SG10201604768RA - Heat sink mounting apparatus and method - Google Patents

Heat sink mounting apparatus and method

Info

Publication number
SG10201604768RA
SG10201604768RA SG10201604768RA SG10201604768RA SG10201604768RA SG 10201604768R A SG10201604768R A SG 10201604768RA SG 10201604768R A SG10201604768R A SG 10201604768RA SG 10201604768R A SG10201604768R A SG 10201604768RA SG 10201604768R A SG10201604768R A SG 10201604768RA
Authority
SG
Singapore
Prior art keywords
heat sink
mounting apparatus
sink mounting
heat
sink
Prior art date
Application number
SG10201604768RA
Inventor
Martin Stokes
Original Assignee
Ge Oil & Gas Uk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ge Oil & Gas Uk Ltd filed Critical Ge Oil & Gas Uk Ltd
Publication of SG10201604768RA publication Critical patent/SG10201604768RA/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49945—Assembling or joining by driven force fit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG10201604768RA 2011-12-16 2012-12-17 Heat sink mounting apparatus and method SG10201604768RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11193976.5A EP2605627B1 (en) 2011-12-16 2011-12-16 Heat sink mounting apparatus and method

Publications (1)

Publication Number Publication Date
SG10201604768RA true SG10201604768RA (en) 2016-07-28

Family

ID=47469982

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201604768RA SG10201604768RA (en) 2011-12-16 2012-12-17 Heat sink mounting apparatus and method
SG11201403271PA SG11201403271PA (en) 2011-12-16 2012-12-17 Heat sink mounting apparatus and method

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201403271PA SG11201403271PA (en) 2011-12-16 2012-12-17 Heat sink mounting apparatus and method

Country Status (7)

Country Link
US (1) US9772147B2 (en)
EP (1) EP2605627B1 (en)
CN (1) CN104137661A (en)
AU (1) AU2012351487C1 (en)
BR (1) BR112014015510A8 (en)
SG (2) SG10201604768RA (en)
WO (1) WO2013087938A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180231946A1 (en) * 2015-08-05 2018-08-16 Tetrascience, Inc. Methods, Systems, and Devices for Monitoring and Controlling Tools

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4096547A (en) * 1976-12-17 1978-06-20 Calabro Anthony Denis Heat transfer mounting device for metallic printed circuit boards
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4607277A (en) * 1982-03-16 1986-08-19 International Business Machines Corporation Semiconductor assembly employing noneutectic alloy for heat dissipation
DE3245072A1 (en) * 1982-12-06 1984-06-07 Siemens AG, 1000 Berlin und 8000 München Thermal plug connection
US4625260A (en) * 1984-08-24 1986-11-25 Thermalloy Incorporated Fasteners for surface mounting of printed circuit board components
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
JPH063831B2 (en) * 1987-04-08 1994-01-12 株式会社日立製作所 Cooling device and semiconductor device using the same
DE3830376A1 (en) * 1988-09-07 1990-03-15 Daimler Benz Ag Device for mounting an electronic module on a base part
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
US5138524A (en) * 1991-09-19 1992-08-11 Thermalloy Incorporated Apparatus for securing electronic device packages to heat sinks
DE4400499C2 (en) 1994-01-11 1996-05-02 Itt Cannon Gmbh Contact spring arrangement
EP0833406A3 (en) 1996-09-26 1999-02-17 Siemens Aktiengesellschaft Press-fit pin with elastic press-fit portion
JP2005129275A (en) 2003-10-21 2005-05-19 Fujitsu Ten Ltd Connector fixing structure
US7188661B2 (en) * 2003-11-13 2007-03-13 Thermamasters, Llc Process for joining members of a heat transfer assembly and assembly formed thereby
WO2008114444A1 (en) * 2007-03-20 2008-09-25 Fujitsu Limited Radiation structure for electronic device, circuit substrate unit, and casing
GB2460680B (en) * 2008-06-05 2012-03-07 Vetco Gray Controls Ltd Subsea electronics module

Also Published As

Publication number Publication date
AU2012351487A1 (en) 2014-07-10
US9772147B2 (en) 2017-09-26
EP2605627B1 (en) 2017-06-28
CN104137661A (en) 2014-11-05
AU2012351487B2 (en) 2017-02-02
WO2013087938A1 (en) 2013-06-20
BR112014015510A2 (en) 2017-06-13
US20140305623A1 (en) 2014-10-16
SG11201403271PA (en) 2014-08-28
AU2012351487C1 (en) 2017-07-13
BR112014015510A8 (en) 2017-07-04
EP2605627A1 (en) 2013-06-19

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