BE766063A - Procede de preparation d'une protection superficielle stable pour des elements de construction semi-conducteurs - Google Patents

Procede de preparation d'une protection superficielle stable pour des elements de construction semi-conducteurs

Info

Publication number
BE766063A
BE766063A BE766063A BE766063A BE766063A BE 766063 A BE766063 A BE 766063A BE 766063 A BE766063 A BE 766063A BE 766063 A BE766063 A BE 766063A BE 766063 A BE766063 A BE 766063A
Authority
BE
Belgium
Prior art keywords
surface protection
building elements
stable surface
preparing stable
semiconductor building
Prior art date
Application number
BE766063A
Other languages
English (en)
French (fr)
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of BE766063A publication Critical patent/BE766063A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
BE766063A 1970-04-21 1971-04-21 Procede de preparation d'une protection superficielle stable pour des elements de construction semi-conducteurs BE766063A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2019099A DE2019099C3 (de) 1970-04-21 1970-04-21 Verfahren zur Herstellung eines stabilen Oberflachenschutzes fur Halbleiterbauelemente

Publications (1)

Publication Number Publication Date
BE766063A true BE766063A (fr) 1971-09-16

Family

ID=5768685

Family Applications (1)

Application Number Title Priority Date Filing Date
BE766063A BE766063A (fr) 1970-04-21 1971-04-21 Procede de preparation d'une protection superficielle stable pour des elements de construction semi-conducteurs

Country Status (4)

Country Link
US (1) US3788895A (enExample)
BE (1) BE766063A (enExample)
DE (1) DE2019099C3 (enExample)
FR (1) FR2090013A5 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
US3915780A (en) * 1973-08-02 1975-10-28 Texas Instruments Inc Extruded epoxy packaging system
US4173683A (en) * 1977-06-13 1979-11-06 Rca Corporation Chemically treating the overcoat of a semiconductor device
DE2751517C2 (de) * 1977-11-18 1983-10-20 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Oberflächenpassiviertes Halbleiterbauelement mit einer Halbleiterscheibe und Verfahren zur Herstellung desselben
US4230754A (en) * 1978-11-07 1980-10-28 Sprague Electric Company Bonding electronic component to molded package
US4327369A (en) * 1979-08-06 1982-04-27 Hi-Tech Industries, Inc. Encapsulating moisture-proof coating
JPS5759366A (en) * 1980-09-26 1982-04-09 Nitto Electric Ind Co Ltd Epoxy resin composition for sealing semiconductor
EP0075481B1 (en) * 1981-09-22 1986-08-27 Hitachi, Ltd. Electrophotographic plate
NL8203980A (nl) * 1982-10-15 1984-05-01 Philips Nv Werkwijze voor de fotolithografische behandeling van een substraat.
NL8304443A (nl) * 1983-12-27 1985-07-16 Philips Nv Methode voor het aanbrengen van een metaalspiegel.
NL8400916A (nl) * 1984-03-22 1985-10-16 Stichting Ct Voor Micro Elektr Werkwijze voor het vervaardigen van een isfet en een aldus vervaardigde isfet.
US5449950A (en) * 1984-04-16 1995-09-12 Canon Kabushiki Kaisha Photosensor with organic and inorganic insulation layers
US4950583A (en) * 1986-09-17 1990-08-21 Brewer Science Inc. Adhesion promoting product and process for treating an integrated circuit substrate therewith
US4732858A (en) * 1986-09-17 1988-03-22 Brewer Science, Inc. Adhesion promoting product and process for treating an integrated circuit substrate
US5026667A (en) * 1987-12-29 1991-06-25 Analog Devices, Incorporated Producing integrated circuit chips with reduced stress effects
US5002808A (en) * 1988-03-23 1991-03-26 The Dow Chemical Company Adhesion methods employing benzocyclobutene-based organosilane adhesion aids
FR2649917A1 (fr) * 1989-07-20 1991-01-25 Snecma Procede de fabrication de moules-carapaces pour fonderie
US5368942A (en) * 1993-01-15 1994-11-29 The United States Of America As Represented By The Secreatary Of Commerce Method of adhering substrates
DE4432294A1 (de) 1994-09-12 1996-03-14 Telefunken Microelectron Verfahren zur Reduzierung der Oberflächenrekombinationsgeschwindigkeit in Silizium
DE19638669A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Herstellungsverfahren von Kunststoffgehäusen für auf Trägerrahmen befestigten Chips
US6613184B1 (en) * 1997-05-12 2003-09-02 International Business Machines Corporation Stable interfaces between electrically conductive adhesives and metals
DE19741437A1 (de) * 1997-09-19 1999-04-01 Siemens Ag Elektronisches Bauteil mit verbesserter Gehäusepreßmasse

Also Published As

Publication number Publication date
DE2019099A1 (de) 1971-11-25
US3788895A (en) 1974-01-29
DE2019099B2 (enExample) 1975-04-10
FR2090013A5 (enExample) 1972-01-07
DE2019099C3 (de) 1975-11-20

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