BRPI0506373A - método e dispositivo para soldagem a laser de elementos de material sinterizado - Google Patents

método e dispositivo para soldagem a laser de elementos de material sinterizado

Info

Publication number
BRPI0506373A
BRPI0506373A BRPI0506373-6A BRPI0506373A BRPI0506373A BR PI0506373 A BRPI0506373 A BR PI0506373A BR PI0506373 A BRPI0506373 A BR PI0506373A BR PI0506373 A BRPI0506373 A BR PI0506373A
Authority
BR
Brazil
Prior art keywords
laser welding
sintered material
material elements
laser
welding
Prior art date
Application number
BRPI0506373-6A
Other languages
English (en)
Inventor
Piergiorgio Romanin
Massimo Asti
Silvio Corrias
Marco Pidria
Original Assignee
Fiat Ricerche
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fiat Ricerche filed Critical Fiat Ricerche
Publication of BRPI0506373A publication Critical patent/BRPI0506373A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/144—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing particles, e.g. powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Products (AREA)

Abstract

"MéTODO E DISPOSITIVO PARA SOLDAGEM A LASER DE ELEMENTOS DE MATERIAL SINTERIZADO". A presente invenção refere-se a um método para soldagem a laser de materiais sinterizados, no qual a solda a laser é executada com a adição de um material de solda, o último sendo aduzido simultaneamente para a etapa de soldagem na forma de pós de metal, em uma área de junção entre as partes a serem unidas (1,2).
BRPI0506373-6A 2004-07-13 2005-06-29 método e dispositivo para soldagem a laser de elementos de material sinterizado BRPI0506373A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04425519A EP1616655B1 (en) 2004-07-13 2004-07-13 Method for laser welding of elements of sintered material
PCT/IB2005/001946 WO2006008606A1 (en) 2004-07-13 2005-06-29 Method and device for laser welding of elements of sintered material

Publications (1)

Publication Number Publication Date
BRPI0506373A true BRPI0506373A (pt) 2006-12-26

Family

ID=34932630

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0506373-6A BRPI0506373A (pt) 2004-07-13 2005-06-29 método e dispositivo para soldagem a laser de elementos de material sinterizado

Country Status (9)

Country Link
US (1) US20070039930A1 (pt)
EP (1) EP1616655B1 (pt)
JP (1) JP2008506535A (pt)
CN (1) CN100484684C (pt)
AT (1) ATE344706T1 (pt)
BR (1) BRPI0506373A (pt)
DE (1) DE602004003138T2 (pt)
ES (1) ES2275198T3 (pt)
WO (1) WO2006008606A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7951412B2 (en) * 2006-06-07 2011-05-31 Medicinelodge Inc. Laser based metal deposition (LBMD) of antimicrobials to implant surfaces

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3947654A (en) * 1973-10-24 1976-03-30 Sirius Corporation Method of generating laser-radio beam
JP2517752B2 (ja) * 1988-12-12 1996-07-24 ダイハツ工業株式会社 焼結部品の接合方法
DE4006511A1 (de) * 1990-03-02 1991-09-05 Krupp Gmbh Einrichtung zum zufuehren pulverfoermiger zusatzwerkstoffe in den bereich einer schweissstelle
EP0502390A1 (en) * 1991-02-26 1992-09-09 Kabushiki Kaisha Kobe Seiko Sho Filler metal for welding sintered materials
US5245155A (en) * 1992-03-06 1993-09-14 General Electric Company Single point powder feed nozzle for use in laser welding
JPH08290292A (ja) * 1995-04-19 1996-11-05 Kobe Steel Ltd 鉄系焼結材などの電子ビーム、レーザ又はｔｉｇ溶接方法
US6396025B1 (en) * 1999-07-01 2002-05-28 Aeromet Corporation Powder feed nozzle for laser welding
EP1361288B1 (en) * 2001-01-15 2006-09-27 Toyota Jidosha Kabushiki Kaisha Wear-resistant copper-base alloy

Also Published As

Publication number Publication date
ATE344706T1 (de) 2006-11-15
DE602004003138T2 (de) 2007-08-30
ES2275198T3 (es) 2007-06-01
US20070039930A1 (en) 2007-02-22
WO2006008606A1 (en) 2006-01-26
JP2008506535A (ja) 2008-03-06
CN1898057A (zh) 2007-01-17
EP1616655B1 (en) 2006-11-08
CN100484684C (zh) 2009-05-06
DE602004003138D1 (de) 2006-12-21
EP1616655A1 (en) 2006-01-18

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.