BR9302933A - Arquitetura de linha de fabricacao,totalmente automatizada e computadorizada baseada em transportadoras dotada de aparelho de interface pressurizado para transferir uma peca de trabalho a ser processada;recipientes pressurizados vedaveis e transportaveis e aparelho de expedicao com sistema de distribuicao de gas para manusear e armazenar os mesmos - Google Patents

Arquitetura de linha de fabricacao,totalmente automatizada e computadorizada baseada em transportadoras dotada de aparelho de interface pressurizado para transferir uma peca de trabalho a ser processada;recipientes pressurizados vedaveis e transportaveis e aparelho de expedicao com sistema de distribuicao de gas para manusear e armazenar os mesmos

Info

Publication number
BR9302933A
BR9302933A BR9302933A BR9302933A BR9302933A BR 9302933 A BR9302933 A BR 9302933A BR 9302933 A BR9302933 A BR 9302933A BR 9302933 A BR9302933 A BR 9302933A BR 9302933 A BR9302933 A BR 9302933A
Authority
BR
Brazil
Prior art keywords
carriers
processed
transfer
piece
work
Prior art date
Application number
BR9302933A
Other languages
English (en)
Portuguese (pt)
Inventor
Georges Garric
Andre Lafond
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP92480110A external-priority patent/EP0582017B1/en
Priority claimed from EP92480112A external-priority patent/EP0582019B1/en
Priority claimed from EP92480109A external-priority patent/EP0582016B1/en
Priority claimed from EP92480111A external-priority patent/EP0582018B1/en
Application filed by Ibm filed Critical Ibm
Publication of BR9302933A publication Critical patent/BR9302933A/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1902—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3216—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404—Storage means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Library & Information Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
BR9302933A 1992-08-04 1993-07-21 Arquitetura de linha de fabricacao,totalmente automatizada e computadorizada baseada em transportadoras dotada de aparelho de interface pressurizado para transferir uma peca de trabalho a ser processada;recipientes pressurizados vedaveis e transportaveis e aparelho de expedicao com sistema de distribuicao de gas para manusear e armazenar os mesmos BR9302933A (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP92480110A EP0582017B1 (en) 1992-08-04 1992-08-04 Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers
EP92480112A EP0582019B1 (en) 1992-08-04 1992-08-04 Fully automated and computerized conveyor based manufacturing line architectures adapted to pressurized sealable transportable containers
EP92480109A EP0582016B1 (en) 1992-08-04 1992-08-04 Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment
EP92480111A EP0582018B1 (en) 1992-08-04 1992-08-04 Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment

Publications (1)

Publication Number Publication Date
BR9302933A true BR9302933A (pt) 1994-03-15

Family

ID=27442478

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9302933A BR9302933A (pt) 1992-08-04 1993-07-21 Arquitetura de linha de fabricacao,totalmente automatizada e computadorizada baseada em transportadoras dotada de aparelho de interface pressurizado para transferir uma peca de trabalho a ser processada;recipientes pressurizados vedaveis e transportaveis e aparelho de expedicao com sistema de distribuicao de gas para manusear e armazenar os mesmos

Country Status (3)

Country Link
KR (1) KR970006725B1 (mo)
BR (1) BR9302933A (mo)
TW (1) TW224182B (mo)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004021413A1 (en) * 2002-08-31 2004-03-11 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
KR101688620B1 (ko) 2015-12-24 2016-12-21 피코앤테라(주) 웨이퍼 수납용기
JP6693356B2 (ja) * 2016-09-09 2020-05-13 株式会社ダイフク 物品搬送装置
CN108107672B (zh) 2016-11-25 2021-03-02 上海微电子装备（集团）股份有限公司 一种掩模版版盒
TWI781800B (zh) * 2021-10-22 2022-10-21 銓發科技股份有限公司 束帶儲存裝置及其儲存盤

Also Published As

Publication number Publication date
KR940005476A (ko) 1994-03-21
KR970006725B1 (ko) 1997-04-29
TW224182B (mo) 1994-05-21

Similar Documents

Publication Publication Date Title
DE69100283D1 (de) Nippel bestimmt zum Zusammenwirken mit mehreren Kupplungsbestandteilen.
SE8402122D0 (sv) Manipulator for samverkan med en industrirobot
BR8303077A (pt) Aparelho e processo em combinacao com uma fileira de bobinadeiras, para agarrar artigo
FI865265A0 (fi) Anordning foer alstrande av energi med hjaelp av variationer i en vaetskeyta.
EP0263169A4 (en) Robot with workpiece feeder and holder.
EP0618131A3 (en) Two-hull boat with hydrofoils.
BR9302933A (pt) Arquitetura de linha de fabricacao,totalmente automatizada e computadorizada baseada em transportadoras dotada de aparelho de interface pressurizado para transferir uma peca de trabalho a ser processada;recipientes pressurizados vedaveis e transportaveis e aparelho de expedicao com sistema de distribuicao de gas para manusear e armazenar os mesmos
DE68910810D1 (de) Anlage mit angetriebenen kugeln und deck.
DK30185D0 (da) Ventil med stroemkraftkompensator
DK156091C (da) Moetrik bestemt til at anbringes i en aaben profilskinne.
BR9105857A (pt) Integron de corinebacteria,processo de transformacao de uma cepa de bacteria com corineforma e corinebacteria
DE3671472D1 (de) Lanze zum blasen und frischen im konverter.
IT8621460A0 (it) Corpo di unione di forma a blocco a piatta adatto per essere equipaggiato in particolare con valvole o simili componenti.
DK0479884T3 (da) Kraftværk med fluid-bed forbrændingsreaktor
FI890252A0 (fi) Paineistetulla leijukerrospalamisella toimiva voimala
BR8901166A (pt) Processo para acionar uma ferramenta hidraulica submersa,conversor de energia,e navio para realizacao do processo
IT206970Z2 (it) Pezzi di raccordo in particolare tubazioni e valvole.
ES516493A0 (es) "metodo y dispositivo para hacer minimo el consumo de energia al reducir oxido de hierro con gases reductores".
IT1193482B (it) Torretta portautensili girevole con riduttore epicicloidale per torni e simili
BR8907579A (pt) Processo para tratamento de camada de oxido de metal,processo para ligar objeto de metal a segundo objeto e estrutura de objeto de metal
IT8430680V0 (it) Cerniera per infissi con organi ricoperti in materia plastica atti a resistere ad agenti corrosivi.
DK201686D0 (da) Anlaeg til at forsyne en manipulator med arbejdsstykker
Singh et al. Relation between temperature and biogas production.
Patchett Development of a national policy for water quality monitoring in Papua New Guinea
IT8622637A0 (it) Inceneritore a pulitura facilitata in particolare per impieghi domestici e/o industriali.

Legal Events

Date Code Title Description
EE Request for examination
FB36 Technical and formal requirements: requirement - article 36 of industrial property law
FA8 Dismissal: dismissal - article 36, par. 1 of industrial property law