BE709891A - - Google Patents

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Publication number
BE709891A
BE709891A BE709891DA BE709891A BE 709891 A BE709891 A BE 709891A BE 709891D A BE709891D A BE 709891DA BE 709891 A BE709891 A BE 709891A
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BE
Belgium
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Filing date
Publication date
Application filed filed Critical
Publication of BE709891A publication Critical patent/BE709891A/xx

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
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    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
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    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/01006Carbon [C]
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    • H01L2924/1204Optical Diode
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    • H01L2924/14Integrated circuits
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    • H01L2924/19043Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
BE709891D 1967-01-27 1968-01-25 BE709891A (US06815460-20041109-C00097.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6701294A NL6701294A (US06815460-20041109-C00097.png) 1967-01-27 1967-01-27

Publications (1)

Publication Number Publication Date
BE709891A true BE709891A (US06815460-20041109-C00097.png) 1968-07-25

Family

ID=19799151

Family Applications (1)

Application Number Title Priority Date Filing Date
BE709891D BE709891A (US06815460-20041109-C00097.png) 1967-01-27 1968-01-25

Country Status (7)

Country Link
AT (1) AT286416B (US06815460-20041109-C00097.png)
BE (1) BE709891A (US06815460-20041109-C00097.png)
CH (1) CH483774A (US06815460-20041109-C00097.png)
DE (1) DE1285581C2 (US06815460-20041109-C00097.png)
FR (1) FR1553301A (US06815460-20041109-C00097.png)
GB (1) GB1211412A (US06815460-20041109-C00097.png)
NL (1) NL6701294A (US06815460-20041109-C00097.png)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0355424B1 (en) * 1988-07-25 1995-02-15 Asahi Glass Company Ltd. Glass antenna device for an automobile
US4933812A (en) * 1989-10-11 1990-06-12 Hewlett-Packard Company Package and circuit arrangement for housing and connecting polarized electrical components and method of manufacture

Also Published As

Publication number Publication date
GB1211412A (en) 1970-11-04
DE1285581C2 (de) 1973-08-23
CH483774A (de) 1969-12-31
AT286416B (de) 1970-12-10
DE1285581B (de) 1968-12-19
FR1553301A (US06815460-20041109-C00097.png) 1969-01-10
NL6701294A (US06815460-20041109-C00097.png) 1968-07-29

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