BR112017013546A2 - conjunto eletrônico. - Google Patents
conjunto eletrônico.Info
- Publication number
- BR112017013546A2 BR112017013546A2 BR112017013546A BR112017013546A BR112017013546A2 BR 112017013546 A2 BR112017013546 A2 BR 112017013546A2 BR 112017013546 A BR112017013546 A BR 112017013546A BR 112017013546 A BR112017013546 A BR 112017013546A BR 112017013546 A2 BR112017013546 A2 BR 112017013546A2
- Authority
- BR
- Brazil
- Prior art keywords
- circuit board
- semiconductor device
- semiconductor
- metal region
- conductive blocks
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4043—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to have chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Thermal Sciences (AREA)
Abstract
um conjunto eletrônico compreende um dispositivo semicondutor (48) que tem blocos condutivos (66) sobre um primeiro lado do semicondutor (72) e uma região metálica (266) sobre um segundo lado do semicondutor (74) oposto ao primeiro lado (72). uma grade de conexão (16) proporciona respectivos terminais separados (54, 56) que são eletricamente e mecanicamente conectados a correspondentes blocos condutivos. um primeiro dissipador de calor (30) compreende um primeiro componente (37) tendo um lado conjugado (62). uma porção do lado conjugado (62) é ligada diretamente com a região metálica (266) do dispositivo semicondutor (48). uma placa de circuito tem uma abertura para receber o dispositivo semicondutor (48). a grade de conexão (16) estende-se para fora para a placa de circuito ou um primeiro lado da placa da placa de circuito.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562115719P | 2015-02-13 | 2015-02-13 | |
US62/115,719 | 2015-02-13 | ||
US14/689,528 | 2015-04-17 | ||
US14/689,528 US9860987B2 (en) | 2015-02-13 | 2015-04-17 | Electronic assembly with one or more heat sinks |
PCT/US2016/017503 WO2016130773A1 (en) | 2015-02-13 | 2016-02-11 | Electronic assembly with one or more heat sinks |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112017013546A2 true BR112017013546A2 (pt) | 2018-03-06 |
BR112017013546B1 BR112017013546B1 (pt) | 2022-05-10 |
Family
ID=56614835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112017013546-9A BR112017013546B1 (pt) | 2015-02-13 | 2016-02-11 | Conjunto eletrônico |
Country Status (5)
Country | Link |
---|---|
US (1) | US9860987B2 (pt) |
EP (1) | EP3257076B1 (pt) |
CN (1) | CN107112307B (pt) |
BR (1) | BR112017013546B1 (pt) |
WO (1) | WO2016130773A1 (pt) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015113873B3 (de) * | 2015-08-21 | 2016-07-14 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronische Baugruppe mit Kondensatoreinrichtung |
US10057974B2 (en) * | 2016-11-04 | 2018-08-21 | Hamilton Sundstrand Corporation | Integrated panel level liquid cooling for bus bars |
US10850623B2 (en) | 2017-10-30 | 2020-12-01 | Sf Motors, Inc. | Stacked electric vehicle inverter cells |
AT520735B1 (de) * | 2017-12-14 | 2019-07-15 | Becom Electronics Gmbh | Leiterplatte |
US10790758B2 (en) | 2018-03-08 | 2020-09-29 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Power converter for electric vehicle drive systems |
US10756649B2 (en) | 2018-03-23 | 2020-08-25 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Inverter module having multiple half-bridge modules for a power converter of an electric vehicle |
US10779445B2 (en) | 2018-03-23 | 2020-09-15 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Inverter module having multiple half-bridge modules for a power converter of an electric vehicle |
