BR112014009888A2 - estrutura micromecânica e sensor de pressão diferencial - Google Patents
estrutura micromecânica e sensor de pressão diferencialInfo
- Publication number
- BR112014009888A2 BR112014009888A2 BR112014009888A BR112014009888A BR112014009888A2 BR 112014009888 A2 BR112014009888 A2 BR 112014009888A2 BR 112014009888 A BR112014009888 A BR 112014009888A BR 112014009888 A BR112014009888 A BR 112014009888A BR 112014009888 A2 BR112014009888 A2 BR 112014009888A2
- Authority
- BR
- Brazil
- Prior art keywords
- pressure sensor
- differential pressure
- micromechanical structure
- micromechanical
- differential
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0047—Diaphragm with non uniform thickness, e.g. with grooves, bosses or continuously varying thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0097—Devices comprising flexible or deformable elements not provided for in groups B81B3/0002 - B81B3/0094
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0618—Overload protection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1159726 | 2011-10-26 | ||
| FR1159726A FR2982023B1 (fr) | 2011-10-26 | 2011-10-26 | Structure micromecanique a membrane deformable et a protection contre de fortes deformations |
| PCT/EP2012/071000 WO2013060697A1 (fr) | 2011-10-26 | 2012-10-24 | Structure micromecanique a membrane deformable et a protection contre de fortes deformations |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR112014009888A2 true BR112014009888A2 (pt) | 2017-04-25 |
| BR112014009888B1 BR112014009888B1 (pt) | 2020-10-27 |
Family
ID=47076229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014009888-3A BR112014009888B1 (pt) | 2011-10-26 | 2012-10-24 | estrutura micromecânica e sensor de pressão diferencial |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9470592B2 (pt) |
| EP (1) | EP2771661B1 (pt) |
| JP (1) | JP6022587B2 (pt) |
| CN (1) | CN104024816B (pt) |
| BR (1) | BR112014009888B1 (pt) |
| CA (1) | CA2852847C (pt) |
| ES (1) | ES2725557T3 (pt) |
| FR (1) | FR2982023B1 (pt) |
| WO (1) | WO2013060697A1 (pt) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3007134B1 (fr) * | 2013-06-17 | 2018-11-16 | Auxitrol S.A. | Systeme de mesure de pression discriminant une panne d'une surpression ou d'une depression |
| US8921957B1 (en) * | 2013-10-11 | 2014-12-30 | Robert Bosch Gmbh | Method of improving MEMS microphone mechanical stability |
| US9410861B2 (en) * | 2014-03-25 | 2016-08-09 | Honeywell International Inc. | Pressure sensor with overpressure protection |
| US9369804B2 (en) * | 2014-07-28 | 2016-06-14 | Robert Bosch Gmbh | MEMS membrane overtravel stop |
| US9890033B2 (en) * | 2015-04-06 | 2018-02-13 | Honeywell International Inc. | Silicon-on-sapphire device with minimal thermal strain preload and enhanced stability at high temperature |
| US9963340B2 (en) | 2015-12-03 | 2018-05-08 | Honeywell International Inc. | Pressure sensor die over pressure protection for high over pressure to operating span ratios |
| US10197462B2 (en) * | 2016-05-25 | 2019-02-05 | Honeywell International Inc. | Differential pressure sensor full overpressure protection device |
| US10589983B2 (en) * | 2016-09-07 | 2020-03-17 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Silicon carbide microelectromechanical structure, device, and method |
| DE102017213354A1 (de) * | 2017-08-02 | 2019-02-07 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
| DE102018222730A1 (de) | 2018-12-21 | 2020-06-25 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
| DE102019205349A1 (de) * | 2019-04-12 | 2020-10-15 | Robert Bosch Gmbh | Mikromechanisches Bauteil für eine kapazitive Sensor- oder Schaltervorrichtung |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06105787B2 (ja) * | 1983-02-25 | 1994-12-21 | 株式会社日立製作所 | 高耐圧圧力センサ |
| JPH0629819B2 (ja) * | 1985-12-20 | 1994-04-20 | 株式会社東芝 | 半導体圧力センサ |
| US5062302A (en) * | 1988-04-29 | 1991-11-05 | Schlumberger Industries, Inc. | Laminated semiconductor sensor with overpressure protection |
| EP0339981A3 (en) * | 1988-04-29 | 1991-10-09 | Schlumberger Industries, Inc. | Laminated semiconductor sensor with overpressure protection |
| US4949581A (en) * | 1989-06-15 | 1990-08-21 | Rosemount Inc. | Extended measurement capability transmitter having shared overpressure protection means |
| US5333504A (en) * | 1992-09-01 | 1994-08-02 | Rosemount Inc. | High overpressure low range pressure sensor |
| FR2859281B1 (fr) * | 2003-09-02 | 2005-12-23 | Auxitrol Sa | Protection d'une membrane deformable contre de fortes deformations dans une structure micromecanique |
| EP2524390B1 (de) * | 2010-01-11 | 2014-08-27 | ELMOS Semiconductor AG | Mikroelektromechanisches halbleitersensorbauelement |
| FR2987892B1 (fr) * | 2012-03-06 | 2014-04-18 | Auxitrol Sa | Procede de fabrication d'un capteur de pression et capteur correspondant |
-
2011
- 2011-10-26 FR FR1159726A patent/FR2982023B1/fr active Active
-
2012
- 2012-10-24 US US14/354,113 patent/US9470592B2/en active Active
- 2012-10-24 CA CA2852847A patent/CA2852847C/fr active Active
- 2012-10-24 ES ES12778331T patent/ES2725557T3/es active Active
- 2012-10-24 CN CN201280052198.7A patent/CN104024816B/zh active Active
- 2012-10-24 EP EP12778331.4A patent/EP2771661B1/fr active Active
- 2012-10-24 WO PCT/EP2012/071000 patent/WO2013060697A1/fr active Application Filing
- 2012-10-24 BR BR112014009888-3A patent/BR112014009888B1/pt active IP Right Grant
- 2012-10-24 JP JP2014537585A patent/JP6022587B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2771661B1 (fr) | 2019-02-20 |
| ES2725557T3 (es) | 2019-09-24 |
| JP6022587B2 (ja) | 2016-11-09 |
| BR112014009888B1 (pt) | 2020-10-27 |
| CA2852847A1 (fr) | 2013-05-02 |
| FR2982023A1 (fr) | 2013-05-03 |
| CN104024816B (zh) | 2016-03-09 |
| WO2013060697A1 (fr) | 2013-05-02 |
| FR2982023B1 (fr) | 2015-03-06 |
| CA2852847C (fr) | 2020-09-15 |
| JP2014531034A (ja) | 2014-11-20 |
| EP2771661A1 (fr) | 2014-09-03 |
| CN104024816A (zh) | 2014-09-03 |
| US9470592B2 (en) | 2016-10-18 |
| US20140290375A1 (en) | 2014-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/10/2012, OBSERVADAS AS CONDICOES LEGAIS. |