BR112014011318A2 - empresa de computação - Google Patents

empresa de computação

Info

Publication number
BR112014011318A2
BR112014011318A2 BR112014011318A BR112014011318A BR112014011318A2 BR 112014011318 A2 BR112014011318 A2 BR 112014011318A2 BR 112014011318 A BR112014011318 A BR 112014011318A BR 112014011318 A BR112014011318 A BR 112014011318A BR 112014011318 A2 BR112014011318 A2 BR 112014011318A2
Authority
BR
Brazil
Prior art keywords
computer company
company
computer
Prior art date
Application number
BR112014011318A
Other languages
English (en)
Portuguese (pt)
Inventor
A Sullivan Jason
Original Assignee
A Sullivan Jason
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by A Sullivan Jason filed Critical A Sullivan Jason
Publication of BR112014011318A2 publication Critical patent/BR112014011318A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1497—Rooms for data centers; Shipping containers therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • User Interface Of Digital Computer (AREA)
  • Casings For Electric Apparatus (AREA)
BR112014011318A 2011-11-10 2012-11-12 empresa de computação BR112014011318A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161558433P 2011-11-10 2011-11-10
US13/674,056 US20130308266A1 (en) 2011-11-10 2012-11-11 Providing and dynamically mounting and housing processing control units
PCT/US2012/064679 WO2013071240A1 (en) 2011-11-10 2012-11-12 Providing and dynamically mounting and housing processing control units

Publications (1)

Publication Number Publication Date
BR112014011318A2 true BR112014011318A2 (pt) 2017-05-09

Family

ID=48290661

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014011318A BR112014011318A2 (pt) 2011-11-10 2012-11-12 empresa de computação

Country Status (13)

Country Link
US (1) US20130308266A1 (enrdf_load_stackoverflow)
EP (1) EP2776899A4 (enrdf_load_stackoverflow)
JP (1) JP2015501978A (enrdf_load_stackoverflow)
KR (1) KR20140103265A (enrdf_load_stackoverflow)
CN (1) CN104094188A (enrdf_load_stackoverflow)
AU (1) AU2012334987A1 (enrdf_load_stackoverflow)
BR (1) BR112014011318A2 (enrdf_load_stackoverflow)
CA (1) CA2854900A1 (enrdf_load_stackoverflow)
HK (1) HK1202933A1 (enrdf_load_stackoverflow)
IL (1) IL232474A0 (enrdf_load_stackoverflow)
MX (1) MX2014005706A (enrdf_load_stackoverflow)
RU (1) RU2014122124A (enrdf_load_stackoverflow)
WO (1) WO2013071240A1 (enrdf_load_stackoverflow)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MXPA05004336A (es) 2002-10-22 2005-11-23 A Sullivan Jason Sistemas y metodos para proporcionar una unidad de procesamiento dinamicamente modular.
AU2003285949A1 (en) 2002-10-22 2004-05-13 Isys Technologies Non-peripherals processing control module having improved heat dissipating properties
CA2504222C (en) 2002-10-22 2012-05-22 Jason A. Sullivan Robust customizable computer processing system
US9513667B2 (en) 2012-05-29 2016-12-06 Google Technology Holdings LLC Methods, apparatuses, and systems for radio frequency management between devices
US20130319640A1 (en) * 2012-06-04 2013-12-05 Motorola Mobility Llc Methods, apparatuses, and systems for thermal management between devices
USD765613S1 (en) * 2013-04-03 2016-09-06 Inter Control Hermann Kohler Elektrik Gmbh & Co. Kg Housing for electric and electronic components
US9317081B2 (en) * 2013-09-11 2016-04-19 Dell Products Lp Disk drive carriers and mountable hard drive systems with improved air flow
US9141153B2 (en) 2013-09-11 2015-09-22 Dell Products Lp Hard disk drive assemblies with open side wall areas
US9445531B1 (en) * 2015-05-01 2016-09-13 Baidu Usa Llc Air washing for open air cooling of data centers
US9622379B1 (en) * 2015-10-29 2017-04-11 International Business Machines Corporation Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
US9801308B2 (en) * 2016-03-09 2017-10-24 Dell Products Lp Managing cable connections and air flow in a data center
RU176323U1 (ru) * 2017-02-22 2018-01-17 Павел Александрович Стрельников Система охлаждения персонального компьютера по принципу теплообменных камер
DE102017105553A1 (de) * 2017-03-15 2018-09-20 Fujitsu Technology Solutions Intellectual Property Gmbh Computersystem umfassend ein Computergehäuse mit einer Befestigungsvorrichtung
KR20190063002A (ko) 2017-11-29 2019-06-07 주식회사일렉에프에이 덕트와 레일의 마운팅 시스템
KR101978430B1 (ko) * 2018-08-22 2019-05-14 주식회사 아이티스퀘어 탈부착 가능한 내함을 갖는 2중 구조의 함체
US10595438B1 (en) * 2019-03-22 2020-03-17 Agylstor, Inc. Rugged digital mass storage device
USD933666S1 (en) * 2019-05-24 2021-10-19 Axis Ab Data processing device
USD932494S1 (en) * 2019-05-24 2021-10-05 Axis Ab Data processing device
TWI715188B (zh) * 2019-09-09 2021-01-01 英業達股份有限公司 處理模組

