BR112014028070A8 - sealing technology for led module - Google Patents
sealing technology for led module Download PDFInfo
- Publication number
- BR112014028070A8 BR112014028070A8 BR112014028070A BR112014028070A BR112014028070A8 BR 112014028070 A8 BR112014028070 A8 BR 112014028070A8 BR 112014028070 A BR112014028070 A BR 112014028070A BR 112014028070 A BR112014028070 A BR 112014028070A BR 112014028070 A8 BR112014028070 A8 BR 112014028070A8
- Authority
- BR
- Brazil
- Prior art keywords
- sealing
- silica gel
- impermeable
- lens assembly
- conductor
- Prior art date
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
tecnologia de vedação para módulo de led um processo de vedação dos módulos de led, no campo da iluminação de led, compreendendo: (1) um condutor impermeável atravessa por um furo passante de um dissipador de calor para ser ligado a pontos de solda de polos positivo-negativo numa placa pcb, caracterizado em que os pontos de solda de polos positivo-negativo e a posição na qual o condutor impermeável atravessam são submetidos a um tratamento de vedação com adesivo, e um processo de vedação impermeável é operado entre o condutor impermeável e o furo passante; (2) fixar a placa pcb no dissipador de calor;(3) posicionar um anel de vedação no interior de um dos canais;(4) aplicar uniformemente um anel de sílica gel líquida ao longo do outro canal do conjunto de lentes e a quantidade de sílica gel líquida é limitada para aderir completamente o anel de sílica gel sólida;(5) o dissipador de calor instalado com a placa pcb e o condutor impermeável como processados na etapa (2) são inversamente ancorados no conjunto de lentes que são situadas com o anel sílica gel sólida e sílica gel líquida como processado na etapa (4), a fim de fixar a totalidade do dissipador de calor e o conjunto de lentes. pelo menos dois anéis de vedação impermeáveis são usados para isolar completamente um chip de led do exterior a fim de evitar que qualquer vapor de água ou outros gases nocivos produzam a corrosão do chip e da placa pcb, e os anéis de vedação são mais firmes quando são comparados com a vedação de filme fino; a vida útil é mais longa e as garantias do desempenho da vedação entre o conjunto de lentes e o quadro de radiação de calor são efetuadas.led module sealing technology a sealing process of led modules in the field of led lighting comprising: (1) an impermeable conductor passes through a through hole of a heatsink to be connected to pole welding points Positive-negative on a PCB plate, characterized in that the positive-negative pole welding points and the position at which the impermeable conductor crosses are subjected to an adhesive sealing treatment, and an impermeable sealing process is operated between the impermeable conductor. and the through hole; (2) attach the pcb plate to the heatsink, (3) position a sealing ring inside one of the channels, (4) uniformly apply a liquid silica gel ring along the other channel of the lens assembly and the amount Liquid silica gel is limited to completely adhere to the solid silica gel ring; (5) the heat sink installed with the pcb plate and the waterproof conductor as processed in step (2) are inversely anchored to the lens assembly which is situated with the solid silica gel ring and liquid silica gel as processed in step (4) to secure the entire heat sink and lens assembly. At least two impermeable gaskets are used to completely insulate an LED chip from the outside to prevent any water vapor or other harmful gases from corrosion of the chip and pcb board, and gaskets are firmer when are compared to thin film sealing; The service life is longer and the sealing performance between the lens assembly and the heat radiation frame is guaranteed.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210188159.1 | 2012-06-08 | ||
