BR8600049A - Capacitor plano de desacoplamento e processo de manufatura do mesmo - Google Patents
Capacitor plano de desacoplamento e processo de manufatura do mesmoInfo
- Publication number
- BR8600049A BR8600049A BR8600049A BR8600049A BR8600049A BR 8600049 A BR8600049 A BR 8600049A BR 8600049 A BR8600049 A BR 8600049A BR 8600049 A BR8600049 A BR 8600049A BR 8600049 A BR8600049 A BR 8600049A
- Authority
- BR
- Brazil
- Prior art keywords
- same
- manufacturing process
- disconnection plan
- capacitor disconnection
- capacitor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10924—Leads formed from a punched metal foil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/690,117 US4584627A (en) | 1985-01-09 | 1985-01-09 | Flat decoupling capacitor and method of manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8600049A true BR8600049A (pt) | 1986-09-23 |
Family
ID=24771171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8600049A BR8600049A (pt) | 1985-01-09 | 1986-01-08 | Capacitor plano de desacoplamento e processo de manufatura do mesmo |
Country Status (7)
Country | Link |
---|---|
US (1) | US4584627A (pt) |
BE (1) | BE903985A (pt) |
BR (1) | BR8600049A (pt) |
DE (1) | DE3600447A1 (pt) |
FR (1) | FR2575859B1 (pt) |
GB (1) | GB2169448B (pt) |
IT (1) | IT1188233B (pt) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667267A (en) * | 1985-01-22 | 1987-05-19 | Rogers Corporation | Decoupling capacitor for pin grid array package |
US4734819A (en) * | 1985-12-20 | 1988-03-29 | Rogers Corporation | Decoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array package |
GB8706610D0 (en) * | 1987-03-19 | 1987-04-23 | Smith Ind Plc | Electrical components |
USRE35064E (en) * | 1988-08-01 | 1995-10-17 | Circuit Components, Incorporated | Multilayer printed wiring board |
US4853826A (en) * | 1988-08-01 | 1989-08-01 | Rogers Corporation | Low inductance decoupling capacitor |
EP0380237A1 (en) * | 1989-01-23 | 1990-08-01 | Seiko Electronic Components Ltd. | Power source unit |
US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5079069A (en) * | 1989-08-23 | 1992-01-07 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5161086A (en) * | 1989-08-23 | 1992-11-03 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
US5270488A (en) * | 1990-07-27 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Shield construction for electrical devices |
JP2745933B2 (ja) * | 1992-02-17 | 1998-04-28 | 日本電気株式会社 | Tab−集積回路 |
US5800575A (en) * | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
US5261153A (en) * | 1992-04-06 | 1993-11-16 | Zycon Corporation | In situ method for forming a capacitive PCB |
US5422782A (en) * | 1992-11-24 | 1995-06-06 | Circuit Components Inc. | Multiple resonant frequency decoupling capacitor |
DE19812836A1 (de) * | 1998-03-24 | 1999-09-30 | Pemetzrieder Neosid | Induktives Miniatur-Bauelement für SMD-Montage |
AU1198700A (en) * | 1999-03-16 | 2000-10-04 | Maxwell Energy Products | Low inductance four terminal capacitor lead frame |
JP4161589B2 (ja) * | 2002-02-20 | 2008-10-08 | 株式会社日立製作所 | 低電圧用コンデンサ |
US20060158828A1 (en) * | 2004-12-21 | 2006-07-20 | Amey Daniel I Jr | Power core devices and methods of making thereof |
KR20070016383A (ko) * | 2005-08-03 | 2007-02-08 | 삼성전자주식회사 | 칩형 전기 소자 및 이를 포함하는 액정 표시 모듈 |
US7633739B2 (en) * | 2007-05-24 | 2009-12-15 | Daniel Devoe | Stacked multilayer capacitor |
US8289675B2 (en) * | 2007-05-24 | 2012-10-16 | Daniel Devoe | Stacked multilayer capacitor |
KR102142516B1 (ko) * | 2018-09-04 | 2020-08-07 | 삼성전기주식회사 | 전자 부품 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3665256A (en) * | 1968-10-15 | 1972-05-23 | Rca Corp | Heat dissipation for power integrated circuits |
US3590348A (en) * | 1969-12-29 | 1971-06-29 | Erie Technological Prod Inc | Radial lead ceramic capacitor with integral standoff feet |
