BE733724A - - Google Patents

Info

Publication number
BE733724A
BE733724A BE733724DA BE733724A BE 733724 A BE733724 A BE 733724A BE 733724D A BE733724D A BE 733724DA BE 733724 A BE733724 A BE 733724A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE733724A publication Critical patent/BE733724A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
BE733724D 1968-05-31 1969-05-28 BE733724A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US73359468A 1968-05-31 1968-05-31

Publications (1)

Publication Number Publication Date
BE733724A true BE733724A (enExample) 1969-11-03

Family

ID=24948299

Family Applications (1)

Application Number Title Priority Date Filing Date
BE733724D BE733724A (enExample) 1968-05-31 1969-05-28

Country Status (6)

Country Link
US (1) US3616402A (enExample)
BE (1) BE733724A (enExample)
DE (1) DE1927253A1 (enExample)
FR (1) FR2009759A1 (enExample)
GB (1) GB1275428A (enExample)
NL (1) NL6908267A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2253769C3 (de) * 1972-11-02 1979-07-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Kathodenzerstäubungsanlage mit kontinuierlichem Substratdurchlauf
US4125446A (en) * 1977-08-15 1978-11-14 Airco, Inc. Controlled reflectance of sputtered aluminum layers
US4313815A (en) * 1978-04-07 1982-02-02 Varian Associates, Inc. Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4834856A (en) * 1988-01-21 1989-05-30 Wehner Gottfried K Method and apparatus for sputtering a superconductor onto a substrate
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US5798029A (en) * 1994-04-22 1998-08-25 Applied Materials, Inc. Target for sputtering equipment
DE19623359A1 (de) * 1995-08-17 1997-02-20 Leybold Ag Vorrichtung zum Beschichten eines Substrats
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
JP2001003166A (ja) * 1999-04-23 2001-01-09 Nippon Sheet Glass Co Ltd 基体表面に被膜を被覆する方法およびその方法による基体
US20030209423A1 (en) * 2001-03-27 2003-11-13 Christie David J. System for driving multiple magnetrons with multiple phase ac
US9175383B2 (en) * 2008-01-16 2015-11-03 Applied Materials, Inc. Double-coating device with one process chamber
AU2009242568B2 (en) * 2008-05-01 2013-06-13 First Solar, Inc. Transparent conductive materials including cadmium stannate
JP2013163856A (ja) * 2012-02-13 2013-08-22 Tokyo Electron Ltd スパッタ装置
CN104831247B (zh) * 2015-04-15 2017-06-06 赫得纳米科技(昆山)有限公司 水平连续式磁控溅射镀膜机在线面板恒温加热装置
CN106884150B (zh) * 2017-04-24 2023-06-09 爱瑞德科技(大连)有限公司 一种悬浮阳极及带有悬浮阳极的磁控溅射装置

Also Published As

Publication number Publication date
GB1275428A (en) 1972-05-24
FR2009759A1 (enExample) 1970-02-06
DE1927253A1 (de) 1969-12-04
US3616402A (en) 1971-10-26
NL6908267A (enExample) 1969-12-02

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