BR112014028463A2 - disposição de módulo eletrônico de potência - Google Patents

disposição de módulo eletrônico de potência

Info

Publication number
BR112014028463A2
BR112014028463A2 BR112014028463A BR112014028463A BR112014028463A2 BR 112014028463 A2 BR112014028463 A2 BR 112014028463A2 BR 112014028463 A BR112014028463 A BR 112014028463A BR 112014028463 A BR112014028463 A BR 112014028463A BR 112014028463 A2 BR112014028463 A2 BR 112014028463A2
Authority
BR
Brazil
Prior art keywords
power electronics
electronics module
module layout
layout
power
Prior art date
Application number
BR112014028463A
Other languages
English (en)
Inventor
Roche Olivier
Original Assignee
Sagem Defense Securite
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem Defense Securite filed Critical Sagem Defense Securite
Publication of BR112014028463A2 publication Critical patent/BR112014028463A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Inverter Devices (AREA)
BR112014028463A 2012-05-16 2013-05-13 disposição de módulo eletrônico de potência BR112014028463A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1254521A FR2990795B1 (fr) 2012-05-16 2012-05-16 Agencement de module electronique de puissance
PCT/EP2013/059762 WO2013171136A1 (fr) 2012-05-16 2013-05-13 Agencement de module electronique de puissance

Publications (1)

Publication Number Publication Date
BR112014028463A2 true BR112014028463A2 (pt) 2017-08-08

Family

ID=48430765

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014028463A BR112014028463A2 (pt) 2012-05-16 2013-05-13 disposição de módulo eletrônico de potência

Country Status (8)

Country Link
US (1) US9414532B2 (pt)
EP (1) EP2850658B1 (pt)
CN (1) CN104321870B (pt)
BR (1) BR112014028463A2 (pt)
CA (1) CA2872065A1 (pt)
FR (1) FR2990795B1 (pt)
RU (1) RU2585887C1 (pt)
WO (1) WO2013171136A1 (pt)

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* Cited by examiner, † Cited by third party
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US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
DE102014219585A1 (de) * 2014-09-26 2016-03-31 Robert Bosch Gmbh Kontaktanordnung mit einem Schaltungsträger und einem Verbindungselement
US10224810B2 (en) 2015-03-16 2019-03-05 Cree, Inc. High speed, efficient SiC power module
US10680518B2 (en) * 2015-03-16 2020-06-09 Cree, Inc. High speed, efficient SiC power module
CN105578760A (zh) * 2016-01-05 2016-05-11 英业达科技有限公司 电路板组件
FR3054721B1 (fr) 2016-07-29 2018-12-07 Safran Module electronique de puissance d'un aeronef et procede de fabrication associe
DE102016216207A1 (de) 2016-08-29 2018-03-01 Robert Bosch Gmbh Verfahren zum Herstellen eines mikromechanischen Sensors
DE102016218207A1 (de) * 2016-09-22 2018-03-22 Robert Bosch Gmbh Elektronische Baugruppe, insbesondere eine elektronische Leistungsbaugruppe für Hybridfahrzeuge oder Elektrofahrzeuge
US10411609B2 (en) * 2017-12-22 2019-09-10 Panasonic Intellectual Property Management Co., Ltd. Substrate mounted inverter device
FR3091139B1 (fr) * 2018-12-21 2020-12-11 Safran Electrical & Power Module de distribution électrique comprenant des socles supportant conjointement des barres de puissance et des composants de puissance
CN109872987B (zh) * 2019-03-08 2022-03-08 中国科学院微电子研究所 带有散热结构的系统封装板卡结构及其制作方法
JP6960984B2 (ja) * 2019-12-26 2021-11-05 三菱電機株式会社 電子装置及びその絶縁部材

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DE3930858C2 (de) * 1988-09-20 2002-01-03 Peter H Maier Modulaufbau
US5077595A (en) * 1990-01-25 1991-12-31 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2656416B2 (ja) * 1991-12-16 1997-09-24 三菱電機株式会社 半導体装置および半導体装置の製造方法、並びに半導体装置に用いられる複合基板および複合基板の製造方法
DE4418426B4 (de) * 1993-09-08 2007-08-02 Mitsubishi Denki K.K. Halbleiterleistungsmodul und Verfahren zur Herstellung des Halbleiterleistungsmoduls
DE9403108U1 (de) * 1994-02-24 1994-04-14 Siemens Ag Niederinduktive Hochstromverschienung für Stromrichtermodule
US6963195B1 (en) * 1997-08-15 2005-11-08 General Electric Company Apparatus for sensing current
JPH11233712A (ja) * 1998-02-12 1999-08-27 Hitachi Ltd 半導体装置及びその製法とそれを使った電気機器
DE10054489A1 (de) 2000-11-03 2002-05-29 Zf Sachs Ag Leistungs-Umrichtermodul
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DE10227658B4 (de) * 2002-06-20 2012-03-08 Curamik Electronics Gmbh Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat
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US6775145B1 (en) * 2003-05-14 2004-08-10 Cyntec Co., Ltd. Construction for high density power module package (case II)
US8104358B1 (en) * 2006-01-23 2012-01-31 University Of Puerto Rico High sensitivity passive wireless strain sensor
JP2007235004A (ja) * 2006-03-03 2007-09-13 Mitsubishi Electric Corp 半導体装置
DE102007010883A1 (de) * 2007-03-06 2008-09-18 Infineon Technologies Ag Leistungshalbleiteranordnung und Verfahren zu dessen Herstellung
US8154114B2 (en) * 2007-08-06 2012-04-10 Infineon Technologies Ag Power semiconductor module
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Also Published As

Publication number Publication date
US9414532B2 (en) 2016-08-09
RU2585887C1 (ru) 2016-06-10
FR2990795B1 (fr) 2015-12-11
CA2872065A1 (fr) 2013-11-21
EP2850658B1 (fr) 2022-11-30
CN104321870A (zh) 2015-01-28
EP2850658A1 (fr) 2015-03-25
CN104321870B (zh) 2018-04-24
US20150077942A1 (en) 2015-03-19
WO2013171136A1 (fr) 2013-11-21
FR2990795A1 (fr) 2013-11-22

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]