BE806821A - THYRISTOR - Google Patents

THYRISTOR

Info

Publication number
BE806821A
BE806821A BE137328A BE137328A BE806821A BE 806821 A BE806821 A BE 806821A BE 137328 A BE137328 A BE 137328A BE 137328 A BE137328 A BE 137328A BE 806821 A BE806821 A BE 806821A
Authority
BE
Belgium
Prior art keywords
thyristor
Prior art date
Application number
BE137328A
Other languages
French (fr)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722253489 external-priority patent/DE2253489C3/en
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE806821A publication Critical patent/BE806821A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/4903—Connectors having different sizes, e.g. different diameters
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Thyristors (AREA)
BE137328A 1972-10-31 1973-10-31 THYRISTOR BE806821A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722253489 DE2253489C3 (en) 1972-10-31 Thyristor and process for its manufacture

Publications (1)

Publication Number Publication Date
BE806821A true BE806821A (en) 1974-02-15

Family

ID=5860568

Family Applications (1)

Application Number Title Priority Date Filing Date
BE137328A BE806821A (en) 1972-10-31 1973-10-31 THYRISTOR

Country Status (5)

Country Link
JP (1) JPS5547469B2 (en)
BE (1) BE806821A (en)
CH (1) CH553480A (en)
FR (1) FR2204895B1 (en)
IT (1) IT998994B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756527Y2 (en) * 1977-02-25 1982-12-04

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1095576A (en) * 1964-08-12 1900-01-01
DE1614410B2 (en) * 1967-01-25 1973-12-13 Siemens Ag, 1000 Berlin U. 8000 Muenchen Semiconductor component
US3538401A (en) * 1968-04-11 1970-11-03 Westinghouse Electric Corp Drift field thyristor
FR2007870B1 (en) * 1968-05-06 1975-01-10 Rca Corp

Also Published As

Publication number Publication date
IT998994B (en) 1976-02-20
FR2204895A1 (en) 1974-05-24
JPS4978489A (en) 1974-07-29
JPS5547469B2 (en) 1980-11-29
DE2253489A1 (en) 1974-05-02
CH553480A (en) 1974-08-30
DE2253489B2 (en) 1977-04-28
FR2204895B1 (en) 1978-02-10

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