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694099U (enrdf_load_stackoverflow) * 1979-12-21 1981-07-25
JP2545467B2 (ja) * 1989-09-26 1996-10-16 株式会社日立製作所 電子装置の放熱構造
US5121290A (en) * 1990-06-25 1992-06-09 At&T Bell Laboratories Circuit pack cooling using perforations
JPH11177265A (ja) * 1997-12-05 1999-07-02 Nec Corp 筺体冷却方式
CA2415770C (en) * 2000-07-17 2010-04-27 Galactic Computing Corporation Method and system for providing dynamic hosted service management
JP4397109B2 (ja) * 2000-08-14 2010-01-13 富士通株式会社 情報処理装置及びクロスバーボードユニット・バックパネル組立体の製造方法
US6388880B1 (en) * 2000-10-19 2002-05-14 Fijitsu Network Communications, Inc. Removable fan tray assembly with latching features
US6690576B2 (en) * 2001-07-31 2004-02-10 Hewlett Packard Development Company, L.P. Externally mounted on-line replaceable fan module
US6714411B2 (en) * 2001-12-31 2004-03-30 Hewlett-Packard Development Company, L.P. Computer server hot plug fan tray assembly and method of fan removal
US20040264145A1 (en) * 2003-05-08 2004-12-30 Miller Greg F. Compact electronic component system and method
US6975510B1 (en) * 2003-05-09 2005-12-13 Linux Networx Ventilated housing for electronic components
US7075788B2 (en) * 2003-06-11 2006-07-11 Hewlett-Packard Development Company, L.P. Computer cooling system and method
US7310737B2 (en) * 2003-06-30 2007-12-18 Hewlett-Packard Development Company, L.P. Cooling system for computer systems
US7508663B2 (en) 2003-12-29 2009-03-24 Rackable Systems, Inc. Computer rack cooling system with variable airflow impedance
US20050237716A1 (en) * 2004-04-21 2005-10-27 International Business Machines Corporation Air flow system and method for facilitating cooling of stacked electronics components
US7372695B2 (en) * 2004-05-07 2008-05-13 Rackable Systems, Inc. Directional fan assembly
US7408772B2 (en) * 2004-05-14 2008-08-05 Hewlett-Packard Development Company, L.P. Fan tray electronics enclosure
US20060158844A1 (en) * 2005-01-18 2006-07-20 Frederick Lee Heat dissipation mechanism for a base plate
JP4778246B2 (ja) * 2005-03-16 2011-09-21 日本電気株式会社 無線基地局装置
US7385810B2 (en) * 2005-04-18 2008-06-10 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
US20060256522A1 (en) * 2005-05-10 2006-11-16 Intel Corporation Method and apparatus to maintain chassis air flow during replacement of a fan module in a fan tray
US7414837B2 (en) * 2005-11-01 2008-08-19 Adlink Technology Inc. ATCA board compatible hard disk mounting structure
