CA1004779A - Semiconductor device metalization manufacture - Google Patents

Semiconductor device metalization manufacture

Info

Publication number
CA1004779A
CA1004779A CA192,009A CA192009A CA1004779A CA 1004779 A CA1004779 A CA 1004779A CA 192009 A CA192009 A CA 192009A CA 1004779 A CA1004779 A CA 1004779A
Authority
CA
Canada
Prior art keywords
manufacture
semiconductor device
metalization
device metalization
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA192,009A
Other languages
English (en)
Inventor
Karl H. Tiefert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of CA1004779A publication Critical patent/CA1004779A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/077—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers on sidewalls or on top surfaces of conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
CA192,009A 1973-02-12 1974-02-07 Semiconductor device metalization manufacture Expired CA1004779A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US33151173A 1973-02-12 1973-02-12

Publications (1)

Publication Number Publication Date
CA1004779A true CA1004779A (en) 1977-02-01

Family

ID=23294273

Family Applications (1)

Application Number Title Priority Date Filing Date
CA192,009A Expired CA1004779A (en) 1973-02-12 1974-02-07 Semiconductor device metalization manufacture

Country Status (4)

Country Link
JP (1) JPS49114381A (enExample)
CA (1) CA1004779A (enExample)
DE (1) DE2406578A1 (enExample)
GB (1) GB1419906A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137808A (en) * 1983-04-06 1984-10-10 Plessey Co Plc Integrated circuit processing method

Also Published As

Publication number Publication date
DE2406578A1 (de) 1974-08-15
GB1419906A (en) 1975-12-31
JPS49114381A (enExample) 1974-10-31

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