BR8302607U - Placa condutora com ligação de conector - Google Patents

Placa condutora com ligação de conector

Info

Publication number
BR8302607U
BR8302607U BR8302607-0U BR8302607U BR8302607U BR 8302607 U BR8302607 U BR 8302607U BR 8302607 U BR8302607 U BR 8302607U BR 8302607 U BR8302607 U BR 8302607U
Authority
BR
Brazil
Prior art keywords
connector
connection
contact points
bond
conductive
Prior art date
Application number
BR8302607-0U
Other languages
English (en)
Portuguese (pt)
Inventor
Janos-Gerold Enderlein
Bernd Kaiser
Joerg Romahn
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR8302607U publication Critical patent/BR8302607U/pt

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R27/00Coupling parts adapted for co-operation with two or more dissimilar counterparts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0295Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09372Pads and lands
    • H05K2201/09409Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
BR8302607-0U 2002-11-01 2003-10-31 Placa condutora com ligação de conector BR8302607U (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217114U DE20217114U1 (de) 2002-11-01 2002-11-01 Leiterplatte mit Steckeranschluß

Publications (1)

Publication Number Publication Date
BR8302607U true BR8302607U (pt) 2005-06-07

Family

ID=7976676

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8302607-0U BR8302607U (pt) 2002-11-01 2003-10-31 Placa condutora com ligação de conector

Country Status (7)

Country Link
KR (1) KR200344358Y1 (es)
CN (1) CN2671288Y (es)
BR (1) BR8302607U (es)
DE (1) DE20217114U1 (es)
ES (1) ES1055993Y (es)
FR (1) FR2846844B3 (es)
IT (1) ITMI20030496U1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20219377U1 (de) 2002-12-09 2003-03-06 Siemens AG, 80333 München Leiterplatte mit Steckeranschluss

Also Published As

Publication number Publication date
CN2671288Y (zh) 2005-01-12
KR200344358Y1 (ko) 2004-03-10
ES1055993U (es) 2004-02-16
FR2846844A3 (fr) 2004-05-07
ES1055993Y (es) 2004-06-01
ITMI20030496U1 (it) 2004-05-02
FR2846844B3 (fr) 2004-10-08
DE20217114U1 (de) 2003-01-30
ITMI20030496V0 (it) 2003-10-28

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A ANUIDADE

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 DA RPI 1995 DE 31/03/2009.

B15K Others concerning applications: alteration of classification

Ipc: H01R 12/72 (2011.01), H01R 27/00 (2006.01), H05K 1