US8783051B2 (en) * 2007-04-02 2014-07-22 Hewlett-Packard Development Company, L.P. Data processing system storage unit, data processing system cooling apparatus and data processing system
JP2010524074A (ja) * 2007-04-05 2010-07-15 ジグシンスキー、イェクティエル 強制冷却される電子部品用集積キャビネット／ラック
JP4400662B2 (ja) * 2007-09-12 2010-01-20 株式会社デンソー 電子回路部品実装構造
US20090255653A1 (en) * 2008-04-11 2009-10-15 Dell Products L.P. System and Method for Cooling a Rack
JP4951596B2 (ja) * 2008-07-31 2012-06-13 株式会社日立製作所 冷却システム及び電子装置
JP2010041007A (ja) * 2008-08-08 2010-02-18 Hitachi Information & Communication Engineering Ltd 冷却ユニット、電子装置ラック、冷却システム及びその構築方法
US8355246B2 (en) * 2008-09-18 2013-01-15 Linhares Jr Manuel D Modular air management devices
US7907398B2 (en) * 2008-10-02 2011-03-15 Dell Products L.P. Liquid cooling system
US7869210B2 (en) * 2008-10-08 2011-01-11 Dell Products L.P. Temperature control for an information handling system rack
CN101742876B (zh) * 2008-11-21 2012-07-04 英业达股份有限公司 组合式风扇框架
US8783336B2 (en) 2008-12-04 2014-07-22 Io Data Centers, Llc Apparatus and method of environmental condition management for electronic equipment
US8068340B1 (en) * 2009-06-26 2011-11-29 Juniper Networks, Inc. Power supply with reversible airflow design
US9723759B2 (en) * 2009-11-30 2017-08-01 Facebook, Inc. Cooling servers in a data center using fans external to servers
JP4818429B2 (ja) * 2009-12-28 2011-11-16 株式会社東芝 電子機器
US8203837B2 (en) * 2010-03-31 2012-06-19 Hewlett-Packard Developmet Company, L.P. Cooling system
US8441793B2 (en) * 2010-07-21 2013-05-14 Birchbridge Incorporated Universal rack backplane system
TW201221035A (en) * 2010-11-05 2012-05-16 Inventec Corp Server rack
TWI392997B (zh) * 2010-11-05 2013-04-11 Inventec Corp 伺服器之冷卻循環系統
US8582292B1 (en) * 2010-12-27 2013-11-12 Amazon Technologies, Inc. Integrated ventilation system for electronic equipment
JP5307853B2 (ja) * 2011-06-02 2013-10-02 日本電気株式会社 ファンユニット
US8605434B2 (en) * 2012-05-01 2013-12-10 Adlink Technology Inc. Wall-mounting structure for wall-mounted electronic device

Also Published As

Publication number Publication date
CA2854900A1 (en) 2013-05-16
MX2014005706A (es) 2014-11-10
US20130308266A1 (en) 2013-11-21
KR20140103265A (ko) 2014-08-26
EP2776899A4 (en) 2015-07-29
CN104094188A (zh) 2014-10-08
WO2013071240A1 (en) 2013-05-16
IL232474A0 (en) 2014-06-30
EP2776899A1 (en) 2014-09-17
RU2014122124A (ru) 2015-12-20
JP2015501978A (ja) 2015-01-19
AU2012334987A1 (en) 2014-06-05
HK1202933A1 (en) 2015-10-09

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]