BRPI0505362A - thermoelectric cooling chip heat / cold conditioning device - Google Patents

thermoelectric cooling chip heat / cold conditioning device

Info

Publication number
BRPI0505362A
BRPI0505362A BRPI0505362A BRPI0505362A BR PI0505362 A BRPI0505362 A BR PI0505362A BR PI0505362 A BRPI0505362 A BR PI0505362A BR PI0505362 A BRPI0505362 A BR PI0505362A
Authority
BR
Brazil
Prior art keywords
cold
chip
cooling
cooling chip
heat
Prior art date
Application number
Other languages
Portuguese (pt)
Inventor
Chuan-Sheng Chen
Original Assignee
Chuan-Sheng Chen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuan-Sheng Chen filed Critical Chuan-Sheng Chen
Publication of BRPI0505362A publication Critical patent/BRPI0505362A/en

Links

Landscapes

  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

DISPOSITIVO CONDICIONADOR DE FRIO/CALOR COM CHIP DE RESFRIAMENTO TERMOELéTRICO A presente invenção utiliza principalmente um chip semicondutor especializado, o denominado chip de resfriamento termoelétrico, para a produção do frio. Um elemento de circulação de resfriamento e um elemento dissipador de calor são configurados nos dois lados do chip de resfriamento termoelétrico.O frio produzido pelo chip de resfriamento é fornecido por uma chapa de condução de frio e tubos de resfriamento, e é armazenado em aletas do elemento de circulação de resfriamento. Um controlador de temperatura determina uma temperatura desejada e o frio armazenadonas aletas é soprado para fora como ar frio por uma ventoinha. Similarmente, o calor produzido pelo chip é dissipado pelo elemento de dissipação de calor. Como tal, a presente invenção poderia atingir a temperatura desejada em um curto período de tempo sem o compressor convencional. a presente invenção é portanto de instalação e transporte mais fáceis, consome menos energia e quase não produz ruído e poluição para o meio ambiente.THERMAL ELECTRIC COOLING CHIP / HEAT CONDITIONING DEVICE The present invention mainly utilizes a specialized semiconductor chip, the so-called thermoelectric cooling chip, for the production of cold. A cooling circulation element and a heat sink element are configured on both sides of the thermoelectric cooling chip. The cold produced by the cooling chip is provided by a cold conduction plate and cooling pipes, and is stored in the fins of the cooling circulation element. A temperature controller sets a desired temperature and the cold stored on the fins is blown out like cold air by a fan. Similarly, the heat produced by the chip is dissipated by the heat dissipating element. As such, the present invention could reach the desired temperature in a short time without the conventional compressor. The present invention is therefore easier to install and transport, uses less energy and produces almost no noise and pollution for the environment.

BRPI0505362 2005-09-23 2005-11-28 thermoelectric cooling chip heat / cold conditioning device BRPI0505362A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200520029231 CN2842313Y (en) 2005-09-23 2005-09-23 Semiconductor cooling-heating electric appliance

Publications (1)

Publication Number Publication Date
BRPI0505362A true BRPI0505362A (en) 2007-08-07

Family

ID=37446195

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0505362 BRPI0505362A (en) 2005-09-23 2005-11-28 thermoelectric cooling chip heat / cold conditioning device

Country Status (2)

Country Link
CN (1) CN2842313Y (en)
BR (1) BRPI0505362A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012075360A1 (en) 2010-12-03 2012-06-07 Idaho Technology, Inc. Thermal cycler apparatus and related methods

Also Published As

Publication number Publication date
CN2842313Y (en) 2006-11-29

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Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law

Free format text: REFERENTE A 4A E 5A ANUIDADE(S)

B15G Others concerning applications: unknown petition

Free format text: NAO CONHECIDA A PETICAO 20110109702 DE 24/10/2011 COM BASE NO DISPOSTO NO ART 219, INCISO "I" DA LPI E NOS ARTIGOS 10 AO 14 DA RESOLUCAO INPI/DIRPA NO 124/2006 EM VIRTUDE DE TER SIDO APRESENTADA APOS O PRAZO LEGAL DE 03 (TRES) MESES, TENDO COMO INICIO PARA A CONTAGEM DO PRAZO O DESPACHO 8.6 PUBLICADO NA RPI 2094 DE 22/02/2011.

B08K Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87)

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2094 DE 22/02/2011.