| CN201210188159.1A CN103471066B (en) | 2012-06-08 | 2012-06-08 | A kind of sealing technology of LED module |
| CN201320278363.2 | 2013-05-21 | ||
| CN 201320278363 CN203273043U (en) | 2013-05-21 | 2013-05-21 | Wire-passing hole sealing device |
| CN201310189101.3A CN104180079B (en) | 2013-05-21 | 2013-05-21 | Wire penetrating hole sealing device |
| CN201310189101.3 | 2013-05-21 | ||
| PCT/CN2013/076937 WO2013182077A1 (en) | 2012-06-08 | 2013-06-07 | An led module sealing technology |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| BR112014028070A2 BR112014028070A2 (en) | 2017-08-08 |
| BR112014028070A8 true BR112014028070A8 (en) | 2019-08-06 |
| BR112014028070B1 BR112014028070B1 (en) | 2020-11-17 |
Family
ID=49796034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014028070-3A BR112014028070B1 (en) | 2012-06-08 | 2013-06-07 | sealing process for led module and sealing process of a led lighting device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103471066B (en) |
| BR (1) | BR112014028070B1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104296025A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with protective packaging |
| CN104296026A (en) * | 2014-09-05 | 2015-01-21 | 成都赛昂电子科技有限公司 | Light-emitting diode lamp with gold bump soldering |
| BR202022001001U2 (en) * | 2022-01-19 | 2022-09-06 | Stella Imp E Exportacao De Luminarias Ltda | CONSTRUCTIVE LAYOUT IN CONNECTOR FOR EXTERNAL LIGHTING PRODUCTS |
| CN115296139B (en) * | 2022-10-11 | 2022-12-30 | 昆山三智达自动化设备科技有限公司 | COS assembling method and equipment based on modular base |
| CN218626764U (en) * | 2022-10-31 | 2023-03-14 | 何季岭 | Waterproof festival lamp |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100657590B1 (en) * | 2006-09-19 | 2006-12-14 | 주식회사 누리플랜 | Line type led lighting of capsule style |
| CN101769457A (en) * | 2009-12-25 | 2010-07-07 | 大连好利维尔科技发展有限公司 | Production method of high-power LED illuminating lamp and lamp |
| CN202118617U (en) * | 2011-06-17 | 2012-01-18 | 杭州华普永明光电股份有限公司 | LED (light-emitting diode) lighting device |
-
2012
- 2012-06-08 CN CN201210188159.1A patent/CN103471066B/en active Active
-
2013
- 2013-06-07 BR BR112014028070-3A patent/BR112014028070B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| BR112014028070B1 (en) | 2020-11-17 |
| BR112014028070A2 (en) | 2017-08-08 |
| CN103471066A (en) | 2013-12-25 |
| CN103471066B (en) | 2015-12-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according art. 34 industrial property law | ||
| B06G | Technical and formal requirements: other requirements |
Free format text: APRESENTE A TRADUCAO SIMPLES DAS FOLHAS DE ROSTO DAS CERTIDOES DE DEPOSITO DAS PRIORIDADES CN 201210188159.1, CN 201320278363.2 E CN 201310189101.3; OU DECLARACOES DE QUE OS DADOS DO PEDIDO INTERNACIONAL ESTAO FIELMENTE CONTIDOS NAS PRIORIDADES REIVINDICADAS, CONTENDO TODOS OS DADOS IDENTIFICADORES DESTAS (TITULARES, NUMERO DE REGISTRO, DATA E TITULO), CONFORME O PARAGRAFO UNICO DO ART. 25 DA RESOLUCAO 77/2013. CABE SALIENTAR QUE NAO FOI POSSIVEL IDENTIFICAR OS TITULARES DOS PEDIDOS PRIORITARIOS NOS DOCUMENTOS JUNTADOS AO PROCESSO, TAMPOUCO NOS APRESENTADOS NA OMPI, POIS SE ENCONTRAM EM CHINES. TAL INFORMACAO E NECESSARIA PARA O EXAME DA OBRIGATORIEDADE DE APRESENTACAO DE CESSAO DOS DOCUMENT |
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| B06H | Technical and formal requirements: requirement cancelled |
Free format text: ANULADA A PUBLICACAO CODIGO 6.7 NA RPI NO 2531 DE 09/07/2019 PELA QUESTAO JA TER SIDO RESPONDIDA POR PETICAO PROTOCOLADA ANTES DA PUBLICACAO DESTA. |
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| B07A | Technical examination (opinion): publication of technical examination (opinion) | ||
| B09A | Decision: intention to grant | ||
| B16A | Patent or certificate of addition of invention granted |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/06/2013, OBSERVADAS AS CONDICOES LEGAIS. |