BR112014008745A2 - composição de moldagem termoplástica, processo para produzir uma composição de moldagem termoplástica, peça moldada, e, uso de uma composição de moldagem termoplástica - Google Patents
composição de moldagem termoplástica, processo para produzir uma composição de moldagem termoplástica, peça moldada, e, uso de uma composição de moldagem termoplásticaInfo
- Publication number
- BR112014008745A2 BR112014008745A2 BR112014008745A BR112014008745A BR112014008745A2 BR 112014008745 A2 BR112014008745 A2 BR 112014008745A2 BR 112014008745 A BR112014008745 A BR 112014008745A BR 112014008745 A BR112014008745 A BR 112014008745A BR 112014008745 A2 BR112014008745 A2 BR 112014008745A2
- Authority
- BR
- Brazil
- Prior art keywords
- molding composition
- thermoplastic molding
- producing
- molded part
- thermoplastic
- Prior art date
Links
- 238000009757 thermoplastic moulding Methods 0.000 title 3
- 238000000034 method Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/06—Polysulfones; Polyethersulfones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/08—Ingredients agglomerated by treatment with a binding agent
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11184585.5A EP2581404A1 (de) | 2011-10-11 | 2011-10-11 | Thermoplastische Formmasse und daraus hergestellte Formteile mit verbesserter Verschleißfestigkeit |
| PCT/EP2012/069990 WO2013053723A1 (de) | 2011-10-11 | 2012-10-10 | Thermoplastische formmasse und daraus hergestellte formteile mit verbesserter verschleissfestigkeit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112014008745A2 true BR112014008745A2 (pt) | 2017-04-18 |
Family
ID=47022650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014008745A BR112014008745A2 (pt) | 2011-10-11 | 2012-10-10 | composição de moldagem termoplástica, processo para produzir uma composição de moldagem termoplástica, peça moldada, e, uso de uma composição de moldagem termoplástica |
Country Status (7)
| Country | Link |
|---|---|
| EP (2) | EP2581404A1 (https=) |
| JP (1) | JP6169086B2 (https=) |
| KR (1) | KR101990657B1 (https=) |
| CN (1) | CN103975008B (https=) |
| BR (1) | BR112014008745A2 (https=) |
| IN (1) | IN2014CN02729A (https=) |
| WO (1) | WO2013053723A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL2818502T3 (pl) * | 2013-06-28 | 2017-04-28 | Altachem N.V. | Element zaworu |
| ES2813051T3 (es) * | 2017-05-03 | 2021-03-22 | Kaeser Kompressoren Se | Compresor helicoidal con revestimiento de varias capas de los tornillos de rotor |
| KR102117742B1 (ko) | 2017-12-31 | 2020-06-01 | 롯데첨단소재(주) | 열가소성 수지 조성물 및 이로부터 형성된 성형품 |
| CN110815994A (zh) * | 2019-10-23 | 2020-02-21 | 嘉善双飞润滑材料有限公司 | 一种三层复合自润滑材料及其连续生产工艺 |
| EP3945107A1 (de) * | 2020-07-28 | 2022-02-02 | Evonik Operations GmbH | Thermoplastische zusammensetzungen von polyetheretherketonen mit verbesserten tribologischen materialeigenschaften und verwendung dieser |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1152035A (en) | 1965-09-22 | 1969-05-14 | Marconi Co Ltd | Improvements in or relating to D.C. Restoring Circuits |
| CA1075223A (en) * | 1975-12-12 | 1980-04-08 | Donald G. Needham | Poly (arylene sulfide) antifriction composition |
