BE709772A - - Google Patents
Info
- Publication number
- BE709772A BE709772A BE709772DA BE709772A BE 709772 A BE709772 A BE 709772A BE 709772D A BE709772D A BE 709772DA BE 709772 A BE709772 A BE 709772A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
- H10W72/01251—Changing the shapes of bumps
- H10W72/01255—Changing the shapes of bumps by using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/019—Manufacture or treatment of bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
- H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
- H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6701136A NL6701136A (https=) | 1967-01-25 | 1967-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE709772A true BE709772A (https=) | 1968-07-23 |
Family
ID=19799110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE709772D BE709772A (https=) | 1967-01-25 | 1968-01-23 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3528090A (https=) |
| AT (1) | AT275609B (https=) |
| BE (1) | BE709772A (https=) |
| CH (1) | CH479162A (https=) |
| DE (1) | DE1614306C3 (https=) |
| ES (1) | ES349652A1 (https=) |
| FR (1) | FR1555930A (https=) |
| GB (1) | GB1204263A (https=) |
| NL (1) | NL6701136A (https=) |
| SE (1) | SE350648B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3638304A (en) * | 1969-11-06 | 1972-02-01 | Gen Motors Corp | Semiconductive chip attachment method |
| BE790652A (fr) * | 1971-10-28 | 1973-02-15 | Siemens Ag | Composant a semi-conducteurs a connexions portantes |
| US3740619A (en) * | 1972-01-03 | 1973-06-19 | Signetics Corp | Semiconductor structure with yieldable bonding pads having flexible links and method |
| US3911474A (en) * | 1972-01-03 | 1975-10-07 | Signetics Corp | Semiconductor structure and method |
| DE3806287A1 (de) * | 1988-02-27 | 1989-09-07 | Asea Brown Boveri | Aetzverfahren zur strukturierung einer mehrschicht-metallisierung |
| JP2002521575A (ja) * | 1998-07-24 | 2002-07-16 | アンテルユニヴェルシテール・ミクロ−エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ | 導電パターンの電解メッキシステムとその電解メッキ方法 |
| US6758958B1 (en) | 1998-07-24 | 2004-07-06 | Interuniversitair Micro-Elektronica Centrum | System and a method for plating of a conductive pattern |
| US9524945B2 (en) | 2010-05-18 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with L-shaped non-metal sidewall protection structure |
| US8377816B2 (en) * | 2009-07-30 | 2013-02-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming electrical connections |
| US8841766B2 (en) | 2009-07-30 | 2014-09-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall protection structure |
| US8324738B2 (en) | 2009-09-01 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned protection layer for copper post structure |
| US8659155B2 (en) | 2009-11-05 | 2014-02-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps |
| US8610270B2 (en) | 2010-02-09 | 2013-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and semiconductor assembly with lead-free solder |
| US8441124B2 (en) | 2010-04-29 | 2013-05-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Cu pillar bump with non-metal sidewall protection structure |
| US8546254B2 (en) * | 2010-08-19 | 2013-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Mechanisms for forming copper pillar bumps using patterned anodes |
| KR102458034B1 (ko) | 2015-10-16 | 2022-10-25 | 삼성전자주식회사 | 반도체 패키지, 반도체 패키지의 제조방법, 및 반도체 모듈 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3386894A (en) * | 1964-09-28 | 1968-06-04 | Northern Electric Co | Formation of metallic contacts |
| US3408271A (en) * | 1965-03-01 | 1968-10-29 | Hughes Aircraft Co | Electrolytic plating of metal bump contacts to semiconductor devices upon nonconductive substrates |
-
1967
- 1967-01-25 NL NL6701136A patent/NL6701136A/xx unknown
- 1967-12-06 DE DE1614306A patent/DE1614306C3/de not_active Expired
-
1968
- 1968-01-19 US US699228A patent/US3528090A/en not_active Expired - Lifetime
- 1968-01-22 AT AT61768A patent/AT275609B/de active
- 1968-01-22 CH CH98468A patent/CH479162A/de not_active IP Right Cessation
- 1968-01-22 SE SE00829/68A patent/SE350648B/xx unknown
- 1968-01-23 ES ES349652A patent/ES349652A1/es not_active Expired
- 1968-01-23 BE BE709772D patent/BE709772A/xx unknown
- 1968-01-24 GB GB3676/68A patent/GB1204263A/en not_active Expired
- 1968-01-25 FR FR1555930D patent/FR1555930A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1614306A1 (de) | 1970-08-20 |
| DE1614306B2 (de) | 1974-05-16 |
| GB1204263A (en) | 1970-09-03 |
| NL6701136A (https=) | 1968-07-26 |
| SE350648B (https=) | 1972-10-30 |
| US3528090A (en) | 1970-09-08 |
| ES349652A1 (es) | 1969-04-01 |
| DE1614306C3 (de) | 1974-12-19 |
| AT275609B (de) | 1969-10-27 |
| CH479162A (de) | 1969-09-30 |
| FR1555930A (https=) | 1969-01-31 |