BR9304546A - Processo para deposição química seguida da deposição eletrolítica de metais sobre alumina - Google Patents
Processo para deposição química seguida da deposição eletrolítica de metais sobre aluminaInfo
- Publication number
- BR9304546A BR9304546A BR9304546A BR9304546A BR9304546A BR 9304546 A BR9304546 A BR 9304546A BR 9304546 A BR9304546 A BR 9304546A BR 9304546 A BR9304546 A BR 9304546A BR 9304546 A BR9304546 A BR 9304546A
- Authority
- BR
- Brazil
- Prior art keywords
- deposition
- alumina
- metals
- followed
- electrolytic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5338—Etching
- C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1865—Heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9304546A BR9304546A (pt) | 1993-11-19 | 1993-11-19 | Processo para deposição química seguida da deposição eletrolítica de metais sobre alumina |
EP19950900029 EP0680523B1 (en) | 1993-11-19 | 1994-11-18 | Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
DE69422978T DE69422978D1 (de) | 1993-11-19 | 1994-11-18 | Vorbehandlung von keramischen aluminiumoxidoberflächen zur stromlosen und elektrochemischen metallplattierung |
PCT/BR1994/000039 WO1995014116A1 (en) | 1993-11-19 | 1994-11-18 | Preparation of alumina ceramic surfaces for electroless and electrochemical metal deposition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9304546A BR9304546A (pt) | 1993-11-19 | 1993-11-19 | Processo para deposição química seguida da deposição eletrolítica de metais sobre alumina |
Publications (1)
Publication Number | Publication Date |
---|---|
BR9304546A true BR9304546A (pt) | 1995-08-01 |
Family
ID=4057688
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR9304546A BR9304546A (pt) | 1993-11-19 | 1993-11-19 | Processo para deposição química seguida da deposição eletrolítica de metais sobre alumina |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0680523B1 (pt) |
BR (1) | BR9304546A (pt) |
DE (1) | DE69422978D1 (pt) |
WO (1) | WO1995014116A1 (pt) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SG48729A1 (en) * | 1993-05-14 | 1998-05-18 | Kyokawa Mekki Kogyo Kk | Metal film resistor having fuse function and method for producing the same |
US6692976B1 (en) * | 2000-08-31 | 2004-02-17 | Agilent Technologies, Inc. | Post-etch cleaning treatment |
JP2005022956A (ja) * | 2003-07-02 | 2005-01-27 | Rohm & Haas Electronic Materials Llc | セラミックの金属化 |
EP2381015B1 (en) | 2005-08-12 | 2019-01-16 | Modumetal, Inc. | Compositionally modulated composite materials |
US8121692B2 (en) | 2006-08-30 | 2012-02-21 | Cardiac Pacemakers, Inc. | Method and apparatus for neural stimulation with respiratory feedback |
US8050765B2 (en) | 2006-08-30 | 2011-11-01 | Cardiac Pacemakers, Inc. | Method and apparatus for controlling neural stimulation during disordered breathing |
CA2764887C (en) | 2009-06-08 | 2018-09-11 | Modumetal Llc | Electrodeposited, nanolaminate coatings and claddings for corrosion protection |
CA2905536C (en) | 2013-03-15 | 2023-03-07 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
WO2014146117A2 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
CN105283587B (zh) | 2013-03-15 | 2019-05-10 | 莫杜美拓有限公司 | 纳米叠层涂层 |
CN105189828B (zh) | 2013-03-15 | 2018-05-15 | 莫杜美拓有限公司 | 具有高硬度的镍铬纳米层压涂层 |
BR112017005534A2 (pt) | 2014-09-18 | 2017-12-05 | Modumetal Inc | métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva |
EP3194642A4 (en) | 2014-09-18 | 2018-07-04 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
AR109584A1 (es) | 2016-09-08 | 2018-12-26 | Modumetal Inc | Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos |
US11293272B2 (en) | 2017-03-24 | 2022-04-05 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
CN110770372B (zh) | 2017-04-21 | 2022-10-11 | 莫杜美拓有限公司 | 具有电沉积涂层的管状制品及其生产系统和方法 |
CN112272717B (zh) | 2018-04-27 | 2024-01-05 | 莫杜美拓有限公司 | 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法 |
CN115474345B (zh) * | 2022-09-14 | 2023-04-28 | 东华大学 | 基于丝网印刷和化学沉积的陶瓷织物电路制作方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62265191A (ja) * | 1986-05-12 | 1987-11-18 | 日立化成工業株式会社 | セラミツク配線板の製造法 |
EP0284626B1 (en) * | 1986-09-30 | 1992-03-04 | Macdermid, Incorporated | Process for metallizing non-conductive substrates |
-
1993
- 1993-11-19 BR BR9304546A patent/BR9304546A/pt not_active IP Right Cessation
-
1994
- 1994-11-18 EP EP19950900029 patent/EP0680523B1/en not_active Expired - Lifetime
- 1994-11-18 DE DE69422978T patent/DE69422978D1/de not_active Expired - Lifetime
- 1994-11-18 WO PCT/BR1994/000039 patent/WO1995014116A1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0680523B1 (en) | 2000-02-09 |
WO1995014116A1 (en) | 1995-05-26 |
EP0680523A1 (en) | 1995-11-08 |
DE69422978D1 (de) | 2000-03-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCP | Transfer pending | ||
PC | Transfer |
Free format text: FUNDACAO CPQD - CENTRO DE PESQUISA E DESENVOLVIMENTO EM TELECOMUNICACOES (BR) |
|
FF | Decision: granting | ||
FG9A | Patent or certificate of addition granted | ||
B21A | Expiry acc. art. 78, item i of ipl- expiry of the term of protection |
Free format text: PATENTE EXTINTA EM 19/11/2013 |