BR8106873A - Processo de producao de um modulo de ceramica de camadas multiplas - Google Patents

Processo de producao de um modulo de ceramica de camadas multiplas

Info

Publication number
BR8106873A
BR8106873A BR8106873A BR8106873A BR8106873A BR 8106873 A BR8106873 A BR 8106873A BR 8106873 A BR8106873 A BR 8106873A BR 8106873 A BR8106873 A BR 8106873A BR 8106873 A BR8106873 A BR 8106873A
Authority
BR
Brazil
Prior art keywords
production process
multiple layer
layer ceramic
ceramic module
module
Prior art date
Application number
BR8106873A
Other languages
English (en)
Inventor
Frank C Bakermans
Lee Roger Conrad
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8106873A publication Critical patent/BR8106873A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638—Removal thereof
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4867—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
BR8106873A 1980-10-28 1981-10-26 Processo de producao de um modulo de ceramica de camadas multiplas BR8106873A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20146980A 1980-10-28 1980-10-28
US06/307,657 US4345955A (en) 1980-10-28 1981-10-02 Process for manufacturing multilayer ceramic chip carrier modules

Publications (1)

Publication Number Publication Date
BR8106873A true BR8106873A (pt) 1982-07-06

Family

ID=26896779

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8106873A BR8106873A (pt) 1980-10-28 1981-10-26 Processo de producao de um modulo de ceramica de camadas multiplas

Country Status (8)

Country Link
US (1) US4345955A (pt)
EP (1) EP0050903B1 (pt)
BR (1) BR8106873A (pt)
CA (1) CA1167979A (pt)
DE (1) DE3173737D1 (pt)
DK (1) DK474181A (pt)
ES (1) ES506657A0 (pt)
NO (1) NO813626L (pt)

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JPS5820160B2 (ja) * 1978-06-17 1983-04-21 日本碍子株式会社 メタライズ層を備えたセラミツクス体
JPS57184296A (en) * 1981-05-09 1982-11-12 Hitachi Ltd Ceramic circuit board
US4504340A (en) * 1983-07-26 1985-03-12 International Business Machines Corporation Material and process set for fabrication of molecular matrix print head
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
JPS6047495A (ja) * 1983-08-25 1985-03-14 株式会社日立製作所 セラミツク配線基板
US4727410A (en) * 1983-11-23 1988-02-23 Cabot Technical Ceramics, Inc. High density integrated circuit package
US4510000A (en) * 1983-11-30 1985-04-09 International Business Machines Corporation Method for palladium activating molybdenum metallized features on a ceramic substrate
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
FR2558763B1 (fr) * 1984-01-27 1987-11-20 Thomson Csf Procede de fabrication d'un substrat ceramique, avec plots de connexion electriques transversaux
JPS61155243A (ja) * 1984-12-28 1986-07-14 富士通株式会社 グリ−ンシ−ト組成物
US4766671A (en) * 1985-10-29 1988-08-30 Nec Corporation Method of manufacturing ceramic electronic device
JPH0632355B2 (ja) * 1986-01-27 1994-04-27 株式会社日立製作所 セラミツク配線基板とその製造方法
GB8602331D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
DE3630066C1 (de) * 1986-09-04 1988-02-04 Heraeus Gmbh W C Verfahren zur Herstellung von gesinterten metallisierten Aluminiumnitrid-Keramikkoerpern
US4767479A (en) * 1987-09-21 1988-08-30 United Technologies Corporation Method for bonding ceramic casting cores
US4765950A (en) * 1987-10-07 1988-08-23 Risi Industries, Inc. Process for fabricating parts from particulate material
US4929575A (en) * 1988-03-21 1990-05-29 The Dow Chemical Company Melt processable, green, ceramic precursor powder
FR2638594B1 (fr) * 1988-11-03 1990-12-21 Cartier Systemes G Procede de realisation d'un circuit electrique de puissance monocouche ou multicouches, et circuit obtenu par ce procede
US4933045A (en) * 1989-06-02 1990-06-12 International Business Machines Corporation Thin film multilayer laminate interconnection board assembly method
JP2761776B2 (ja) * 1989-10-25 1998-06-04 Ii Ai Deyuhon De Nimoasu Ando Co 多層回路板の製造方法
CA2071662A1 (en) * 1991-06-26 1992-12-27 Jon J. Gulick Integrated socket-type package for flip-chip semiconductor devices and circuits
US5240671A (en) * 1992-06-01 1993-08-31 Microelectronics And Computer Technology Corporation Method of forming recessed patterns in insulating substrates
US5340510A (en) * 1993-04-05 1994-08-23 Materials Systems Incorporated Method for making piezoelectric ceramic/polymer composite transducers
DE19615787A1 (de) * 1996-04-20 1997-10-23 Bosch Gmbh Robert Verfahren zur Herstellung eines keramischen Multilayer-Substrats
US6214523B1 (en) * 1998-01-09 2001-04-10 International Business Machines Corporation Pattern formation by removal of paste material
JP2004186395A (ja) * 2002-12-03 2004-07-02 Fujitsu Ltd セラミック基板の製造方法
DE102009013021A1 (de) * 2009-03-16 2010-09-23 Gkn Sinter Metals Holding Gmbh Schmiermittel für die Pulvermetallurgie
DE102013200281A1 (de) * 2013-01-11 2014-07-17 Robert Bosch Gmbh Verfahren zum Herstellen einer Aufnahme für ein Sensorelement
US11274065B2 (en) * 2018-06-13 2022-03-15 Fuelcell Energy, Inc. Ceramic felt material for high-temperature fuel cells

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FR1090014A (fr) * 1952-08-11 1955-03-25 Int Standard Electric Corp Méthodes et procédé de moulage de matériaux notamment de pièces en céramique
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US4197118A (en) * 1972-06-14 1980-04-08 Parmatech Corporation Manufacture of parts from particulate material
US3991029A (en) * 1973-05-03 1976-11-09 E. I. Du Pont De Nemours And Company Ceramic compositions and articles made therefrom
US3956052A (en) * 1974-02-11 1976-05-11 International Business Machines Corporation Recessed metallurgy for dielectric substrates
US4101710A (en) * 1977-03-07 1978-07-18 E. I. Du Pont De Nemours And Company Silver compositions

Also Published As

Publication number Publication date
US4345955A (en) 1982-08-24
DK474181A (da) 1982-04-29
ES8206916A1 (es) 1982-08-16
EP0050903A1 (en) 1982-05-05
NO813626L (no) 1982-04-29
EP0050903B1 (en) 1986-02-05
CA1167979A (en) 1984-05-22
DE3173737D1 (en) 1986-03-20
ES506657A0 (es) 1982-08-16

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