CA1033471A - Hermetic sealing cover for a container for semiconductor devices and method of fabricating the same - Google Patents

Hermetic sealing cover for a container for semiconductor devices and method of fabricating the same

Info

Publication number
CA1033471A
CA1033471A CA244,510A CA244510A CA1033471A CA 1033471 A CA1033471 A CA 1033471A CA 244510 A CA244510 A CA 244510A CA 1033471 A CA1033471 A CA 1033471A
Authority
CA
Canada
Prior art keywords
fabricating
container
same
semiconductor devices
sealing cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA244,510A
Other languages
English (en)
French (fr)
Inventor
Samuel W. Levine
Norman Hascoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEMI-ALLOYS
Original Assignee
SEMI-ALLOYS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEMI-ALLOYS filed Critical SEMI-ALLOYS
Application granted granted Critical
Publication of CA1033471A publication Critical patent/CA1033471A/en
Expired legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W95/00—
    • H10W72/5445—
CA244,510A 1975-06-03 1976-01-29 Hermetic sealing cover for a container for semiconductor devices and method of fabricating the same Expired CA1033471A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/583,463 US4109818A (en) 1975-06-03 1975-06-03 Hermetic sealing cover for a container for semiconductor devices

Publications (1)

Publication Number Publication Date
CA1033471A true CA1033471A (en) 1978-06-20

Family

ID=24333198

Family Applications (1)

Application Number Title Priority Date Filing Date
CA244,510A Expired CA1033471A (en) 1975-06-03 1976-01-29 Hermetic sealing cover for a container for semiconductor devices and method of fabricating the same

Country Status (6)

Country Link
US (1) US4109818A (OSRAM)
JP (1) JPS594859B2 (OSRAM)
CA (1) CA1033471A (OSRAM)
DE (1) DE2621184C3 (OSRAM)
FR (1) FR2313773A1 (OSRAM)
GB (1) GB1488331A (OSRAM)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243729A (en) * 1978-07-31 1981-01-06 Semi-Alloys, Inc. Metallic hermetic sealing cover for a container
US4192433A (en) * 1979-01-19 1980-03-11 Semi-Alloys, Inc. Hermetic sealing cover for a container for semiconductor devices
US4190176A (en) * 1979-01-23 1980-02-26 Semi-Alloys, Inc. Sealing cover unit for a container for a semiconductor device
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4331258A (en) * 1981-03-05 1982-05-25 Raychem Corporation Sealing cover for an hermetically sealed container
JPS60124848A (ja) * 1983-12-08 1985-07-03 Hitachi Chem Co Ltd 半導体類のパッケ−ジ構造
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
FR2615488B1 (fr) * 1987-05-20 1990-05-18 Aluminium Societe Alsacienne Opercule pour la fermeture d'un recipient comprenant une zone de scellage en matiere thermoplastique, et procede pour la fabrication de cet opercule
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
US5230759A (en) * 1989-10-20 1993-07-27 Fujitsu Limited Process for sealing a semiconductor device
US5218510A (en) * 1991-09-23 1993-06-08 Bradford Company Suspension packaging for static-sensitive products
JP3579740B2 (ja) * 1998-04-18 2004-10-20 Ｔｄｋ株式会社 電子部品の製造方法
US6827232B1 (en) * 1999-09-16 2004-12-07 Tokai Kogyo Co., Ltd. Resin case providing compatibility between air permeability and water proofing property, and mold for producing such case
US7442334B2 (en) * 1999-09-16 2008-10-28 Tokai Kogyo Co., Ltd. Resin case in which gas-permeability and waterproof quality are compatible, and die for manufacturing such case
IL179204A0 (en) 2006-11-13 2008-01-20 Abraham Aharoni Multi-phase interferometer
JP2009001754A (ja) * 2007-06-25 2009-01-08 Kagawa Univ 接着構造、封止構造及びそれを用いた電子部品、接着方法並びに封止方法
US9056470B2 (en) * 2008-05-15 2015-06-16 Hewlett-Packard Development Company, L.P. Flexible circuit seal
US7993609B2 (en) * 2008-12-30 2011-08-09 Sterilucent, Inc. Package for chemicals
US20160291269A1 (en) 2015-04-01 2016-10-06 Coriant Advanced Technology, LLC Photonic integrated circuit chip packaging

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2887737A (en) * 1954-07-12 1959-05-26 Pittsburgh Plate Glass Co Sealing means for glazing unit
US3120321A (en) * 1962-09-27 1964-02-04 Central States Can Corp Container construction
US3190952A (en) * 1963-02-21 1965-06-22 Bitko Sheldon Welded hermetic seal
FR2155233A5 (OSRAM) * 1971-10-05 1973-05-18 Toyo Seikan Kaisha Ltd
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
US3778683A (en) * 1972-08-28 1973-12-11 Gen Electric Self-bonding capacitor case insulation
US3825148A (en) * 1972-09-25 1974-07-23 Gen Electric Hermetic sealing system for plastic tank and cover

Also Published As

Publication number Publication date
US4109818A (en) 1978-08-29
DE2621184B2 (de) 1978-10-26
GB1488331A (en) 1977-10-12
DE2621184A1 (de) 1976-12-23
JPS594859B2 (ja) 1984-02-01
FR2313773B3 (OSRAM) 1979-03-16
FR2313773A1 (fr) 1976-12-31
JPS51148360A (en) 1976-12-20
DE2621184C3 (de) 1979-08-02

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