BR7503777A - Dispositivo semicondutor e processo de fabricacao do mesm - Google Patents
Dispositivo semicondutor e processo de fabricacao do mesmInfo
- Publication number
- BR7503777A BR7503777A BR4859/75A BR7504859A BR7503777A BR 7503777 A BR7503777 A BR 7503777A BR 4859/75 A BR4859/75 A BR 4859/75A BR 7504859 A BR7504859 A BR 7504859A BR 7503777 A BR7503777 A BR 7503777A
- Authority
- BR
- Brazil
- Prior art keywords
- semiconductor device
- manufacturing process
- manufacturing
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
- H10D84/67—Complementary BJTs
- H10D84/673—Vertical complementary BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/60—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/19—Preparing inhomogeneous wafers
- H10P90/1904—Preparing vertically inhomogeneous wafers
- H10P90/1906—Preparing SOI wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/019—Manufacture or treatment of isolation regions comprising dielectric materials using epitaxial passivated integrated circuit [EPIC] processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/031—Manufacture or treatment of isolation regions comprising PN junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/061—Manufacture or treatment using SOI processes together with lateral isolation, e.g. combinations of SOI and shallow trench isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/181—Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/30—Isolation regions comprising PN junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
- H10W10/014—Manufacture or treatment of isolation regions comprising dielectric materials using trench refilling with dielectric materials, e.g. shallow trench isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/10—Isolation regions comprising dielectric materials
- H10W10/17—Isolation regions comprising dielectric materials formed using trench refilling with dielectric materials, e.g. shallow trench isolations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7408110A NL7408110A (nl) | 1974-06-18 | 1974-06-18 | Halfgeleiderinrichting met complementaire tran- sistorstrukturen en werkwijze ter vervaardiging daarvan. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR7503777A true BR7503777A (pt) | 1976-07-06 |
Family
ID=19821569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR4859/75A BR7503777A (pt) | 1974-06-18 | 1975-06-16 | Dispositivo semicondutor e processo de fabricacao do mesm |
Country Status (13)
| Country | Link |
|---|---|
| JP (1) | JPS5112778A (cg-RX-API-DMAC10.html) |
| AU (1) | AU499052B2 (cg-RX-API-DMAC10.html) |
| BE (1) | BE830286A (cg-RX-API-DMAC10.html) |
| BR (1) | BR7503777A (cg-RX-API-DMAC10.html) |
| CA (1) | CA1029134A (cg-RX-API-DMAC10.html) |
| CH (1) | CH588166A5 (cg-RX-API-DMAC10.html) |
| DE (1) | DE2525529B2 (cg-RX-API-DMAC10.html) |
| ES (1) | ES438593A1 (cg-RX-API-DMAC10.html) |
| FR (1) | FR2275884A1 (cg-RX-API-DMAC10.html) |
| GB (1) | GB1505103A (cg-RX-API-DMAC10.html) |
| IT (1) | IT1046053B (cg-RX-API-DMAC10.html) |
| NL (1) | NL7408110A (cg-RX-API-DMAC10.html) |
| SE (1) | SE407996B (cg-RX-API-DMAC10.html) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7710164A (nl) * | 1977-09-16 | 1979-03-20 | Philips Nv | Werkwijze ter behandeling van een eenkristal- lijn lichaam. |
| US4159915A (en) * | 1977-10-25 | 1979-07-03 | International Business Machines Corporation | Method for fabrication vertical NPN and PNP structures utilizing ion-implantation |
| US4232328A (en) * | 1978-12-20 | 1980-11-04 | Bell Telephone Laboratories, Incorporated | Dielectrically-isolated integrated circuit complementary transistors for high voltage use |
| GB2060252B (en) * | 1979-09-17 | 1984-02-22 | Nippon Telegraph & Telephone | Mutually isolated complementary semiconductor elements |
| JPS57204898A (en) * | 1981-06-02 | 1982-12-15 | Saito Masayasu | Pump for vessel for dividing liquid little by little |
| JP2531824Y2 (ja) * | 1987-02-13 | 1997-04-09 | 株式会社 神崎高級工機製作所 | 油圧クラツチ式変速装置 |
| JPS63142451U (cg-RX-API-DMAC10.html) * | 1987-03-12 | 1988-09-20 | ||
| US5070382A (en) * | 1989-08-18 | 1991-12-03 | Motorola, Inc. | Semiconductor structure for high power integrated circuits |
| US7076124B2 (en) * | 2002-12-20 | 2006-07-11 | Avago Technologies, Ltd. | Integrated multichannel laser driver and photodetector receiver |
| EP4372792A1 (en) * | 2022-11-16 | 2024-05-22 | Infineon Technologies Dresden GmbH & Co . KG | Semiconductor device |
-
1974
- 1974-06-18 NL NL7408110A patent/NL7408110A/xx not_active Application Discontinuation
-
1975
- 1975-05-21 GB GB21807/75A patent/GB1505103A/en not_active Expired
- 1975-06-07 DE DE19752525529 patent/DE2525529B2/de not_active Withdrawn
- 1975-06-11 CA CA229,060A patent/CA1029134A/en not_active Expired
- 1975-06-13 CH CH771075A patent/CH588166A5/xx not_active IP Right Cessation
- 1975-06-13 IT IT24362/75A patent/IT1046053B/it active
- 1975-06-16 BR BR4859/75A patent/BR7503777A/pt unknown
- 1975-06-16 JP JP50072123A patent/JPS5112778A/ja active Granted
- 1975-06-16 ES ES438593A patent/ES438593A1/es not_active Expired
- 1975-06-16 SE SE7506878A patent/SE407996B/xx unknown
- 1975-06-16 BE BE157368A patent/BE830286A/xx unknown
- 1975-06-17 AU AU82149/75A patent/AU499052B2/en not_active Expired
- 1975-06-18 FR FR7519105A patent/FR2275884A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| CA1029134A (en) | 1978-04-04 |
| NL7408110A (nl) | 1975-12-22 |
| IT1046053B (it) | 1980-06-30 |
| JPS5247319B2 (cg-RX-API-DMAC10.html) | 1977-12-01 |
| ES438593A1 (es) | 1977-01-16 |
| FR2275884B1 (cg-RX-API-DMAC10.html) | 1980-10-24 |
| JPS5112778A (en) | 1976-01-31 |
| FR2275884A1 (fr) | 1976-01-16 |
| AU499052B2 (en) | 1979-04-05 |
| SE7506878L (sv) | 1975-12-19 |
| BE830286A (fr) | 1975-12-16 |
| SE407996B (sv) | 1979-04-30 |
| GB1505103A (en) | 1978-03-22 |
| CH588166A5 (cg-RX-API-DMAC10.html) | 1977-05-31 |
| AU8214975A (en) | 1976-12-23 |
| DE2525529A1 (de) | 1976-01-08 |
| DE2525529B2 (de) | 1977-08-04 |
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