter-stood with reference to Figure 1 of the drawing which shows a sintered capacitor anode 10 made from tantalum, aluminum or other film forming metal having an attached metal lead out rod 20. An oxide layer is electrolytically provided on the surface of anode 10 and a cathode layer, e.g. silver, is applied on the oxide layer following con-ventional, known procedures. Anode and cathode terminal leads, indicated at 30 and 40 respectively, are bonded to -the capacitor body by welding, as indicated at 35, and solder, as indicated at 45, and the assembly is enclosed within a resin envelope as indicated at 50 by conventional techniques. With further reference to Figure 1, cathode terminal lead 40 comprises a relatively narrow portion 60 which is arranged to loosely fit in the slightly larger aperture 62 of the conventional circuit board indicated at 64. Intermediate lateral portion 66 of cathode lead 40 is in contact with circuit board 64 as is the corresponding lateral portion 68 of anode lead 30. The longitudinal portion 70 of cathode lead 40 is bonded by solder to the cathode of the capacitor as previously described. Anode lead 30 is formed of a resiliently deformable metal 8uch as "nickel silve~r' which is~we~Idabre~ to ~t-an~alum~
and solderable (typicaL composition:55%Cu,26.75%Zn,18V/ONi, .2570Mn) and has a relatively wide strip-like portion 72,a : :
transve~e "shou~er" portion 68 at the same ~elas ~e transverse .
9g96 portion 66.of cathode lead 40, a longitudinal portion 74, and a transverse portion 76 which i8 welded at 35 to anode lead out rod 20. As can be seen from Figure l(a), the relatively wide portion ?2 of anode_lead 30 has an end portion 78 which, upon entry into aperture 80 of circuit board 64, is resiliently deformed by the sides 83 of aperture 80, as indicated at 82, due to the relatively narrow width of aperture 80. Upon passing through aper-ture 80, resilient end portion 78 returns to its initial shape and engages the capacitor to circuit board 64 as shown at 85 in Figure l(a). The resilient deformation of locking conf'iguration 78 is facilitated by~ lance cuts, as indicated'a't 84, in're~'ative'ly'wide''strip-like~ member 72.
Upon insertion of the capacitor into circuit board 64, as described above, which can be done manually or auto-matically by machine, the capacitor is firmly held to circuit board 64 by the engagement of end portion 78 of arode terminal lead 30,and the c~ntact of lateral portions 66 and 68 of the cathode and anode terminal leads. The - ' capacitor can thus be conveniently joined to conductors : ' 86 and 88 as indicated in Figure 1 by solder connections 90 and 92. :
The capacitor body of the present invention i~
engaged to circuit board 64 b.y'aligning the relatively ' narrow strip-like cathode terminal lead 40 with the rela-tively smaller aperture 62 of circult board 64. End portion 60 of cathode lead 40 is surrounded by aperture 62 but fits~ -lOSZ2()S
loosely in aperture 62. The end portion 78 of relatively wide strip-like anode terminal lead 30 is spaced ~ pre-determined distance from portion 60 of cathode lead 40 so as to be aligned with ap~-rture 80 of circuit board 64.
The width of aperture 80 is narrower than the overall width 81 of end portion 78. Thus, end portion 78 is resil-iently deformed upon passing through aperture 80 and is returned to its original shape after passing through aper-ture 80 and thus engages circuit board 64. In view of the substantially different widths of the anode tenminal lead 30 and cathode terminal lead 40, the likelihood of reversing the desired polarity upon engagement with circuit board 64 is obviated. In addition to ease of installation, the capacitor of the present invention is firmly engaged so that it will not fall free of the circuit board 64 prior to or during soldering.
- With reference to Figure 2, a thin sheet of resilient, solderable metal such as previously mentioned hereinabove, about 0.010 inch to 0.020 inch thick, is suitabl~ punched to obtain the configuration shown having a pluralit~ of conductor pairs 100 attached to strip 110.
The configuration of Figure 2 is subsequently subjected ~: -. to a lancing operation to provide the lance cuts indicated at 84 in Figure 3, and a progressive die punch press opera- :
~ tion to deform end portion 78 as shown in Figure 3 and 3A.
lO 9 Z 2 ~ 5 9996 Thereafter capacitors 10 are attached as shown in Figure 4, to anode leads 30 by welding lead out rods 20 thereto as indicated at 35. Subsequently, the assembly is conventionally dipped in molten solder to bond the cathode leads 40 to capacitors 10 and provide the solder coating shown at 45 in Figure 1.