| CA1246295A (en) | 1982-12-23 | 1988-12-06 | Robert A. Clendinning | Aromatic amorphous thermoplastic terpolymers |
| DE3330154A1 (de) | 1983-08-20 | 1985-03-07 | Basf Ag, 6700 Ludwigshafen | Verfahren zur herstellung von polyethern |
| US4870153A (en) | 1987-10-22 | 1989-09-26 | Amoco Corporation | Novel poly(aryl ether) polymers |
| CA2137477C (en) * | 1993-12-24 | 2002-05-07 | Hideaki Oka | Polyamide and polyamide composition |
| EP0783532A1 (en) * | 1994-09-26 | 1997-07-16 | Empak Inc. | Milled carbon fiber reinforced polymer composition |
| JPH1017770A (ja) * | 1996-06-28 | 1998-01-20 | Kawatetsu Mining Co Ltd | 成形材料用ｐｐｓ樹脂組成物 |
| WO1999043751A1 (en) * | 1998-02-24 | 1999-09-02 | Asahi Kasei Kogyo Kabushiki Kaisya | Polyoxymethylene resin composition |
| US7049362B2 (en) * | 1998-12-28 | 2006-05-23 | Osaka Gas Co.,Ltd. | Resin molded product |
| ATE313432T1 (de) | 2002-06-07 | 2006-01-15 | Ks Gleitlager Gmbh | Gleitlagerverbundwerkstoff |
| DE10329228A1 (de) * | 2003-06-28 | 2005-01-20 | Institut für Verbundwerkstoffe GmbH (IVW) | Polymer-Verbundwerkstoff mit einem Füllmaterial zur Erhöhung der Verschleißfestigkeit |
| DE502004009120D1 (de) * | 2003-10-20 | 2009-04-23 | Ks Gleitlager Gmbh | Formkörper für gleitende Beanspruchung |
| DE102004031283A1 (de) | 2004-06-29 | 2006-02-16 | Sachtleben Chemie Gmbh | Polymere Werkstoffe mit hohen Gehalten an anorganischen Feststoffen und Verfahren zu deren Herstellung |
| DE102006015997A1 (de) | 2006-03-30 | 2007-10-04 | Ensinger Kunststofftechnologie GbR (vertretungsberechtigter Gesellschafter Wilfried Ensinger, 71154 Nufringen) | Verschleißfester Werkstoff |
| BRPI0716577A2 (pt) | 2006-08-25 | 2013-11-05 | Sachtleben Chemie Gmbh | Compósito contendo dióxido de titânio |
| JP5621172B2 (ja) * | 2007-04-23 | 2014-11-05 | ソルベイ スペシャルティ ポリマーズ ユーエスエー エルエルシー | 熱可塑性ポリマー混合物、およびその用途 |
| ES2378641T3 (es) * | 2008-09-08 | 2012-04-16 | Basf Se | Método para la preparación de cuerpos moldeados planos o de láminas |
| CN101974218B (zh) * | 2010-11-12 | 2012-07-11 | 大河宝利材料科技(苏州)有限公司 | 一种笔记本电脑外壳专用pc/abs合金 |
-
2011
- 2011-10-11 EP EP11184585.5A patent/EP2581404A1/de not_active Withdrawn
-
2012
- 2012-10-10 WO PCT/EP2012/069990 patent/WO2013053723A1/de not_active Ceased
- 2012-10-10 JP JP2014535035A patent/JP6169086B2/ja active Active
- 2012-10-10 KR KR1020147012356A patent/KR101990657B1/ko active Active
- 2012-10-10 BR BR112014008745A patent/BR112014008745A2/pt not_active IP Right Cessation
- 2012-10-10 CN CN201280060934.3A patent/CN103975008B/zh active Active
- 2012-10-10 IN IN2729CHN2014 patent/IN2014CN02729A/en unknown
- 2012-10-10 EP EP12772913.5A patent/EP2766415B1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2766415B1 (de) | 2015-08-12 |
| KR20140074385A (ko) | 2014-06-17 |
| WO2013053723A1 (de) | 2013-04-18 |
| EP2581404A1 (de) | 2013-04-17 |
| JP6169086B2 (ja) | 2017-07-26 |
| CN103975008B (zh) | 2016-08-24 |
| KR101990657B1 (ko) | 2019-06-19 |
| IN2014CN02729A (https=) | 2015-07-03 |
| CN103975008A (zh) | 2014-08-06 |
| JP2014528505A (ja) | 2014-10-27 |
| EP2766415A1 (de) | 2014-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application fees: application dismissed [chapter 8.6 patent gazette] | ||
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |