BR0200848A - Condutores blindados microfabricados - Google Patents

Condutores blindados microfabricados

Info

Publication number
BR0200848A
BR0200848A BR0200848-3A BR0200848A BR0200848A BR 0200848 A BR0200848 A BR 0200848A BR 0200848 A BR0200848 A BR 0200848A BR 0200848 A BR0200848 A BR 0200848A
Authority
BR
Brazil
Prior art keywords
microfabricated
microstructure
shielded conductors
mems
conductors
Prior art date
Application number
BR0200848-3A
Other languages
English (en)
Other versions
BR0200848B1 (pt
Inventor
Peter M Gulvin
Jingkuang Chen
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of BR0200848A publication Critical patent/BR0200848A/pt
Publication of BR0200848B1 publication Critical patent/BR0200848B1/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1637Manufacturing processes molding
    • B41J2/1639Manufacturing processes molding sacrificial molding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1645Manufacturing processes thin film formation thin film formation by spincoating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006Interconnects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14403Structure thereof only for on-demand ink jet heads including a filter

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

"CONDUTORES BLINDADOS MICROFABRICADOS". Uma microestrutura que pode ser usada como uma conexão elétrica num aparelho de sistema eletromecânico microfabricado (MEMS) . A microestrutura pode possuir uma ou mais conexões elétricas para transmissão de sinal. A microestrutura permite que um aparelho MEMS proteja transmissões de sinal contra os efeitos de interferência eletromagnética ou de fluidos condutivos.
BRPI0200848-3A 2001-03-19 2002-03-18 Microestrutura de um sistema eletromecânico microfabricado BR0200848B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/812,498 US6465856B2 (en) 2001-03-19 2001-03-19 Micro-fabricated shielded conductors

Publications (2)

Publication Number Publication Date
BR0200848A true BR0200848A (pt) 2003-03-25
BR0200848B1 BR0200848B1 (pt) 2014-08-05

Family

ID=25209756

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0200848-3A BR0200848B1 (pt) 2001-03-19 2002-03-18 Microestrutura de um sistema eletromecânico microfabricado

Country Status (7)

Country Link
US (1) US6465856B2 (pt)
EP (1) EP1243550B1 (pt)
JP (1) JP2002307697A (pt)
BR (1) BR0200848B1 (pt)
CA (1) CA2375712C (pt)
DE (1) DE60212229T2 (pt)
MX (1) MXPA02002849A (pt)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040213511A1 (en) * 2002-03-19 2004-10-28 Scholz Christopher J. Erbium doped waveguide amplifier (EDWA) with pump reflector
US6952042B2 (en) * 2002-06-17 2005-10-04 Honeywell International, Inc. Microelectromechanical device with integrated conductive shield
US7781850B2 (en) 2002-09-20 2010-08-24 Qualcomm Mems Technologies, Inc. Controlling electromechanical behavior of structures within a microelectromechanical systems device
US7002215B1 (en) * 2002-09-30 2006-02-21 Pts Corporation Floating entrance guard for preventing electrical short circuits
DE10304835A1 (de) * 2003-02-06 2004-08-05 Robert Bosch Gmbh Mikroelektromechanisches Bauelement
US8367215B2 (en) * 2003-10-31 2013-02-05 Epcos Ag Radio-frequency microelectromechanical systems and method of manufacturing such systems
KR101140688B1 (ko) * 2003-10-31 2012-05-03 에프코스 아게 전자 장치 및 그 제조 방법
US7369296B2 (en) 2004-09-27 2008-05-06 Idc, Llc Device and method for modifying actuation voltage thresholds of a deformable membrane in an interferometric modulator
US7373026B2 (en) 2004-09-27 2008-05-13 Idc, Llc MEMS device fabricated on a pre-patterned substrate
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
EP1928780A2 (en) * 2005-09-30 2008-06-11 Qualcomm Mems Technologies, Inc. Mems device and interconnects for same
US7652814B2 (en) 2006-01-27 2010-01-26 Qualcomm Mems Technologies, Inc. MEMS device with integrated optical element
US7643203B2 (en) 2006-04-10 2010-01-05 Qualcomm Mems Technologies, Inc. Interferometric optical display system with broadband characteristics
US7369292B2 (en) 2006-05-03 2008-05-06 Qualcomm Mems Technologies, Inc. Electrode and interconnect materials for MEMS devices
US7706042B2 (en) 2006-12-20 2010-04-27 Qualcomm Mems Technologies, Inc. MEMS device and interconnects for same
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US20090033516A1 (en) * 2007-08-02 2009-02-05 Schlumberger Technology Corporation Instrumented wellbore tools and methods
US8566759B2 (en) * 2007-08-24 2013-10-22 International Business Machines Corporation Structure for on chip shielding structure for integrated circuits or devices on a substrate
US8589832B2 (en) * 2007-08-24 2013-11-19 International Business Machines Corporation On chip shielding structure for integrated circuits or devices on a substrate and method of shielding
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device
US8349635B1 (en) * 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
JP5715734B2 (ja) 2011-10-24 2015-05-13 ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. インクジェットプリントヘッド装置、流体噴射装置、及びその方法
AU2011380023B2 (en) * 2011-10-24 2015-03-26 Hewlett-Packard Development Company, L.P. Fluid ejection devices and methods thereof
US9323041B2 (en) 2011-11-30 2016-04-26 Pixtronix, Inc. Electromechanical systems display apparatus incorporating charge dissipation surfaces
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
US11646576B2 (en) 2021-09-08 2023-05-09 Analog Devices International Unlimited Company Electrical overstress protection of microelectromechanical systems

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5467068A (en) * 1994-07-07 1995-11-14 Hewlett-Packard Company Micromachined bi-material signal switch
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
US6758552B1 (en) * 1995-12-06 2004-07-06 Hewlett-Packard Development Company Integrated thin-film drive head for thermal ink-jet printer
US6174820B1 (en) * 1999-02-16 2001-01-16 Sandia Corporation Use of silicon oxynitride as a sacrificial material for microelectromechanical devices

Also Published As

Publication number Publication date
CA2375712C (en) 2005-01-25
EP1243550A2 (en) 2002-09-25
DE60212229T2 (de) 2006-10-05
JP2002307697A (ja) 2002-10-23
CA2375712A1 (en) 2002-09-19
BR0200848B1 (pt) 2014-08-05
DE60212229D1 (de) 2006-07-27
EP1243550B1 (en) 2006-06-14
US6465856B2 (en) 2002-10-15
MXPA02002849A (es) 2005-07-25
EP1243550A3 (en) 2004-06-16
US20020130916A1 (en) 2002-09-19

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Free format text: ALTERADA A CLASSIFICACAO DE H01R 43/00 PARA B87B 7/04 E B81C 1/00

Ipc: B81B 7/04 (2006.01), B81C 1/00 (2006.01)

B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 05/08/2014, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2371 DE 14-06-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.