BR112014032959A2 - processo de fabricação de um microcircuito sem contato - Google Patents
processo de fabricação de um microcircuito sem contatoInfo
- Publication number
- BR112014032959A2 BR112014032959A2 BR112014032959A BR112014032959A BR112014032959A2 BR 112014032959 A2 BR112014032959 A2 BR 112014032959A2 BR 112014032959 A BR112014032959 A BR 112014032959A BR 112014032959 A BR112014032959 A BR 112014032959A BR 112014032959 A2 BR112014032959 A2 BR 112014032959A2
- Authority
- BR
- Brazil
- Prior art keywords
- loop
- antenna coil
- act1
- strip
- zone
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
- G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
resumo patente de invenção: "processo de fabricação de um microcircuito sem contato". a presente invenção se refere a um processo de fabricação de uma bobina de antena de microcircuito sem contato, compreendendo etapas que consistem em: depositar uma primeira camada eletricamente condutora (al) sobre uma primeira face de uma plaqueta, e formar na primeira camada uma bobina de antena (ma1) em espiral, comportando várias espiras, compreendendo uma espira interna (is) ligada a uma faixa de conexão (act2) interna e uma espira externa (es) ligada a uma faixa de conexão externa (act1), a espira externa (es) seguindo a totalidade do contorno de bobina de antena com exceção de uma zona que permite a passagem de uma pista condutora ligando a faixa de conexão externa (act1) à espira externa, as faixas de conexão externa e interna (act1, act2) da bobina de antena (ma1) sendo formadas em uma zona central (cz) da espira externa, a bobina de antena compreendendo uma zona de contorno (cst1) na qual cada espira contorna a faixa de conexão externa.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1201866A FR2992761B1 (fr) | 2012-07-02 | 2012-07-02 | Procede de fabrication d'un microcircuit sans contact |
FR1201866 | 2012-07-02 | ||
PCT/FR2013/050982 WO2014006286A1 (fr) | 2012-07-02 | 2013-05-03 | Procede de fabrication d'un microcircuit sans contact |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112014032959A2 true BR112014032959A2 (pt) | 2017-06-27 |
BR112014032959B1 BR112014032959B1 (pt) | 2021-10-13 |
Family
ID=46785506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112014032959-1A BR112014032959B1 (pt) | 2012-07-02 | 2013-05-03 | Processo de fabricação de um microcircuito sem contato, bobina de antena de microcircuito sem contato, módulos sem contato e cartão com microcircuitos |
Country Status (6)
Country | Link |
---|---|
US (1) | US9218562B2 (pt) |
EP (1) | EP2867831B1 (pt) |
CN (1) | CN104603798B (pt) |
BR (1) | BR112014032959B1 (pt) |
FR (1) | FR2992761B1 (pt) |
WO (1) | WO2014006286A1 (pt) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9489613B2 (en) * | 2011-08-08 | 2016-11-08 | Féinics Amatech Teoranta | RFID transponder chip modules with a band of the antenna extending inward |
FR2992761B1 (fr) | 2012-07-02 | 2015-05-29 | Inside Secure | Procede de fabrication d'un microcircuit sans contact |
FR2996944B1 (fr) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
US11264337B2 (en) | 2017-03-14 | 2022-03-01 | Mediatek Inc. | Semiconductor package structure |
US11387176B2 (en) | 2017-03-14 | 2022-07-12 | Mediatek Inc. | Semiconductor package structure |
US10784211B2 (en) | 2017-03-14 | 2020-09-22 | Mediatek Inc. | Semiconductor package structure |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
JP7450607B2 (ja) * | 2018-08-31 | 2024-03-15 | スリーエム イノベイティブ プロパティズ カンパニー | コイル及びその製造方法 |
FR3086098B1 (fr) * | 2018-09-18 | 2020-12-04 | Smart Packaging Solutions | Procede de fabrication d'un module electronique pour objet portatif |
FR3089090B1 (fr) * | 2018-11-22 | 2021-03-19 | Smart Packaging Solutions | Procédé de fabrication d’un module souple et module obtenu |
CN116235179A (zh) * | 2020-07-24 | 2023-06-06 | 兰克森控股公司 | 用于智能卡芯片模块的电路、智能卡芯片模块及智能卡芯片模块的制造方法 |
USD942538S1 (en) | 2020-07-30 | 2022-02-01 | Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
USD943024S1 (en) | 2020-07-30 | 2022-02-08 | Federal Card Services, LLC | Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module |
FR3131412B1 (fr) | 2021-12-24 | 2024-01-05 | Wisekey Semiconductors | Module sans contact ayant une bobine d'antenne configurable |
FR3131411B1 (fr) | 2021-12-24 | 2024-01-05 | Wisekey Semiconductors | Procédé de fabrication d’un module sans contact ayant une bobine d'antenne à inductance finement ajustable |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2716281B1 (fr) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Procédé de fabrication d'une carte sans contact. |
US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
FR2743649B1 (fr) * | 1996-01-17 | 1998-04-03 | Gemplus Card Int | Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication |
DE19632115C1 (de) | 1996-08-08 | 1997-12-11 | Siemens Ag | Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls |
JP2002319011A (ja) * | 2001-01-31 | 2002-10-31 | Canon Inc | 半導体装置、半導体装置の製造方法及び電子写真装置 |
FR2890212B1 (fr) | 2005-08-30 | 2009-08-21 | Smart Packaging Solutions Sps | Module electronique a double interface de communication, notamment pour carte a puce |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
FR2938954B1 (fr) * | 2008-11-24 | 2011-06-24 | Rfideal | Procede de fabrication d'objets portatifs sans contact avec pont dielectrique. |
US8366009B2 (en) * | 2010-08-12 | 2013-02-05 | Féinics Amatech Teoranta | Coupling in and to RFID smart cards |
FR2963141B1 (fr) * | 2010-07-20 | 2012-08-31 | Oberthur Technologies | Etiquette electronique sans contact |
FR2992761B1 (fr) | 2012-07-02 | 2015-05-29 | Inside Secure | Procede de fabrication d'un microcircuit sans contact |
FR2996944B1 (fr) | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
-
2012
- 2012-07-02 FR FR1201866A patent/FR2992761B1/fr active Active
-
2013
- 2013-05-03 BR BR112014032959-1A patent/BR112014032959B1/pt active IP Right Grant
- 2013-05-03 US US14/412,491 patent/US9218562B2/en active Active
- 2013-05-03 CN CN201380044934.9A patent/CN104603798B/zh active Active
- 2013-05-03 EP EP13725722.6A patent/EP2867831B1/fr active Active
- 2013-05-03 WO PCT/FR2013/050982 patent/WO2014006286A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2867831B1 (fr) | 2020-07-15 |
FR2992761B1 (fr) | 2015-05-29 |
WO2014006286A1 (fr) | 2014-01-09 |
EP2867831A1 (fr) | 2015-05-06 |
FR2992761A1 (fr) | 2014-01-03 |
CN104603798A (zh) | 2015-05-06 |
US9218562B2 (en) | 2015-12-22 |
BR112014032959B1 (pt) | 2021-10-13 |
US20150186769A1 (en) | 2015-07-02 |
CN104603798B (zh) | 2018-05-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B25A | Requested transfer of rights approved |
Owner name: WISEKEY SEMICONDUCTORS (FR) |
|
B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 03/05/2013, OBSERVADAS AS CONDICOES LEGAIS. |