BE711211A - - Google Patents

Info

Publication number
BE711211A
BE711211A BE711211DA BE711211A BE 711211 A BE711211 A BE 711211A BE 711211D A BE711211D A BE 711211DA BE 711211 A BE711211 A BE 711211A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE711211A publication Critical patent/BE711211A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
BE711211D 1967-02-24 1968-02-23 BE711211A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES0108491 1967-02-24

Publications (1)

Publication Number Publication Date
BE711211A true BE711211A (en:Method) 1968-08-23

Family

ID=7528838

Family Applications (1)

Application Number Title Priority Date Filing Date
BE711211D BE711211A (en:Method) 1967-02-24 1968-02-23

Country Status (10)

Country Link
US (1) US3554793A (en:Method)
AT (1) AT270783B (en:Method)
BE (1) BE711211A (en:Method)
CH (1) CH470816A (en:Method)
DE (1) DE1627596A1 (en:Method)
DK (1) DK125573B (en:Method)
FR (1) FR1556554A (en:Method)
GB (1) GB1221231A (en:Method)
NL (1) NL6801371A (en:Method)
SE (1) SE339159B (en:Method)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
US4493856A (en) * 1982-03-18 1985-01-15 International Business Machines Corporation Selective coating of metallurgical features of a dielectric substrate with diverse metals
US4504322A (en) * 1982-10-20 1985-03-12 International Business Machines Corporation Re-work method for removing extraneous metal from cermic substrates
DE3311137A1 (de) * 1983-03-26 1984-09-27 Helmut 6487 Flörsbachtal Wicher Anordnung zur verbindung eines elektronischen bauelementes mit der platine eines elektronischen geraetes
CN111715999A (zh) * 2020-05-28 2020-09-29 南昌欧菲显示科技有限公司 半导体器件焊接装置及半导体器件焊接方法
US11304310B1 (en) 2020-10-13 2022-04-12 Macronix International Co., Ltd. Method of fabricating circuit board

Also Published As

Publication number Publication date
DK125573B (da) 1973-03-12
GB1221231A (en) 1971-02-03
SE339159B (en:Method) 1971-09-27
US3554793A (en) 1971-01-12
AT270783B (de) 1969-05-12
NL6801371A (en:Method) 1968-08-26
FR1556554A (en:Method) 1969-02-07
DE1627596A1 (de) 1971-07-15
CH470816A (de) 1969-03-31

Similar Documents

Publication Publication Date Title
AU425114B2 (en:Method)
AU342066A (en:Method)
AU3151267A (en:Method)
AU2116667A (en:Method)
AU2256867A (en:Method)
AU2528767A (en:Method)
AU2977667A (en:Method)
AU1273466A (en:Method)
AU610966A (en:Method)
AU3189468A (en:Method)
BE162295A (en:Method)
BE692198A (en:Method)
AU3054676A (en:Method)
AU2406369A (en:Method)
AU23366A (en:Method)
AU1868267A (en:Method)
AU34866A (en:Method)
AU408412B2 (en:Method)
AU1763766A (en:Method)
AU459699A (en:Method)
AU1677166A (en:Method)
AU1614766A (en:Method)
AU97666A (en:Method)
BE710222A (en:Method)
BE426053A (en:Method)