BR112014015510A2 - aparelho de montagem de dissipador de calor, dissipador de calor para uso com o aparelho e método para montar um dissipador de calor - Google Patents

aparelho de montagem de dissipador de calor, dissipador de calor para uso com o aparelho e método para montar um dissipador de calor

Info

Publication number
BR112014015510A2
BR112014015510A2 BR112014015510A BR112014015510A BR112014015510A2 BR 112014015510 A2 BR112014015510 A2 BR 112014015510A2 BR 112014015510 A BR112014015510 A BR 112014015510A BR 112014015510 A BR112014015510 A BR 112014015510A BR 112014015510 A2 BR112014015510 A2 BR 112014015510A2
Authority
BR
Brazil
Prior art keywords
heat sink
mounting
mounting apparatus
heat
sink
Prior art date
Application number
BR112014015510A
Other languages
English (en)
Other versions
BR112014015510A8 (pt
Inventor
Stokes Martin
Original Assignee
Vetco Gray Controls Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vetco Gray Controls Ltd filed Critical Vetco Gray Controls Ltd
Publication of BR112014015510A2 publication Critical patent/BR112014015510A2/pt
Publication of BR112014015510A8 publication Critical patent/BR112014015510A8/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49945—Assembling or joining by driven force fit
BR112014015510A 2011-12-16 2012-12-17 aparelho de montagem de dissipador de calor, dissipador de calor para uso com o aparelho e método para montar um dissipador de calor BR112014015510A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11193976.5A EP2605627B1 (en) 2011-12-16 2011-12-16 Heat sink mounting apparatus and method
PCT/EP2012/075848 WO2013087938A1 (en) 2011-12-16 2012-12-17 Heat sink mounting apparatus and method

Publications (2)

Publication Number Publication Date
BR112014015510A2 true BR112014015510A2 (pt) 2017-06-13
BR112014015510A8 BR112014015510A8 (pt) 2017-07-04

Family

ID=47469982

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014015510A BR112014015510A8 (pt) 2011-12-16 2012-12-17 aparelho de montagem de dissipador de calor, dissipador de calor para uso com o aparelho e método para montar um dissipador de calor

Country Status (7)

Country Link
US (1) US9772147B2 (pt)
EP (1) EP2605627B1 (pt)
CN (1) CN104137661A (pt)
AU (1) AU2012351487C1 (pt)
BR (1) BR112014015510A8 (pt)
SG (2) SG11201403271PA (pt)
WO (1) WO2013087938A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3332295A4 (en) * 2015-08-05 2019-01-02 Tetrascience, Inc. Methods, systems, and devices for monitoring and controlling tools

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096547A (en) * 1976-12-17 1978-06-20 Calabro Anthony Denis Heat transfer mounting device for metallic printed circuit boards
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4607277A (en) * 1982-03-16 1986-08-19 International Business Machines Corporation Semiconductor assembly employing noneutectic alloy for heat dissipation
DE3245072A1 (de) * 1982-12-06 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Thermische steckverbindung
US4625260A (en) * 1984-08-24 1986-11-25 Thermalloy Incorporated Fasteners for surface mounting of printed circuit board components
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
DE3830376A1 (de) * 1988-09-07 1990-03-15 Daimler Benz Ag Einrichtung zur befestigung von elektronischen modulen an einem basisteil
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
US5138524A (en) * 1991-09-19 1992-08-11 Thermalloy Incorporated Apparatus for securing electronic device packages to heat sinks
DE4400499C2 (de) 1994-01-11 1996-05-02 Itt Cannon Gmbh Kontaktfeder-Anordnung
EP0833406A3 (de) 1996-09-26 1999-02-17 Siemens Aktiengesellschaft Einpressstift mit einem elastischen Einpressbereich
JP2005129275A (ja) 2003-10-21 2005-05-19 Fujitsu Ten Ltd コネクタ固定構造
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
WO2008114444A1 (ja) * 2007-03-20 2008-09-25 Fujitsu Limited 電子装置の放熱構造及び回路基板ユニット及び筐体
GB2460680B (en) * 2008-06-05 2012-03-07 Vetco Gray Controls Ltd Subsea electronics module

Also Published As

Publication number Publication date
AU2012351487B2 (en) 2017-02-02
EP2605627A1 (en) 2013-06-19
US9772147B2 (en) 2017-09-26
BR112014015510A8 (pt) 2017-07-04
AU2012351487C1 (en) 2017-07-13
US20140305623A1 (en) 2014-10-16
SG11201403271PA (en) 2014-08-28
AU2012351487A1 (en) 2014-07-10
SG10201604768RA (en) 2016-07-28
WO2013087938A1 (en) 2013-06-20
EP2605627B1 (en) 2017-06-28
CN104137661A (zh) 2014-11-05

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: GE OIL AND GAS UK LIMITED (GB)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements
B350 Update of information on the portal [chapter 15.35 patent gazette]