US3710210A (en) * | 1972-04-13 | 1973-01-09 | Sprague Electric Co | Electrical component having an attached lead assembly |
US4038488A (en) * | 1975-05-12 | 1977-07-26 | Cambridge Memories, Inc. | Multilayer ceramic multi-chip, dual in-line packaging assembly |
US4151579A (en) * | 1977-09-09 | 1979-04-24 | Avx Corporation | Chip capacitor device |
US4514750A (en) * | 1982-01-11 | 1985-04-30 | Texas Instruments Incorporated | Integrated circuit package having interconnected leads adjacent the package ends |
FR2536901A1 (fr) * | 1982-11-26 | 1984-06-01 | Europ Composants Electron | Condensateur multi-couches de puissance |
US4511951A (en) * | 1983-11-14 | 1985-04-16 | Rogers Corporation | Multilayer decoupling capacitor and method of manufacture thereof |
US4497012A (en) * | 1983-11-14 | 1985-01-29 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
-
1985
- 1985-01-09 US US06/690,117 patent/US4584627A/en not_active Expired - Fee Related
-
1986
- 1986-01-06 BE BE0/216096A patent/BE903985A/fr not_active IP Right Cessation
- 1986-01-07 FR FR868600125A patent/FR2575859B1/fr not_active Expired
- 1986-01-08 GB GB8600324A patent/GB2169448B/en not_active Expired
- 1986-01-08 IT IT19025/86A patent/IT1188233B/it active
- 1986-01-08 BR BR8600049A patent/BR8600049A/pt unknown
- 1986-01-09 DE DE19863600447 patent/DE3600447A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2169448A (en) | 1986-07-09 |
IT8619025A0 (it) | 1986-01-08 |
DE3600447A1 (de) | 1986-07-17 |
IT1188233B (it) | 1988-01-07 |
BE903985A (fr) | 1986-05-02 |
FR2575859A1 (fr) | 1986-07-11 |
GB8600324D0 (en) | 1986-02-12 |
FR2575859B1 (fr) | 1989-04-14 |
GB2169448B (en) | 1989-05-10 |
US4584627A (en) | 1986-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR8600049A (pt) | Capacitor plano de desacoplamento e processo de manufatura do mesmo | |
BR8802677A (pt) | Aplicador de medicamento percutaneo e processo de fabricacao do mesmo | |
DE3786900T2 (de) | Optischer Verbinder und dessen Herstellungsverfahren. | |
BR8804926A (pt) | Dispositivo de filtracao e processo de fabricacao do mesmo | |
BR8601577A (pt) | Maquina dinamoeletrica e processo de sua producao | |
BR8801241A (pt) | Fusivel limitador de corrente e processo de fabricacao do mesmo | |
BR8303426A (pt) | Capacitor de desacoplamento e processo de sua fabricacao | |
BR8401746A (pt) | Estojo de cosmetico e processo de utilizacao do mesmo | |
BR8605826A (pt) | Unidade vitrificada multipla e processo de sua fabricacao | |
BR8405808A (pt) | Capacitor de desacoplamento e processo de manufatura do mesmo | |
BR8501937A (pt) | Resistor linear dependente de tensao e processo de fabricar o mesmo | |
PT82896A (pt) | Unidade de altifalantes e seu processo de fabrico | |
BR8606969A (pt) | Perfluoropolieteres e processo de preparacao dos mesmos e de oxido de perfluoropolimetileno | |
BR8405805A (pt) | Capacitor de desacoplamento e processo de manufatura do mesmo | |
BR8805716A (pt) | Processo de fabricacao de embolo articulado e embolo articulado | |
BR8706159A (pt) | Copoliester contendo silicio e processo de producao do mesmo | |
BR8606668A (pt) | Protetor de incontinencia e processo para fabricacao do mesmo | |
IT8619723A0 (it) | Condensatore di disaccoppiamento erelativo procedimento di fabbricazione. | |
BR8800800A (pt) | Conjunto de mangueira e processo de sua fabricacao | |
BR8405810A (pt) | Capacitor de desacoplamento e processo de manufatura do mesmo | |
BR8600904A (pt) | Estrutura de tubulacao e processo de fabricacao de tubulacao | |
BR8405804A (pt) | Capacitor de desacoplamento e processo de fabricacao do mesmo | |
BR8602008A (pt) | Capacitor de desacoplamento e processo de sua formacao | |
BR8802097A (pt) | Processo de combustao e aparelhagem de combustao | |
BR8706678A (pt) | Processo para a fabricacao de querosene e ou gasoleo(s) |