TWM516695U - Chip type air conditioning device - Google Patents

Description

Wafer type air conditioner

The present invention relates to an air conditioner, and more particularly to a wafer type air conditioner.

With the continuous consumption of various energy sources, not only a serious energy crisis but also serious damage to the environment is caused. Taking traditional air-conditioning systems as an example, whether it is used in general buildings or automotive air-conditioning systems, the use of refrigerants and The compressor is used to achieve the function of conveying the cooling and heating. Due to the long-term use of refrigerant, it will not only destroy the ozone layer of the earth, but also cause a greenhouse effect, which in turn will change the earth's climate. As for the compressor, it generates noise and consumes a lot of electricity.

Therefore, some manufacturers have actively developed air conditioners that can replace refrigerants. For example, the Republic of China Announcement No. I284188 "Using Semiconductor Cooling and Heating Appliances" invention patent case is an example, which is mainly on the two sides of the Thermoelectric Cooling Chip. In combination with a heat-dissipating cycle device and a cold circulator, the heat-dissipating cycle device and the cold circulator are respectively equipped with a cold guide plate, a heat guide plate, a cold water pipe, a heat pipe and a fin, and a fan is installed on the heat-dissipating cycle device. And so on. Cooling is generated by the thermoelectrically cooled wafer, and then transmitted to the fin through the cold circulator through the cold runner to be cold stored, and then the temperature is set by the thermostat, and the cold stored in the fin is blown through the fan, and the thermoelectricity is The heat generated by the cooled wafer is cooled by the heat cycle equipment Excluded, to achieve the set coldness.

However, due to the above-mentioned structural design of the conventional heating and cooling appliance, there is a large amount of heat generated by the thermoelectrically cooled wafer cannot be quickly and effectively taken away, so that the temperature of the thermoelectrically cooled wafer cannot be lowered to the target temperature, thereby causing the The effect of cooling or heat removal of the heating and cooling appliances is not satisfactory.

Therefore, the object of the present invention is to provide a wafer type air conditioner which can provide cold air or heat, is small in size, and can save power and meet environmental protection requirements.

Therefore, the novel wafer type air conditioner includes a casing, a uniform cold chip, a heat dissipating unit, a first fan, and a second fan.

The casing has an inner accommodating space, a plurality of air inlet holes for inputting outside air into the accommodating space, a cold air output hole for outputting gas in the accommodating space, and a The heating output hole of the gas output in the accommodating space.

The refrigerating wafer is disposed in the accommodating space and has a cold surface facing the cold air output hole and a hot surface facing the heating output hole.

The heat dissipating unit is disposed in the accommodating space, and the heat dissipating unit includes a heat conducting seat for contacting the hot surface of the chilled wafer, and is mostly made of a ceramic composite material and disposed on the heat conducting seat The heat sink extends in the direction of the heat output hole.

The first fan is disposed in the casing and is located at the heating output hole and is used for extracting high temperature gas in the accommodating space to be outputted by the heating output hole.

The second fan is disposed in the casing and is located at the cold air outlet hole and is used for extracting low temperature gas in the accommodating space to be outputted by the cold air output hole.

The utility model has the advantages that the heat sink prepared by using the ceramic composite material has the advantages of small volume and high heat dissipation efficiency, and therefore, the wafer type air conditioner is not only smaller in volume than the conventional commercially available similar products, and the wafer is small in size. The heat dissipation efficiency of the air conditioner is also better than that of a similar product that is commercially available. In addition, the wafer type air conditioner can output the heating or cooling air toward the room as needed to achieve the effect of the warm room or the cold room. In addition, because this new model does not require the use of a refrigerant compressor, it can not only reduce energy consumption, but also meet environmental protection needs.

1‧‧‧Shell

11‧‧‧ shell wall

12‧‧‧ accommodating space

13‧‧‧Air intake

14‧‧‧ Vents

15‧‧‧Air outlet

16‧‧‧Heating output hole

2‧‧‧Cold wafer

21‧‧‧ cold noodles

22‧‧‧ Hot noodles

3‧‧‧heating unit

31‧‧‧heating seat

32‧‧‧ Heat sink

33‧‧‧Separate temperature seat

34‧‧‧Composite heat sink

4‧‧‧First fan

5‧‧‧second fan

6‧‧‧Guide cooler

61‧‧‧ Around the wall

611‧‧‧ entrance

612‧‧‧Export

62‧‧‧through hole

63‧‧‧Sheet

64‧‧‧Air passage

Other features and effects of the present invention will be apparent from the following description of the drawings. FIG. 1 is a cross-sectional view showing an embodiment of the novel wafer type air conditioning apparatus; FIG. 2 is another FIG. 3 is a cross-sectional view showing the combined relationship of the heat conducting seat, the heat sink and the cooling chip of the embodiment; and FIG. 4 is another cross-sectional view illustrating the implementation. Another combination of the heat conducting seat, the heat sink and the cooling chip.