Following the solder-dipping step, the assembly is conventionally dipped in liquid resin, e.g. epoxy resin to provide a resin envelope as indicated at 50 in Figure 1 which encloses the capacitor 10, anode lead out rod 20 and most of the longitudinal portions of anote terminal lead 30 and cathode terminal lead 40. After forming the resin envelope 50, the conductor pairs 100 are cut at line 120 to obtain individual completed capacitors of the type shown in Figure 1.
With reference to Figures 5(a), 5(b) and 5(c), these figures show different embodiments of end portion or locking c~nfiguration 78, which can be formed by conventional metal working techniques. In Figure 5(b), the embodiment disclosed engages circuit board 64 in a manner similar to the embodiment of Figure 1, i.e. the end portion 78" is resiliently deformed and passes completely through aperture 80" and thereafter returns :
to its original shape to engage circuit board 64. In the embodiment of Figure 5(a), end portion 78' is ' lO ~ Z ~ O S 9996 resiliently deformed and compressed and engages circuit board 64 by being "wedged" in aperture 80' which is suitably of a circular, rather than elongate cross-section. In the embodiment of Figure 5(c), end portion 78 " ' is tapered as shown at 81, suitably from about 5 to 10, and is wedged in aperture 80 " ' without any substantial deformation of end portion 78 " '. m e slight taper of end portion 78 " ' enables a firm engagement with circuit board 64, particular~y when the circuit board material is a thermosetting resin such as phenolic and glass epoxy materials.
While in the foregoing description, the anode tenminal lead conductor has been described as having a relatively wide strip-like portion and a locking configuration, and the cathode terminal lead conductor as having a relatively narrow strip-like portion, it is within the scope of this invention that this arxangement be reversed. That is, the cathode lead terminal conductor can have a relatively wide strip-like portion and locking configuration while the anode terminal lead conductor has a relatively narrow strip-like portion.
Claims
1. A resin coated solid state electrolytic capacitor comprising an anode of film forming metal and an electrolytic dielectric oxide film thereon, a layer of semiconductive electrolyte on said film, and a conductive cathode layer on said electrolyte layer, a lead out rod connected to said anode a resin envelope enclosing said anode and said layers, a pair of spaced terminal lead conductors extending in the same direction, each said terminal lead conductor being formed from a thin sheet of resilient solderable metal,one of said pair of terminal lead conductors being the cathode lead conductor and having a strip-like portion and a longitu-dinal portion soldered to said cathode layer with most of said longitudinal portion being embedded in the resin of said envelope, the other of said pair of said terminal lead conductors being the anode lead conductor, said anode lead conductor having a strip-like portion, a longitudinal portion substantially embedded in the resin of said envelope and a lateral portion welded to said anode lead out rod, said lateral portion and said lead out rod being embedded in the resin of said envelope, one of said strip-like portions being substantially wider than the other and terminating in a pre-formed end portion integral therewith, said end portion being wider than the width of a circuit board aperture of predetermined dimensions and said pre-formed end portion being resiliently deformable for engagement in such circuit board aperture.
8.
8.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US66200676A | 1976-02-27 | 1976-02-27 | |
| US662,006 | 1976-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1092205A true CA1092205A (en) | 1980-12-23 |
Family
ID=24656004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA270,639A Expired CA1092205A (en) | 1976-02-27 | 1977-01-28 | Electrolytic capacitor with self-retaining lead assembly |
Country Status (6)
| Country | Link |
|---|---|
| JP (2) | JPS52125759A (en) |
| CA (1) | CA1092205A (en) |
| DE (1) | DE2706911A1 (en) |
| FR (1) | FR2342549A1 (en) |
| GB (1) | GB1567695A (en) |
| NL (1) | NL7702059A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4368944A (en) * | 1980-08-18 | 1983-01-18 | Magnetic Controls Company | Terminal construction |
