|
WO1994012083A1
(en)
*
|
1992-11-30 |
1994-06-09 |
Permacrest (Aust) Pty. Limited |
A container for controlling the release of gas(es) from an effervescent fluid and a method and device for producing said container
|
|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
WO2015113024A1
(en)
*
|
2014-01-27 |
2015-07-30 |
Corning Incorporated |
Edge chamfering methods
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
US10442719B2
(en)
*
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
JP2017521259A
(ja)
|
2014-07-08 |
2017-08-03 |
コーニング インコーポレイテッド |
材料をレーザ加工するための方法および装置
|
|
EP3169476A1
(en)
|
2014-07-14 |
2017-05-24 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
WO2016010949A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for forming perforations
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
KR20170028943A
(ko)
|
2014-07-14 |
2017-03-14 |
코닝 인코포레이티드 |
조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
JP2018507154A
(ja)
|
2015-01-12 |
2018-03-15 |
コーニング インコーポレイテッド |
マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
|
|
CN107922237B
(zh)
|
2015-03-24 |
2022-04-01 |
康宁股份有限公司 |
显示器玻璃组合物的激光切割和加工
|
|
JP2018516215A
(ja)
|
2015-03-27 |
2018-06-21 |
コーニング インコーポレイテッド |
気体透過性窓、および、その製造方法
|
|
CN107835794A
(zh)
|
2015-07-10 |
2018-03-23 |
康宁股份有限公司 |
在挠性基材板中连续制造孔的方法和与此相关的产品
|
|
WO2017192835A1
(en)
|
2016-05-06 |
2017-11-09 |
Corning Incorporated |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
KR20190035805A
(ko)
|
2016-07-29 |
2019-04-03 |
코닝 인코포레이티드 |
레이저 처리를 위한 장치 및 방법
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
WO2018064409A1
(en)
|
2016-09-30 |
2018-04-05 |
Corning Incorporated |
Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
|
|
LT3529214T
(lt)
|
2016-10-24 |
2021-02-25 |
Corning Incorporated |
Substrato apdorojimo stotis lakšto formos stiklo substratų lazeriniam mašininiam apdorojimui
|
|
US10752534B2
(en)
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
CN113121125B
(zh)
*
|
2021-04-14 |
2022-10-18 |
万津实业(赤壁)有限公司 |
用于2.5d浮法玻璃的加工方法
|