Referring to Figures 1 and 2, an embodiment of the wafer type air conditioner of the present invention comprises a casing 1, a uniform cold chip 2, a heat dissipating unit 3, a first fan 4, and a second fan 5.

The casing 1 has a casing wall 11 , an accommodating space 12 defined by the casing wall 11 , and a plurality of air inlet holes 13 disposed in the casing wall 11 , and are disposed on the casing wall 11 and located in the heat dissipation unit 3 adjacent air outlet holes 14, a cold air outlet opening 15 at one end of the casing wall 11, and a heating output aperture 16 at the opposite end of the casing wall 11.

The refrigerating wafer 2 is disposed in the accommodating space 12, and the refrigerating wafer 2 has a cold surface 21 facing the cold air output hole 15 and a hot surface 22 facing the heating output hole 16.

Referring to FIGS. 1, 2, and 3, the heat dissipating unit 3 is disposed in the accommodating space 12. The heat dissipating unit 3 includes a heat conducting seat 31 for contacting the hot surface 22 of the chilled wafer 2, and most of the ceramics are ceramic. a heat sink 32 which is formed on the heat conducting seat 31 and extends in the direction of the heating output hole 16 and is disposed between the inner surface of the casing 1 and the refrigerant chip 2 for isolating the same The cold wafer 2 is in thermal contact with the inner surface of the casing 1 . Specifically, the heat conducting seat 31 and the heat sinks 32 may be made of a metal material selected from the group consisting of copper, iron, aluminum, silver, gold, or the like; or The heat conducting seat 31 is made of a metal material, and the heat sinks 32 are made of a ceramic composite material. In this aspect, the heat sinks 32 can have a porous (OPEN CELL) characteristic, and the heat thereof The convection heat dissipation mechanism is not limited to the surface of the material, and the inside of the material can also be thermally convectively dissipated, so the heat dissipation mode is three-dimensional heat conduction mode (3D) heat convection, scattered The thermal surface area is much larger than that of the general metal surface heat dissipating material, so that the overall heat dissipation efficiency is superior to that of the general heat sink 32, and the thermal conductive seat 31 is made of a metal material as the contact bonding surface energy in contact with the hot surface 22 of the refrigerating wafer 2. It has smooth and detailed characteristics.

The first fan 4 is disposed in the casing 1 and is located at the heating output hole 16 for extracting high temperature gas in the accommodating space 12 from the heating output hole 16 .

The second fan 5 is disposed in the casing 1 and is located at the cold air outlet hole 15 for extracting low temperature gas in the accommodating space 12 from the cold air outlet hole 15 .

In addition, the novel wafer type air conditioner further includes a cold guide seat 6 disposed in the casing 1 between the refrigerant chip 2 and the second fan 5. The cold guide seat 6 has a surrounding wall 61 and a majority a through hole 62 disposed on the surrounding wall 61, a plurality of sheets 63 protruding from the inner surface of the surrounding wall 61, and a defined by the sheet 63 and located in the surrounding wall 61 and communicating with the same An air flow passage 64 through which the aperture 62 communicates. The surrounding wall 61 has an inlet 611 facing the cold surface 21 of the refrigerant chip 2, and an outlet 612 facing the cold air output hole 15, the through holes 62 and the air inlet holes 13 of the casing 1. The same. The air flow passage 64 is meandered.

Referring to Figures 1 and 2, in use, when a cold room effect is to be generated in the room, the cold air outlet hole 15 of the wafer type air conditioner can be directed toward the room. The wafer type air conditioner is activated, and the first fan 4 and the second fan 5 start to operate. The heat generated when the refrigerant chip 2 is operated is transmitted to the heat conducting seat 31 and the heat sink 32 via the hot surface 22, and a portion thereof. Heat can pass through The air outlet 14 is dissipated outward, and another portion of the heat is outputted outwardly from the heating output hole 16 through the blowing of the first fan 4. The coldness generated by the cold surface 21 of the chilled wafer 2, while being operative with the second fan 5, can attract outside air to enter the cold runner 6 through the air inlets 13 and the through holes 62, Cooling heat is generated by the cold energy generated by the cold surface 21 of the refrigerant chip 2 to form cold air, and the cold air follows the air flow passage 64 and passes through the outlet 612 and is outwardly outputted by the cold air output hole 15 so that The room can produce a cold room effect.

In particular, since the cooling chiller 6 is cooled by contact with the cold surface 21 of the chilled wafer 2, and the airflow passage 64 is in a meandering shape, cold air and the cold runner 6 can be added. The contact time and the contact area of the cold face 21 of the wafer 2 are cooled, so that the coldness of the cold air outputted outward through the cold air outlet hole 15 can be increased.

