BE776344A - Procede de placage electrolytique de regions conductrices discretes - Google Patents
Procede de placage electrolytique de regions conductrices discretesInfo
- Publication number
- BE776344A BE776344A BE776344A BE776344A BE776344A BE 776344 A BE776344 A BE 776344A BE 776344 A BE776344 A BE 776344A BE 776344 A BE776344 A BE 776344A BE 776344 A BE776344 A BE 776344A
- Authority
- BE
- Belgium
- Prior art keywords
- electrolytic
- placing
- conductive regions
- discreet
- discreet conductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9694670A | 1970-12-10 | 1970-12-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE776344A true BE776344A (fr) | 1972-04-04 |
Family
ID=22259879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE776344A BE776344A (fr) | 1970-12-10 | 1971-12-07 | Procede de placage electrolytique de regions conductrices discretes |
Country Status (7)
Country | Link |
---|---|
US (1) | US3729389A (fr) |
BE (1) | BE776344A (fr) |
CA (1) | CA940868A (fr) |
DE (1) | DE2160284A1 (fr) |
FR (1) | FR2117994B1 (fr) |
NL (1) | NL7116988A (fr) |
SE (1) | SE7115468L (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5531008Y2 (fr) * | 1974-08-20 | 1980-07-24 | ||
US4061553A (en) * | 1976-12-03 | 1977-12-06 | Carolina Steel & Wire Corporation | Electroplating apparatus and method |
US5242562A (en) * | 1992-05-27 | 1993-09-07 | Gould Inc. | Method and apparatus for forming printed circuits |
US5721007A (en) * | 1994-09-08 | 1998-02-24 | The Whitaker Corporation | Process for low density additive flexible circuits and harnesses |
US20060129219A1 (en) * | 2002-09-05 | 2006-06-15 | Kurth Paul A | Tool for placement of dual angioplasty wires in the coronary sinus vasculature and method of using the same |
FR2847761B1 (fr) * | 2002-11-27 | 2005-02-04 | Framatome Connectors Int | Dispositif de metallisation de formes imprimees munies de pistes conductrices d'electricite et procede de metallisation associe |
NL1025446C2 (nl) * | 2004-02-09 | 2005-08-10 | Besi Plating B V | Werkwijze en inrichting voor het elektrolytisch doen toenemen van de dikte van een elektrisch geleidend patroon op een dielektrische drager alsmede dielektrische drager. |
US10900135B2 (en) * | 2016-02-09 | 2021-01-26 | Weinberg Medical Physics, Inc. | Method and apparatus for manufacturing particles |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE676575C (de) * | 1937-02-14 | 1939-06-07 | Max Erhardt | Verfahren zur Vermeidung von durch die Warenaufhaengevorrichtungen in galvanischen Baedern entstehenden Metallverlusten |
BE517552A (fr) * | 1951-05-17 |
-
1970
- 1970-12-10 US US00096946A patent/US3729389A/en not_active Expired - Lifetime
-
1971
- 1971-07-07 CA CA117,618A patent/CA940868A/en not_active Expired
- 1971-12-02 SE SE7115468A patent/SE7115468L/sv unknown
- 1971-12-04 DE DE19712160284 patent/DE2160284A1/de active Pending
- 1971-12-07 BE BE776344A patent/BE776344A/fr unknown
- 1971-12-09 FR FR7144279A patent/FR2117994B1/fr not_active Expired
- 1971-12-10 NL NL7116988A patent/NL7116988A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR2117994A1 (fr) | 1972-07-28 |
FR2117994B1 (fr) | 1974-08-23 |
DE2160284A1 (de) | 1972-07-06 |
SE7115468L (fr) | 1972-06-12 |
NL7116988A (fr) | 1972-06-13 |
CA940868A (en) | 1974-01-29 |
US3729389A (en) | 1973-04-24 |
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