BR9913619A - Processo para preparação de um polìmero de poliamida e poliamida preparada pela reação de uma lactona <244>,ß- insaturada e uma amina selecionada de um grupo constituìdo de rnh2, rnh3 + e suas misturas - Google Patents
Processo para preparação de um polìmero de poliamida e poliamida preparada pela reação de uma lactona <244>,ß- insaturada e uma amina selecionada de um grupo constituìdo de rnh2, rnh3 + e suas misturasInfo
- Publication number
- BR9913619A BR9913619A BR9913619-8A BR9913619A BR9913619A BR 9913619 A BR9913619 A BR 9913619A BR 9913619 A BR9913619 A BR 9913619A BR 9913619 A BR9913619 A BR 9913619A
- Authority
- BR
- Brazil
- Prior art keywords
- polymers
- polyamide
- rnh3
- rnh2
- mixtures
- Prior art date
Links
- 229920000642 polymer Polymers 0.000 title abstract 9
- 150000002596 lactones Chemical class 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 3
- 150000001412 amines Chemical class 0.000 title abstract 2
- 239000004952 Polyamide Substances 0.000 title 2
- 229920002647 polyamide Polymers 0.000 title 2
- 101100037762 Caenorhabditis elegans rnh-2 gene Proteins 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- -1 2(5H)-furanone Chemical class 0.000 abstract 1
- 150000003868 ammonium compounds Chemical class 0.000 abstract 1
- VIHAEDVKXSOUAT-UHFFFAOYSA-N but-2-en-4-olide Chemical compound O=C1OCC=C1 VIHAEDVKXSOUAT-UHFFFAOYSA-N 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 239000008394 flocculating agent Substances 0.000 abstract 1
- 239000000017 hydrogel Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 230000001453 nonthrombogenic effect Effects 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 abstract 1
- 150000003141 primary amines Chemical class 0.000 abstract 1
- 238000000746 purification Methods 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
- 230000002194 synthesizing effect Effects 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/5328—Conductive materials containing conductive organic materials or pastes, e.g. conductive adhesives, inks
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L27/00—Materials for grafts or prostheses or for coating grafts or prostheses
- A61L27/14—Macromolecular materials
- A61L27/18—Macromolecular materials obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61L—METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS OR SURGICAL ARTICLES
- A61L33/00—Antithrombogenic treatment of surgical articles, e.g. sutures, catheters, prostheses, or of articles for the manipulation or conditioning of blood; Materials for such treatment
- A61L33/06—Use of macromolecular materials
- A61L33/068—Use of macromolecular materials obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/04—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Veterinary Medicine (AREA)
- Materials Engineering (AREA)
- Epidemiology (AREA)
- Manufacturing & Machinery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Surgery (AREA)
- Dermatology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Transplantation (AREA)
- Wood Science & Technology (AREA)
- Hematology (AREA)
- Polyamides (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