| FR2593017B1 (en) * | 1986-01-13 | 1990-01-26 | Sayag Electronic | DEVICE FOR HANGING, BEFORE WELDING, ELECTRICAL OR ELECTRONIC COMPONENTS ON A PRINTED CIRCUIT PLATE |
| US5273460A (en) * | 1991-09-17 | 1993-12-28 | Hosiden Corporation | Electrical parts for surface mounting |
| FR2724530B1 (en) * | 1994-09-12 | 1996-12-13 | Sagem | METHOD OF MOUNTING WITH DETECTION, ON A PRINTED CIRCUIT OF AN ELECTRIC COMPONENT AND DETROMPE ELECTRIC COMPONENT |
| FR2925822B1 (en) * | 2007-12-24 | 2015-07-03 | Johnson Controls Tech Co | DEVICE FOR CONNECTING AN ELECTRICAL AND / OR ELECTRONIC ELEMENT TO A CIRCUIT BOARD AND CORRESPONDING ELEMENT. |
| DE102011110683A1 (en) * | 2010-08-27 | 2012-05-03 | Marquardt Mechatronik Gmbh | Electric switch |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB820318A (en) * | 1955-12-22 | 1959-09-16 | Chicago Telephone Supply Corp | Radio and television receiver component adapted especially for use with printed wiring |
| DE1113518B (en) * | 1958-03-05 | 1961-09-07 | Siemens Ag | Electrolytic capacitor with plug connections |
| JPS4827338B1 (en) * | 1968-12-23 | 1973-08-21 | ||
| FR2084341A5 (en) * | 1970-03-24 | 1971-12-17 | Matsuo Electric Co | |
| US3646404A (en) * | 1971-01-13 | 1972-02-29 | Matsuo Electric Co | Solid-state electrolytic capacitor and method of making same |
| DE2243503C2 (en) * | 1972-09-05 | 1974-09-19 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method of manufacturing an electrolytic capacitor |
| DE2402122A1 (en) * | 1973-01-19 | 1974-07-25 | Ericsson Telefon Ab L M | FIXED ELECTROLYTE CAPACITOR |
| DE2509856B2 (en) * | 1975-03-06 | 1979-03-01 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Method for attaching connections to electrical components and components with at least one punched connection |
-
1977
- 1977-01-28 CA CA270,639A patent/CA1092205A/en not_active Expired
- 1977-02-18 DE DE19772706911 patent/DE2706911A1/en not_active Withdrawn
- 1977-02-25 GB GB808977A patent/GB1567695A/en not_active Expired
- 1977-02-25 NL NL7702059A patent/NL7702059A/en not_active Application Discontinuation
- 1977-02-25 FR FR7705689A patent/FR2342549A1/en active Granted
- 1977-02-25 JP JP1942477A patent/JPS52125759A/en active Pending
-
1983
- 1983-06-06 JP JP8519783U patent/JPS6015334Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1567695A (en) | 1980-05-21 |
| FR2342549B1 (en) | 1983-07-18 |
| JPS5920627U (en) | 1984-02-08 |
| JPS6015334Y2 (en) | 1985-05-14 |
| DE2706911A1 (en) | 1977-09-01 |
| JPS52125759A (en) | 1977-10-21 |
| FR2342549A1 (en) | 1977-09-23 |
| NL7702059A (en) | 1977-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20090237865A1 (en) | Solid electrolytic capacitor and method for manufacturing same | |
| DE19640849C2 (en) | Melt-proof, surface-mountable dry electrolytic capacitor | |
| US7262955B2 (en) | Solid electrolytic capacitor and method for manufacturing the same | |
| CA1092205A (en) | Electrolytic capacitor with self-retaining lead assembly | |
| US6259348B1 (en) | Surface mounting type electronic component incorporating safety fuse | |
| JP3557564B2 (en) | Multilayer solid electrolytic capacitors | |
| US4349860A (en) | Tantalum condenser | |
| US5177674A (en) | Fused solid electrolytic capacitor | |
| US3997821A (en) | Solid electrolytic capacitor with planar cathode lead | |
| EP0436224A2 (en) | Solid electrolytic capacitor and a method of producing the same | |
| JP3080923B2 (en) | Method for manufacturing solid electrolytic capacitor | |
| US5576927A (en) | Electrolytic chip capacitor | |
| JP2005019923A (en) | Chip-shape solid electrolytic capacitor | |
| JPH0315330B2 (en) | ||
| US4827381A (en) | Solid electrolytical capacitor | |
| JP2875452B2 (en) | Manufacturing method of surface mount type solid electrolytic capacitor | |
| JPS5833690B2 (en) | Kotai Denkai Capacitor | |
| US4551786A (en) | Unencapsulated solid electrolytic capacitor and method for manufacturing the same | |
| JP2655629B2 (en) | Chip type solid electrolytic capacitor | |
| JP3433490B2 (en) | Chip-shaped solid electrolytic capacitors | |
| DE3539457C2 (en) | ||
| JPH034021Y2 (en) | ||
| JPS6357937B2 (en) | ||
| JPS6325697B2 (en) | ||
| JP3022095B2 (en) | Metallized capacitors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |