BR8702377A - Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas - Google Patents

Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas

Info

Publication number
BR8702377A
BR8702377A BR8702377A BR8702377A BR8702377A BR 8702377 A BR8702377 A BR 8702377A BR 8702377 A BR8702377 A BR 8702377A BR 8702377 A BR8702377 A BR 8702377A BR 8702377 A BR8702377 A BR 8702377A
Authority
BR
Brazil
Prior art keywords
healing
inducable
composition
position fixed
agent additive
Prior art date
Application number
BR8702377A
Other languages
English (en)
Inventor
Glenn Gilbert Eagle
Original Assignee
American Cyanamid Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP87106432A priority Critical patent/EP0289632A1/en
Priority to AU72500/87A priority patent/AU609393B2/en
Application filed by American Cyanamid Co filed Critical American Cyanamid Co
Priority to BR8702377A priority patent/BR8702377A/pt
Priority to JP62125035A priority patent/JP2558281B2/ja
Publication of BR8702377A publication Critical patent/BR8702377A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
BR8702377A 1987-05-04 1987-05-11 Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas BR8702377A (pt)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP87106432A EP0289632A1 (en) 1987-05-04 1987-05-04 High green strength induction curable adhesives
AU72500/87A AU609393B2 (en) 1987-05-04 1987-05-05 Induction curable epoxy adhesives and curing agents
BR8702377A BR8702377A (pt) 1987-05-04 1987-05-11 Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas
JP62125035A JP2558281B2 (ja) 1987-05-04 1987-05-23 高い生強度を有する誘導硬化性接着剤

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP87106432A EP0289632A1 (en) 1987-05-04 1987-05-04 High green strength induction curable adhesives
BR8702377A BR8702377A (pt) 1987-05-04 1987-05-11 Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas

Publications (1)

Publication Number Publication Date
BR8702377A true BR8702377A (pt) 1988-11-29

Family

ID=25664193

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8702377A BR8702377A (pt) 1987-05-04 1987-05-11 Aditivo de agente de cura,composicao de adesivo curavel por inducao e processo para posicionar fixas pecas metalicas

Country Status (4)

Country Link
EP (1) EP0289632A1 (pt)
JP (1) JP2558281B2 (pt)
AU (1) AU609393B2 (pt)
BR (1) BR8702377A (pt)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2684387A1 (fr) * 1991-11-29 1993-06-04 Bostik Sa Systemes pour adhesifs thermofusibles reticulables, leur preparation et procede d'assemblage les utilisant.
US6696147B1 (en) 1992-04-16 2004-02-24 Thyssenkrupp Budd Company Beaded adhesive and flanged part made therefrom
US6074506A (en) * 1992-04-16 2000-06-13 The Budd Company Method of bonding using non-compressible beads
US5470416A (en) * 1992-04-16 1995-11-28 The Budd Company Bonding method using mixture of adhesive and non-compressible beads
EP0700337B1 (en) * 1993-05-25 2002-11-20 Lord Corporation Method for obtaining mechanical lock between surfaces
EP0737225B1 (en) * 1993-10-13 2001-12-12 E.I. Du Pont De Nemours And Company Polyamide compositions toughened with waste plasticized polyvinylbutyral
US6228133B1 (en) 1998-05-01 2001-05-08 3M Innovative Properties Company Abrasive articles having abrasive layer bond system derived from solid, dry-coated binder precursor particles having a fusible, radiation curable component
US6057382A (en) * 1998-05-01 2000-05-02 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
US6136398A (en) * 1998-05-01 2000-10-24 3M Innovative Properties Company Energy cured sealant composition
US6274643B1 (en) 1998-05-01 2001-08-14 3M Innovative Properties Company Epoxy/thermoplastic photocurable adhesive composition
US6077601A (en) 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
GB9817799D0 (en) * 1998-08-14 1998-10-14 Dow Deutschland Inc Viscosity modifier for thermosetting resin compositioning
DE19856254A1 (de) * 1998-12-07 2000-06-08 Freudenberg Carl Fa Klebstoffpulver
EP1226742B1 (en) 1999-11-03 2006-12-27 Nexicor, LLC Hand held induction tool
DE60013181T2 (de) 1999-12-20 2005-08-11 3M Innovative Properties Co., Saint Paul Bei umgebungstemperatur stabiler und einkomponentiger härtbarer epoxidharzklebstoff
CA2351963A1 (en) * 2000-07-18 2002-01-18 Illinois Tool Works Inc. One-part, heat cured epoxy adhesive
US6888257B2 (en) * 2002-06-28 2005-05-03 Lord Corporation Interface adhesive
US7358289B2 (en) 2002-10-22 2008-04-15 3M Innovative Properties Company Heat-curable adhesive composition
US20040191523A1 (en) * 2003-03-24 2004-09-30 Jihong Kye Reactive hot melt adhesive formulation for joining stamped metal and plastic parts
JP4691878B2 (ja) * 2003-06-23 2011-06-01 ナガセケムテックス株式会社 接着剤組成物
JP4529534B2 (ja) * 2004-04-28 2010-08-25 東レ株式会社 繊維強化複合材料用熱硬化性樹脂組成物
US20080029214A1 (en) * 2006-08-04 2008-02-07 Zephyros, Inc. Multiple or single stage cure adhesive material and method of use
EP2119737B1 (en) * 2008-05-15 2011-05-04 Evonik Degussa GmbH Electronic packaging
DE102019209754A1 (de) 2019-07-03 2021-01-07 Tesa Se Thermisch härtender Klebstoff und daraus hergestelltes Klebeband

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1233838A (fr) * 1958-08-26 1960-10-12 Degussa Procédé pour coller des métaux
JPS4948800A (pt) * 1972-09-12 1974-05-11
US4332713A (en) * 1979-11-09 1982-06-01 Ciba-Geigy Corporation Liquid or pasty thermosetting adhesive which can be pre-gelled and which is based on epoxide resin, and the use of this adhesive
DE3229657A1 (de) * 1982-08-09 1984-02-09 Henkel KGaA, 4000 Düsseldorf Pastoese, vorgelierbare, waermehaertbare epoxidharz-klebstoffe
US4435549A (en) * 1983-01-24 1984-03-06 W. R. Grace & Co. N-Cyano amide compositions and adducts thereof
US4459398A (en) * 1983-05-27 1984-07-10 General Motors Corporation High strength one-part epoxy adhesive composition
US4521583A (en) * 1984-02-09 1985-06-04 American Cyanamid Company Curable epoxy resin compositions
NZ212747A (en) * 1984-07-17 1989-01-27 Dow Chemical Co Partially advanced epoxy resin compositions
CA1259897A (en) * 1985-04-02 1989-09-26 Madan M. Bagga Bonding process using curable epoxide resin adhesive

Also Published As

Publication number Publication date
JPS63301283A (ja) 1988-12-08
AU7250087A (en) 1988-11-10
JP2558281B2 (ja) 1996-11-27
EP0289632A1 (en) 1988-11-09
AU609393B2 (en) 1991-05-02

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FF Decision: intention to grant
FG Letter patent granted
B21A Expiry acc. art. 78, item i of ipl- expiry of the term of protection

Free format text: PATENTE EXTINTA EM 11/05/2002

B15K Others concerning applications: alteration of classification

Ipc: C08L 63/00 (2006.01), C08G 59/22 (2006.0