US10778118B2 (en) | 2018-03-23 | 2020-09-15 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Inverter module having multiple half-bridge modules for a power converter of an electric vehicle |
US10778117B2 (en) | 2018-04-17 | 2020-09-15 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Inverter module of an electric vehicle |
US10772242B2 (en) | 2018-04-17 | 2020-09-08 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Inverter module of an electric vehicle |
US10608423B2 (en) | 2018-04-26 | 2020-03-31 | Sf Motors, Inc. | Electric vehicle inverter module laminated bus bar |
US10600578B2 (en) | 2018-04-26 | 2020-03-24 | Sf Motors, Inc. | Electric vehicle inverter module capacitors |
US10660242B2 (en) * | 2018-04-26 | 2020-05-19 | Chongqing Jinkang New Energy Vehicle Co., Ltd. | Electric vehicle inverter module heat sink |
US10900412B2 (en) * | 2018-05-31 | 2021-01-26 | Borg Warner Inc. | Electronics assembly having a heat sink and an electrical insulator directly bonded to the heat sink |
KR102055678B1 (ko) * | 2018-10-11 | 2019-12-13 | 엘지전자 주식회사 | 정수기 |
TWI690134B (zh) * | 2018-12-07 | 2020-04-01 | 璦司柏電子股份有限公司 | 內建有檢流電阻和功率電晶體的馬達控制裝置 |
US11488796B2 (en) * | 2019-04-24 | 2022-11-01 | Applied Materials, Inc. | Thermal break for high-frequency antennae |
US11917790B2 (en) * | 2019-04-26 | 2024-02-27 | Intel Corporation | Thermal control for processor-based devices |
US11293332B2 (en) * | 2020-01-19 | 2022-04-05 | Cooler Master Co., Ltd. | Vehicle electronic control unit water block |
US20210367526A1 (en) * | 2020-05-22 | 2021-11-25 | Marel Power Solutions, Inc. | Packaged power module |
US11457544B2 (en) * | 2020-11-24 | 2022-09-27 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics systems comprising a two phase cold plate having an outer enclosure and an inner enclosure |
US11439039B2 (en) * | 2020-12-07 | 2022-09-06 | Hamilton Sundstrand Corporation | Thermal management of electronic devices on a cold plate |
US11596088B2 (en) * | 2021-01-29 | 2023-02-28 | Toyota Motor Engineering & Manufacturing North America, Inc. | Asymmetric configurable double-sided manifold micro-channel cold plates |
KR20230090747A (ko) * | 2021-12-15 | 2023-06-22 | 현대자동차주식회사 | 파워모듈용 양면 냉각장치 |
US11974413B2 (en) * | 2022-04-27 | 2024-04-30 | Quanta Computer Inc. | Systems and methods for heat dissipation in computing systems with environment resistance |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4004195A (en) | 1975-05-12 | 1977-01-18 | Rca Corporation | Heat-sink assembly for high-power stud-mounted semiconductor device |
US5471011A (en) | 1994-05-26 | 1995-11-28 | Ak Technology, Inc. | Homogeneous thermoplastic semi-conductor chip carrier package |
US5666003A (en) * | 1994-10-24 | 1997-09-09 | Rohm Co. Ltd. | Packaged semiconductor device incorporating heat sink plate |
US5847929A (en) | 1996-06-28 | 1998-12-08 | International Business Machines Corporation | Attaching heat sinks directly to flip chips and ceramic chip carriers |
US6490161B1 (en) * | 2002-01-08 | 2002-12-03 | International Business Machines Corporation | Peripheral land grid array package with improved thermal performance |
EP1450176A1 (en) | 2003-02-21 | 2004-08-25 | Liaisons Electroniques-Mecaniques Lem S.A. | Magnetic field sensor and electrical current sensor therewith |
US7268425B2 (en) * | 2003-03-05 | 2007-09-11 | Intel Corporation | Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
US6842341B1 (en) * | 2003-10-02 | 2005-01-11 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
