BR9713235A - Suporte de dados para a memorização de dados binários e processo para a produção do suporte de dados. - Google Patents

Suporte de dados para a memorização de dados binários e processo para a produção do suporte de dados.

Info

Publication number
BR9713235A
BR9713235A BR9713235-7A BR9713235A BR9713235A BR 9713235 A BR9713235 A BR 9713235A BR 9713235 A BR9713235 A BR 9713235A BR 9713235 A BR9713235 A BR 9713235A
Authority
BR
Brazil
Prior art keywords
data
data carrier
layer
tin
production
Prior art date
Application number
BR9713235-7A
Other languages
English (en)
Portuguese (pt)
Inventor
Franz Kohnle
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR9713235A publication Critical patent/BR9713235A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)
BR9713235-7A 1996-09-27 1997-09-11 Suporte de dados para a memorização de dados binários e processo para a produção do suporte de dados. BR9713235A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1996141219 DE19641219C1 (de) 1996-09-27 1996-09-27 Datenträger zur Speicherung von Daten und Verfahren zur Herstellung des Datenträgers
PCT/EP1997/004965 WO1998013533A1 (de) 1996-09-27 1997-09-11 Datenträger zur speicherung von binärdaten und verfahren zur herstellung des datenträgers

Publications (1)

Publication Number Publication Date
BR9713235A true BR9713235A (pt) 2000-04-04

Family

ID=7808024

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9713235-7A BR9713235A (pt) 1996-09-27 1997-09-11 Suporte de dados para a memorização de dados binários e processo para a produção do suporte de dados.

Country Status (5)

Country Link
CN (1) CN1212733A (de)
BR (1) BR9713235A (de)
DE (1) DE19641219C1 (de)
TW (1) TW358920B (de)
WO (1) WO1998013533A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010035606A1 (de) * 2010-08-27 2012-03-01 Albert-Ludwigs-Universität Freiburg Verfahren zum Herstellen einer Mikrostruktur, Mikrostruktur und fluidische Plattform
EP2431923A1 (de) * 2010-09-20 2012-03-21 Printechnologics GmbH Elektrolythaltiger Informationsträger
KR101823285B1 (ko) * 2014-01-13 2018-01-29 쑹화 쑨 무-시안 구리 예비도금 전기도금액 및 이의 제조방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952237B2 (ja) * 1981-10-14 1984-12-18 キザイ株式会社 錫−亜鉛合金めつき浴
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
DE4438799A1 (de) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen

Also Published As

Publication number Publication date
TW358920B (en) 1999-05-21
WO1998013533A1 (de) 1998-04-02
DE19641219C1 (de) 1998-02-12
CN1212733A (zh) 1999-03-31

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08G Application fees: restoration [chapter 8.7 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/09/1997, OBSERVADAS AS CONDICOES LEGAIS.

B15K Others concerning applications: alteration of classification

Free format text: ALTERADA A CLASSIFICACAO DE C23C 18/16 E G06K 19/067 PARA INT. CL. 2012.01 G06K 19/067 E C23C 18/16

Ipc: G06K 19/067 (2006.01), C23C 18/16 (2006.01)

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time
B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)