BR112019024626A2 - Dispositivo saw com sinais de modo espúrio suprimidos - Google Patents

Dispositivo saw com sinais de modo espúrio suprimidos Download PDF

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Publication number
BR112019024626A2
BR112019024626A2 BR112019024626-6A BR112019024626A BR112019024626A2 BR 112019024626 A2 BR112019024626 A2 BR 112019024626A2 BR 112019024626 A BR112019024626 A BR 112019024626A BR 112019024626 A2 BR112019024626 A2 BR 112019024626A2
Authority
BR
Brazil
Prior art keywords
saw device
delivered
spurious signals
carrier substrate
proposed
Prior art date
Application number
BR112019024626-6A
Other languages
English (en)
Inventor
Knapp Matthias
Bleyl Ingo
Original Assignee
RF360 Europe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RF360 Europe GmbH filed Critical RF360 Europe GmbH
Publication of BR112019024626A2 publication Critical patent/BR112019024626A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02866—Means for compensation or elimination of undesirable effects of bulk wave excitation and reflections

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

para um dispositivo saw de múltiplas camadas arranjado em um substrato portador é proposto o uso de um material específico para o substrato portador. se um material de silício tendo uma faixa selecionada de ângulos de euler for usado como um material para o substrato portador supressão melhorada de sinais de perturbação é alcançada.
BR112019024626-6A 2017-05-24 2018-04-23 Dispositivo saw com sinais de modo espúrio suprimidos BR112019024626A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017111448.3 2017-05-24
DE102017111448.3A DE102017111448B4 (de) 2017-05-24 2017-05-24 SAW-Vorrichtung mit unterdrückten Störmodensignalen
PCT/EP2018/060322 WO2018215152A1 (en) 2017-05-24 2018-04-23 Saw device with suppressed spurious mode signals

Publications (1)

Publication Number Publication Date
BR112019024626A2 true BR112019024626A2 (pt) 2020-06-16

Family

ID=62046922

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019024626-6A BR112019024626A2 (pt) 2017-05-24 2018-04-23 Dispositivo saw com sinais de modo espúrio suprimidos

Country Status (6)

Country Link
US (1) US11824514B2 (pt)
EP (1) EP3631984A1 (pt)
CN (1) CN110999076B (pt)
BR (1) BR112019024626A2 (pt)
DE (1) DE102017111448B4 (pt)
WO (1) WO2018215152A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210068131A (ko) * 2018-10-16 2021-06-08 도호쿠 다이가쿠 음향파 디바이스들
DE102018131946A1 (de) 2018-12-12 2020-06-18 RF360 Europe GmbH Dünnfilm-SAW-Vorrichtung
DE102019106997A1 (de) * 2019-03-19 2020-09-24 RF360 Europe GmbH SAW-Resonator mit reduzierten Störmoden, elektroakustisches Filter und Multiplexer
DE102019119097A1 (de) * 2019-07-15 2021-01-21 RF360 Europe GmbH SAW-Resonator mit reduzierten Störmoden, elektroakustisches Filter und Multiplexer
DE102019130779A1 (de) * 2019-11-14 2021-05-20 RF360 Europe GmbH SAW-Bauteil
WO2021215302A1 (ja) * 2020-04-20 2021-10-28 株式会社村田製作所 複合基板及び弾性波装置
US11588463B2 (en) * 2020-09-24 2023-02-21 Huawei Technologies Co., Ltd. Surface acoustic wave devices with ultra-thin transducers
CN117200743A (zh) * 2022-05-31 2023-12-08 华为技术有限公司 滤波器及电子设备

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US4494091A (en) 1983-05-09 1985-01-15 The United States Of America As Represented By The Secretary Of The Army Damping package for surface acoustic wave devices
US5081389A (en) * 1990-11-30 1992-01-14 Ascom Zelcom Ag. Crystal cut angles for lithium tantalate crystal for novel surface acoustic wave devices
EP1001532A4 (en) * 1998-04-28 2006-02-15 Tdk Corp PIEZOELECTRIC VOLUMIC VIBRATOR
AUPR507601A0 (en) * 2001-05-21 2001-06-14 Microtechnology Centre Management Limited Surface acoustic wave sensor
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WO2008078481A1 (ja) 2006-12-25 2008-07-03 Murata Manufacturing Co., Ltd. 弾性境界波装置
CN102143909A (zh) * 2008-09-09 2011-08-03 智索株式会社 高纯度结晶硅、高纯度四氯化硅及其制造方法
US8035464B1 (en) 2009-03-05 2011-10-11 Triquint Semiconductor, Inc. Bonded wafer SAW filters and methods
WO2010150587A1 (ja) * 2009-06-25 2010-12-29 株式会社 村田製作所 弾性表面波センサー
KR101340310B1 (ko) 2009-10-13 2013-12-12 가부시키가이샤 무라타 세이사쿠쇼 탄성 표면파 장치
FI124453B (fi) * 2010-08-13 2014-09-15 Valtion Teknillinen Mikromekaaninen resonaattorijärjestelmä ja menetelmä sen valmistamiseksi
JP2012060421A (ja) 2010-09-09 2012-03-22 Seiko Epson Corp 弾性表面波デバイス、電子機器及びセンサー装置
JP5850137B2 (ja) 2012-03-23 2016-02-03 株式会社村田製作所 弾性波装置及びその製造方法
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US20150013461A1 (en) * 2013-07-12 2015-01-15 Environetix Technologies Corp. Device and method for measuring physical parameters using saw sensors
DE102014105860A1 (de) * 2014-04-25 2015-10-29 Epcos Ag Elektroakustisches Bauelement und Kristallschnitte für elektroakustische Bauelemente
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DE102018111013B4 (de) * 2018-05-08 2024-05-02 Rf360 Singapore Pte. Ltd. SAW-Vorrichtung für ultrahohe Frequenzen
DE102018131946A1 (de) * 2018-12-12 2020-06-18 RF360 Europe GmbH Dünnfilm-SAW-Vorrichtung

Also Published As

Publication number Publication date
DE102017111448B4 (de) 2022-02-10
US11824514B2 (en) 2023-11-21
WO2018215152A1 (en) 2018-11-29
DE102017111448A1 (de) 2018-11-29
CN110999076A (zh) 2020-04-10
CN110999076B (zh) 2024-03-29
EP3631984A1 (en) 2020-04-08
US20200144981A1 (en) 2020-05-07

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Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B25A Requested transfer of rights approved

Owner name: RF360 SINGAPORE PTE. LTD. (SG)