PROCESSO PARA PREPARAçãO DE UM POLìMERO DE POLIAMIDA E POLIAMIDA PREPARADA PELA REAçãO DE UMA LACTONA <244>,<225>-INSATURADA E UMA AMINA SELECIONADA DE UM GRUPO CONSTITUìDO DE RNH~ 2~, RNH~ 3~^ +^ E SUAS MISTURAS Polímeros e processos para sintetizar polímeros, a partir de lactonas <244>,<225>-insaturadas, em particular 2(5H)-furanona, e aminas com cadeias laterais. Os polímeros são usados como hidrogéis, como polímeros que podem ligar metais e formar complexos que são solúveis em solventes orgânicos, como polímeros úteis como floculantes em purificação de água, como polímeros úteis sobre superfícies não incrustáveis para supressão de biofilmes, polímeros para uso em superfícies não trombogênicas e polímeros com usos como filmes condutores delgados, para microchips e outros dispositivos eletrónicos. O processo é uma reação de polimerização envolvendo a lactona cíclica <244>,<225>-insaturada e uma amina primária ou composto de amónio primário.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/159,305 US6153724A (en) | 1998-09-24 | 1998-09-24 | Preparation of cross-linked 2-dimensional polymers with sidedness from α,β-lactones |
PCT/US1999/021692 WO2000017254A1 (en) | 1998-09-24 | 1999-09-20 | PREPARATION OF CROSS-LINKED 2-DIMENSIONAL POLYMERS WITH SIDEDNESS FROM α,β-LACTONES |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9913619A true BR9913619A (pt) | 2001-10-09 |
Family
ID=22571993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9913619-8A BR9913619A (pt) | 1998-09-24 | 1999-09-20 | Processo para preparação de um polìmero de poliamida e poliamida preparada pela reação de uma lactona <244>,ß- insaturada e uma amina selecionada de um grupo constituìdo de rnh2, rnh3 + e suas misturas |
Country Status (14)
Country | Link |
---|---|
US (1) | US6153724A (pt) |
EP (1) | EP1124882B1 (pt) |
JP (1) | JP3448277B2 (pt) |
KR (1) | KR100423575B1 (pt) |
CN (1) | CN1211416C (pt) |
AT (1) | ATE302230T1 (pt) |
AU (1) | AU738224B2 (pt) |
BR (1) | BR9913619A (pt) |
CA (1) | CA2342857C (pt) |
DE (1) | DE69926780T2 (pt) |
ES (1) | ES2246581T3 (pt) |
IL (1) | IL142060A0 (pt) |
RU (1) | RU2226198C2 (pt) |
WO (1) | WO2000017254A1 (pt) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6399714B1 (en) * | 2000-09-27 | 2002-06-04 | Michigan Biotechnology Institute | Crosslinked polyamide |
US6495657B1 (en) * | 2000-10-27 | 2002-12-17 | Michigan Biotechnology Institute | Two dimensional polyamides prepared from unsaturated carboxylic acids and amines |
US20050043506A1 (en) * | 2000-09-27 | 2005-02-24 | Michigan Biotechnology Institute | Polyamide materials based on unsaturated carboxylic acids and amines |
US6797743B2 (en) | 2000-09-27 | 2004-09-28 | Michigan Biotechnology Institute | Antimicrobial polymer |
US6509104B2 (en) | 2000-12-05 | 2003-01-21 | Michigan Biotechnology Institute | Antithrombogenic polymer coating |
US6541601B1 (en) | 2001-11-27 | 2003-04-01 | Board Of Trustees Of Michigan State University | Unsaturated side chain polyamide polymers |
US6939554B2 (en) * | 2002-02-05 | 2005-09-06 | Michigan Biotechnology Institute | Antimicrobial polymer |
WO2003080730A1 (en) * | 2002-03-20 | 2003-10-02 | Michigan Biotechnology Institute | Conductive polymer-based material |
US6951902B2 (en) * | 2002-08-16 | 2005-10-04 | Michigan Biotechnology Institute | Two dimensional polymer that generates nitric oxide |
US8062729B2 (en) | 2005-01-14 | 2011-11-22 | Ndsu Research Foundation | Polymeric material with surface microdomains |
EP1879972A4 (en) * | 2005-05-09 | 2008-10-15 | Ndsu Res Foundation | ANTIFOULIN MATERIALS WITH POLYAMINE NETWORK POLYSILOXANES |
EP1913060A4 (en) * | 2005-07-29 | 2008-11-26 | Ndsu Res Foundation | FUNCTIONALIZED POLYSILOXANE POLYMERS |
DE102005049388A1 (de) * | 2005-10-15 | 2007-04-19 | Dechema Gesellschaft Für Chemische Technik Und Biotechnologie E.V. | Verfahren zur Vermeidung oder Verminderung von Biofilmen auf einer Oberfläche |
US7989074B2 (en) * | 2006-06-09 | 2011-08-02 | Ndsu Research Foundation | Thermoset siloxane-urethane fouling release coatings |
US8372384B2 (en) * | 2007-01-08 | 2013-02-12 | Ndsu Research Foundation | Quaternary ammonium functionalized cross-linked polyalkylsiloxanes with anti-fouling activity |
US8299200B2 (en) | 2007-06-11 | 2012-10-30 | Ndsu Research Foundation | Anchored polysiloxane-modified polyurethane coatings and uses thereof |
US8709394B2 (en) * | 2007-09-28 | 2014-04-29 | Ndsu Research Foundation | Antimicrobial polysiloxane materials containing metal species |
US20100004202A1 (en) * | 2008-02-15 | 2010-01-07 | Ndsu Research Foundation | Quaternary ammonium-functionalized-POSS compounds |
KR101653531B1 (ko) | 2014-10-24 | 2016-09-05 | 한국과학기술연구원 | 퓨란계 코폴리아미드의 제조방법 |
EP3504300A1 (en) | 2016-08-25 | 2019-07-03 | General Electric Company | Reduced fouling of hydrocarbon oil |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2274831A (en) * | 1939-07-20 | 1942-03-03 | Du Pont | Polyamides and process for their preparation |
US2691643A (en) * | 1950-11-15 | 1954-10-12 | Transparent Package Company | Preparation of polypeptides of beta-alanine |
US2786045A (en) * | 1953-01-21 | 1957-03-19 | Tee Pak Inc | Hydroxyacyl-amino acids and their polymers |
US2968629A (en) * | 1958-09-29 | 1961-01-17 | Universal Oil Prod Co | Method of inhibiting corrosion |
US3525718A (en) * | 1967-04-25 | 1970-08-25 | Celanese Corp | Process for the production of polyamide resin and product |
US5125929A (en) * | 1990-11-29 | 1992-06-30 | E. I. Du Pont De Nemours And Company | Fluorescent paper strength enhancing resin |
CA2049536C (en) * | 1991-05-13 | 1999-07-06 | Rawle I. Hollingsworth | Process for the preparation of 3,4-dihydroxybutanoic acid and salts thereof |
-
1998
- 1998-09-24 US US09/159,305 patent/US6153724A/en not_active Expired - Fee Related
-
1999
- 1999-09-20 BR BR9913619-8A patent/BR9913619A/pt not_active IP Right Cessation
- 1999-09-20 KR KR10-2001-7003201A patent/KR100423575B1/ko not_active IP Right Cessation
- 1999-09-20 DE DE69926780T patent/DE69926780T2/de not_active Expired - Fee Related
- 1999-09-20 IL IL14206099A patent/IL142060A0/xx unknown
- 1999-09-20 AU AU61539/99A patent/AU738224B2/en not_active Ceased
- 1999-09-20 ES ES99948335T patent/ES2246581T3/es not_active Expired - Lifetime
- 1999-09-20 AT AT99948335T patent/ATE302230T1/de not_active IP Right Cessation
- 1999-09-20 EP EP99948335A patent/EP1124882B1/en not_active Expired - Lifetime
- 1999-09-20 JP JP2000574160A patent/JP3448277B2/ja not_active Expired - Fee Related
- 1999-09-20 CA CA002342857A patent/CA2342857C/en not_active Expired - Fee Related
- 1999-09-20 WO PCT/US1999/021692 patent/WO2000017254A1/en active IP Right Grant
- 1999-09-20 RU RU2001107965/04A patent/RU2226198C2/ru not_active IP Right Cessation
- 1999-09-20 CN CNB99811409XA patent/CN1211416C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
AU738224B2 (en) | 2001-09-13 |
US6153724A (en) | 2000-11-28 |
DE69926780T2 (de) | 2006-02-02 |
WO2000017254A1 (en) | 2000-03-30 |
CN1211416C (zh) | 2005-07-20 |
ATE302230T1 (de) | 2005-09-15 |
AU6153999A (en) | 2000-04-10 |
CA2342857A1 (en) | 2000-03-30 |
ES2246581T3 (es) | 2006-02-16 |
EP1124882B1 (en) | 2005-08-17 |
KR100423575B1 (ko) | 2004-03-22 |
CN1320136A (zh) | 2001-10-31 |
CA2342857C (en) | 2004-06-22 |
EP1124882A4 (en) | 2004-04-21 |
IL142060A0 (en) | 2002-03-10 |
KR20010079806A (ko) | 2001-08-22 |
EP1124882A1 (en) | 2001-08-22 |
RU2226198C2 (ru) | 2004-03-27 |
JP3448277B2 (ja) | 2003-09-22 |
JP2002526577A (ja) | 2002-08-20 |
DE69926780D1 (de) | 2005-09-22 |
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Legal Events
Date | Code | Title | Description |
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B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A E 8A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1914 DE 11/09/2007. |