BR112013025887A2 - método para a produção de inserções para passaporte eletrônico - Google Patents

método para a produção de inserções para passaporte eletrônico

Info

Publication number
BR112013025887A2
BR112013025887A2 BR112013025887A BR112013025887A BR112013025887A2 BR 112013025887 A2 BR112013025887 A2 BR 112013025887A2 BR 112013025887 A BR112013025887 A BR 112013025887A BR 112013025887 A BR112013025887 A BR 112013025887A BR 112013025887 A2 BR112013025887 A2 BR 112013025887A2
Authority
BR
Brazil
Prior art keywords
inserts
producing electronic
electronic passport
passport
producing
Prior art date
Application number
BR112013025887A
Other languages
English (en)
Inventor
Anne Ripert
Guillaume Henaut
Pierre Volpe
Yves-Pierre Cuenot
Original Assignee
Smart Packaging Solutions Sps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions Sps filed Critical Smart Packaging Solutions Sps
Publication of BR112013025887A2 publication Critical patent/BR112013025887A2/pt

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49016Antenna or wave energy "plumbing" making
    • Y10T29/49018Antenna or wave energy "plumbing" making with other electrical component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Adornments (AREA)
BR112013025887A 2011-04-05 2012-04-04 método para a produção de inserções para passaporte eletrônico BR112013025887A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1101018A FR2973915B1 (fr) 2011-04-05 2011-04-05 Procede de fabrication d'inserts pour passeport electronique
PCT/FR2012/000127 WO2012136905A1 (fr) 2011-04-05 2012-04-04 Procédé de fabrication d'inserts pour passeport électronique

Publications (1)

Publication Number Publication Date
BR112013025887A2 true BR112013025887A2 (pt) 2016-12-20

Family

ID=44515219

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013025887A BR112013025887A2 (pt) 2011-04-05 2012-04-04 método para a produção de inserções para passaporte eletrônico

Country Status (12)

Country Link
US (1) US9256821B2 (pt)
EP (1) EP2695110B1 (pt)
CN (1) CN103748601A (pt)
BR (1) BR112013025887A2 (pt)
ES (1) ES2550188T3 (pt)
FR (1) FR2973915B1 (pt)
HR (1) HRP20151118T1 (pt)
HU (1) HUE027921T2 (pt)
PL (1) PL2695110T3 (pt)
PT (1) PT2695110E (pt)
RU (1) RU2591016C2 (pt)
WO (1) WO2012136905A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3084613B1 (fr) * 2018-08-06 2020-11-27 Smart Packaging Solutions Insert heterogene et personnalisable pour passeport

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001003188A1 (en) * 1999-07-01 2001-01-11 Intermec Ip Corp. Integrated circuit attachment process and apparatus
RU2158204C1 (ru) * 2000-03-17 2000-10-27 Закрытое акционерное общество "Розан-Файненс" Способ изготовления ламинированных бесконтактных чиповых карт
AU2002361855A1 (en) * 2001-12-24 2003-07-15 Digimarc Id Systems Llc Pet based multi-multi-layer smart cards
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
JP4471971B2 (ja) * 2003-03-12 2010-06-02 ブンデスドゥルッケレイ・ゲーエムベーハー ブックカバーインサートとブック型セキュリティ文書、及びブックカバーインサートとブック型セキュリティ文書の製造方法
TWI284842B (en) * 2003-07-14 2007-08-01 Nec Tokin Corp Communication medium capable of carrying out contactless communication and method of producing the same
JP4860436B2 (ja) * 2006-11-07 2012-01-25 トッパン・フォームズ株式会社 Icカードおよびその製造方法

Also Published As

Publication number Publication date
HRP20151118T1 (hr) 2015-12-04
EP2695110A1 (fr) 2014-02-12
US20140103118A1 (en) 2014-04-17
FR2973915B1 (fr) 2013-11-22
PL2695110T3 (pl) 2016-01-29
RU2013148997A (ru) 2015-05-10
WO2012136905A1 (fr) 2012-10-11
ES2550188T3 (es) 2015-11-05
EP2695110B1 (fr) 2015-07-29
RU2591016C2 (ru) 2016-07-10
PT2695110E (pt) 2015-11-02
FR2973915A1 (fr) 2012-10-12
US9256821B2 (en) 2016-02-09
HUE027921T2 (en) 2016-11-28
CN103748601A (zh) 2014-04-23

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Legal Events

Date Code Title Description
B08F Application fees: dismissal - article 86 of industrial property law

Free format text: REFERENTE A 4A ANUIDADE.

B08K Lapse as no evidence of payment of the annual fee has been furnished to inpi (acc. art. 87)