CA1001323A - Microwave transistor package - Google Patents

Microwave transistor package

Info

Publication number
CA1001323A
CA1001323A CA198,024A CA198024A CA1001323A CA 1001323 A CA1001323 A CA 1001323A CA 198024 A CA198024 A CA 198024A CA 1001323 A CA1001323 A CA 1001323A
Authority
CA
Canada
Prior art keywords
transistor package
microwave transistor
microwave
package
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA198,024A
Other versions
CA198024S (en
Inventor
James A. Benjamin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Application granted granted Critical
Publication of CA1001323A publication Critical patent/CA1001323A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/45001—Core members of the connector
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
CA198,024A 1973-05-18 1974-04-24 Microwave transistor package Expired CA1001323A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US36173173A 1973-05-18 1973-05-18

Publications (1)

Publication Number Publication Date
CA1001323A true CA1001323A (en) 1976-12-07

Family

ID=23423227

Family Applications (1)

Application Number Title Priority Date Filing Date
CA198,024A Expired CA1001323A (en) 1973-05-18 1974-04-24 Microwave transistor package

Country Status (5)

Country Link
JP (1) JPS5624374B2 (en)
CA (1) CA1001323A (en)
CH (1) CH572665A5 (en)
DE (1) DE2423662A1 (en)
GB (1) GB1426543A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701573A (en) * 1985-09-26 1987-10-20 Itt Gallium Arsenide Technology Center Semiconductor chip housing
JPH08506454A (en) * 1993-11-29 1996-07-09 ロジヤーズ・コーポレイシヨン Electronic chip carrier package and manufacturing method thereof

Also Published As

Publication number Publication date
DE2423662A1 (en) 1974-12-05
CH572665A5 (en) 1976-02-13
JPS5020666A (en) 1975-03-05
GB1426543A (en) 1976-03-03
JPS5624374B2 (en) 1981-06-05

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