CA1032660A - Methode de fabrication de transistors sans effet creneau - Google Patents

Methode de fabrication de transistors sans effet creneau

Info

Publication number
CA1032660A
CA1032660A CA229,647A CA229647A CA1032660A CA 1032660 A CA1032660 A CA 1032660A CA 229647 A CA229647 A CA 229647A CA 1032660 A CA1032660 A CA 1032660A
Authority
CA
Canada
Prior art keywords
transistors
dip effect
emitter dip
emitter
effect
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA229,647A
Other languages
English (en)
Inventor
Helmuth Murrmann
Andreas Glasl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of CA1032660A publication Critical patent/CA1032660A/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/225Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a solid phase, e.g. a doped oxide layer
    • H01L21/2251Diffusion into or out of group IV semiconductors
    • H01L21/2254Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides
    • H01L21/2257Diffusion into or out of group IV semiconductors from or through or into an applied layer, e.g. photoresist, nitrides the applied layer being silicon or silicide or SIPOS, e.g. polysilicon, porous silicon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping
    • Y10S438/923Diffusion through a layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Bipolar Transistors (AREA)
CA229,647A 1974-06-21 1975-06-18 Methode de fabrication de transistors sans effet creneau Expired CA1032660A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2429957A DE2429957B2 (de) 1974-06-21 1974-06-21 Verfahren zur Herstellung einer dotierten Zone eines bestimmten Leitungstyps in einem Halbleiterkörper

Publications (1)

Publication Number Publication Date
CA1032660A true CA1032660A (fr) 1978-06-06

Family

ID=5918663

Family Applications (1)

Application Number Title Priority Date Filing Date
CA229,647A Expired CA1032660A (fr) 1974-06-21 1975-06-18 Methode de fabrication de transistors sans effet creneau

Country Status (7)

Country Link
US (1) US4029527A (fr)
JP (1) JPS5118474A (fr)
CA (1) CA1032660A (fr)
DE (1) DE2429957B2 (fr)
FR (1) FR2275881A1 (fr)
GB (1) GB1492830A (fr)
IT (1) IT1038812B (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5268376A (en) * 1975-12-05 1977-06-07 Nec Corp Semiconductor device
NL7604445A (nl) * 1976-04-27 1977-10-31 Philips Nv Werkwijze ter vervaardiging van een halfgelei- derinrichting, en inrichting vervaardigd door toepassing van de werkwijze.
JPS5317081A (en) * 1976-07-30 1978-02-16 Sharp Corp Production of i2l device
NL7709363A (nl) * 1977-08-25 1979-02-27 Philips Nv Werkwijze ter vervaardiging van een halfgeleider- inrichting en halfgeleiderinrichting vervaardigd onder toepassing van een dergelijke werkwijze.
US4118250A (en) * 1977-12-30 1978-10-03 International Business Machines Corporation Process for producing integrated circuit devices by ion implantation
US4199386A (en) * 1978-11-28 1980-04-22 Rca Corporation Method of diffusing aluminum into monocrystalline silicon
JPS6028135B2 (ja) * 1979-05-18 1985-07-03 富士通株式会社 半導体装置の製造方法
US4534806A (en) * 1979-12-03 1985-08-13 International Business Machines Corporation Method for manufacturing vertical PNP transistor with shallow emitter
JPS56115525A (en) * 1980-02-18 1981-09-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
US5830939A (en) * 1996-04-25 1998-11-03 Xerox Corporation Viscosity reduction method
US7579394B2 (en) * 2007-01-16 2009-08-25 Xerox Corporation Adhesion promoter

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1052379A (fr) * 1963-03-28 1900-01-01
DE1913681A1 (de) * 1969-03-18 1970-10-01 Siemens Ag Silicium-Hochfrequenz-Planartransistor
US3664896A (en) * 1969-07-28 1972-05-23 David M Duncan Deposited silicon diffusion sources
US3621346A (en) * 1970-01-28 1971-11-16 Ibm Process for forming semiconductor devices with polycrystalline diffusion pathways and devices formed thereby
US3703420A (en) * 1970-03-03 1972-11-21 Ibm Lateral transistor structure and process for forming the same
US3719535A (en) * 1970-12-21 1973-03-06 Motorola Inc Hyperfine geometry devices and method for their fabrication
DE2211709C3 (de) * 1971-03-12 1979-07-05 Hitachi, Ltd., Tokio Verfahren zum Dotieren von Halbleitermaterial
JPS499186A (fr) * 1972-05-11 1974-01-26
US3897282A (en) * 1972-10-17 1975-07-29 Northern Electric Co Method of forming silicon gate device structures with two or more gate levels

Also Published As

Publication number Publication date
DE2429957B2 (de) 1980-08-28
GB1492830A (en) 1977-11-23
US4029527A (en) 1977-06-14
DE2429957C3 (fr) 1987-04-16
DE2429957A1 (de) 1976-01-08
FR2275881A1 (fr) 1976-01-16
IT1038812B (it) 1979-11-30
FR2275881B1 (fr) 1980-01-04
JPS5118474A (fr) 1976-02-14

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