DE202005004277U1 (de) * | 2004-03-17 | 2005-06-09 | Ebm-Papst St. Georgen Gmbh & Co. Kg | Halbleiterbauelementanordnung |
US7133286B2 (en) | 2004-05-10 | 2006-11-07 | International Business Machines Corporation | Method and apparatus for sealing a liquid cooled electronic device |
US7582951B2 (en) | 2005-10-20 | 2009-09-01 | Broadcom Corporation | Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages |
JP2007158279A (ja) * | 2005-12-09 | 2007-06-21 | Hitachi Ltd | 半導体装置及びそれを用いた電子制御装置 |
US7598603B2 (en) * | 2006-03-15 | 2009-10-06 | Infineon Technologies Ag | Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink |
US7741158B2 (en) * | 2006-06-08 | 2010-06-22 | Unisem (Mauritius) Holdings Limited | Method of making thermally enhanced substrate-base package |
US20080017998A1 (en) * | 2006-07-19 | 2008-01-24 | Pavio Jeanne S | Semiconductor component and method of manufacture |
US7800219B2 (en) | 2008-01-02 | 2010-09-21 | Fairchild Semiconductor Corporation | High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same |
US8021907B2 (en) * | 2008-06-09 | 2011-09-20 | Stats Chippac, Ltd. | Method and apparatus for thermally enhanced semiconductor package |
US7759778B2 (en) | 2008-09-15 | 2010-07-20 | Delphi Technologies, Inc. | Leaded semiconductor power module with direct bonding and double sided cooling |
US7816784B2 (en) * | 2008-12-17 | 2010-10-19 | Fairchild Semiconductor Corporation | Power quad flat no-lead semiconductor die packages with isolated heat sink for high-voltage, high-power applications, systems using the same, and methods of making the same |
US8334467B2 (en) | 2009-06-17 | 2012-12-18 | Lsi Corporation | Lead frame design to improve reliability |
US8841765B2 (en) * | 2011-04-22 | 2014-09-23 | Tessera, Inc. | Multi-chip module with stacked face-down connected dies |
CN102842556B (zh) * | 2011-06-21 | 2015-04-22 | 万国半导体(开曼)股份有限公司 | 双面外露的半导体器件及其制作方法 |
JP5651552B2 (ja) * | 2011-07-22 | 2015-01-14 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
WO2013063773A1 (en) * | 2011-11-02 | 2013-05-10 | Honeywell International Inc. | Devices and methods for sensing current |
US9209106B2 (en) * | 2012-06-21 | 2015-12-08 | Ati Technologies Ulc | Thermal management circuit board for stacked semiconductor chip device |
CH708052B1 (de) * | 2013-05-07 | 2016-09-15 | Melexis Technologies Nv | Vorrichtung zur Strommessung. |
US9209141B2 (en) * | 2014-02-26 | 2015-12-08 | International Business Machines Corporation | Shielded package assemblies with integrated capacitor |
US9439278B2 (en) * | 2014-12-12 | 2016-09-06 | Deere & Company | Film capacitor having a package for heat transfer |
US9659837B2 (en) * | 2015-01-30 | 2017-05-23 | Semiconductor Components Industries, Llc | Direct bonded copper semiconductor packages and related methods |
-
2015
- 2015-04-17 US US14/689,528 patent/US9860987B2/en active Active
-
2016
- 2016-02-11 CN CN201680005380.5A patent/CN107112307B/zh active Active
- 2016-02-11 WO PCT/US2016/017503 patent/WO2016130773A1/en active Application Filing
- 2016-02-11 BR BR112017013546-9A patent/BR112017013546B1/pt active IP Right Grant
- 2016-02-11 EP EP16749863.3A patent/EP3257076B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
US9860987B2 (en) | 2018-01-02 |
CN107112307B (zh) | 2020-08-28 |
BR112017013546B1 (pt) | 2022-05-10 |
EP3257076B1 (en) | 2021-04-14 |
WO2016130773A1 (en) | 2016-08-18 |
CN107112307A (zh) | 2017-08-29 |
EP3257076A4 (en) | 2018-12-12 |
US20160242312A1 (en) | 2016-08-18 |
EP3257076A1 (en) | 2017-12-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/02/2016, OBSERVADAS AS CONDICOES LEGAIS |