Furthermore, if the warm room effect is to be generated in the room, the heating output hole 16 of the wafer type air conditioner is directed toward the room, so that the heat generated when the refrigerant chip 2 operates is transferred to the heat conduction via the hot face 22. The heat sink 32 and the heat sink 32 can dissipate a portion of the heat to the indoor space through the air outlets 14 , and the other portion of the heat is discharged from the heat output hole 16 through the blow of the first fan 4 . Indoor, to achieve the effect of the greenhouse.

Since the wafer type air conditioner does not require the use of a refrigerant compressor during the operation of outputting cold air or heating, it can reduce energy consumption and meet environmental protection requirements.

Referring to FIG. 4 again, the heat dissipation unit 3 in this embodiment may also include A penetrant (not shown), and a plurality of composite fins 34 for closely interposing in the fins 32, which are previously applied for and invented by the inventors, are disclosed. The new patent case No. M435811, so the detailed structure will not be described again. Please refer to the description and drawings of the case. The penetrant is applied to the contact of the composite fins 34 with the fins 32. The penetrating agent has high thermal conductivity and is tightly coupled between the composite heat sink 34 and the heat sinks 32, thereby greatly increasing the thermal conductivity, so that the heat energy is transmitted more smoothly, and the heat dissipation performance can be greatly improved.

In summary, the wafer type air conditioner of the present invention has the advantages of small volume and high heat dissipation efficiency due to the above-mentioned structural design, and therefore the overall volume of the wafer type air conditioner is also larger than that of the heat sink of the ceramic composite material. A similar product that is conventionally commercially available is small in size, and the heat dissipation efficiency of the wafer type air conditioner is also better than that of a conventionally marketed similar product. In addition, the heating output hole or the cold air output hole may be output to the room to output heating or cold air as needed to achieve the effect of a warm room or a cold room. In addition, since the wafer type air conditioner does not require the use of a compressor that uses a refrigerant, it can reduce energy consumption and meet environmental protection requirements. Therefore, the purpose of this new type can be achieved.

However, the above description is only for the embodiments of the present invention, and the scope of the present invention cannot be limited thereto, that is, the simple equivalent changes and modifications made by the present patent application scope and the contents of the patent specification are still It is within the scope of this new patent.

1‧‧‧Shell

11‧‧‧ shell wall

12‧‧‧ accommodating space

14‧‧‧ Vents

15‧‧‧Air outlet

16‧‧‧Heating output hole

2‧‧‧Cold wafer

21‧‧‧ cold noodles

22‧‧‧ Hot noodles

3‧‧‧heating unit

31‧‧‧heating seat

32‧‧‧ Heat sink

33‧‧‧Separate temperature seat

4‧‧‧First fan

5‧‧‧second fan

6‧‧‧Guide cooler

61‧‧‧ Around the wall

611‧‧‧ entrance

612‧‧‧Export

62‧‧‧through hole

63‧‧‧Sheet

Claims (5)

A wafer type air conditioner comprising: a casing having an inner accommodating space, a plurality of air inlet holes for inputting outside air into the accommodating space, and a gas for outputting the gas in the accommodating space a cooling air output hole, and a heating output hole for outputting the gas in the accommodating space; a uniform cold chip disposed in the accommodating space and having a cold surface facing the cold air output hole, and a heating surface facing the heating a heat surface of the output hole; a heat dissipating unit disposed in the accommodating space, the heat dissipating unit including a heat conducting seat for contacting the hot surface of the refrigerating wafer, and most of which are made of ceramic composite material and disposed a heat sink extending on the heat conducting seat and extending toward the heating output hole; a first fan disposed in the casing and located in the heating output hole for extracting high temperature gas in the accommodating space from the heating output hole And a second fan, the low temperature gas disposed in the casing and located in the cold air outlet hole for extracting the accommodating space is outputted by the cold air output hole. The wafer type air conditioner of claim 1, further comprising a cold guide seat disposed in the casing and located between the refrigerant chip and the second fan, the cold guide seat having a surrounding wall and a plurality of a through hole surrounding the wall, and an air flow passage formed in the surrounding wall and communicating with the through holes, the surrounding wall having a facing toward the cooling chip The inlet of the cold surface and an outlet facing the cold air outlet hole, the through holes are in communication with the air inlet holes, and the air flow passage is in a meander shape. The wafer type air conditioning apparatus according to claim 2, wherein the cold guide seat further has a plurality of sheets protruding from the inner surface of the surrounding wall to define the air flow passage. The wafer type air conditioner of claim 3, wherein the heat dissipating unit further comprises a space disposed between the inner surface of the casing and the refrigerating wafer for isolating the cold wafer from direct contact with the inner surface of the casing. Separated temperature seat. The wafer type air conditioner of claim 4, wherein the casing further has a plurality of air outlets located on an adjacent side of the heat dissipation unit.