Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
  • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
  • H01L27/0203—Particular design considerations for integrated circuits
  • H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
  • H01L21/76—Making of isolation regions between components
  • H01L21/761—PN junctions
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
  • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
  • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
  • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components

Applications Claiming Priority (1)

Publications (1)

Family

ID=19799016

Family Applications (1)

Country Status (11)

Families Citing this family (2)

• 1967
  • 1967-01-18 NL NL6700755A patent/NL6700755A/xx unknown
  • 1967-12-20 DK DK640567A patent/DK119667B/da unknown
• 1968
  • 1968-01-13 DE DE1968N0031956 patent/DE1639342B2/de active Granted
  • 1968-01-15 AT AT38268A patent/AT300037B/de not_active IP Right Cessation
  • 1968-01-15 SE SE48168A patent/SE345555B/xx unknown
  • 1968-01-15 NO NO17168A patent/NO124401B/no unknown
  • 1968-01-15 CH CH56268A patent/CH470764A/de not_active IP Right Cessation
  • 1968-01-15 GB GB213568A patent/GB1218603A/en not_active Expired
  • 1968-01-16 ES ES349367A patent/ES349367A1/es not_active Expired
  • 1968-01-16 BE BE709451D patent/BE709451A/xx unknown
  • 1968-01-17 FR FR1562929D patent/FR1562929A/fr not_active Expired

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