BE709226A - - Google Patents

Info

Publication number
BE709226A
BE709226A BE709226DA BE709226A BE 709226 A BE709226 A BE 709226A BE 709226D A BE709226D A BE 709226DA BE 709226 A BE709226 A BE 709226A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE709226A publication Critical patent/BE709226A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003Placing of components on belts holding the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861Lead-frames fixed on or encapsulated in insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49121Beam lead frame or beam lead device
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12201Width or thickness variation or marginal cuts repeating longitudinally
    • Y10T428/12208Variation in both width and thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/15Sheet, web, or layer weakened to permit separation through thickness
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
BE709226D 1967-01-26 1968-01-11 BE709226A (US06589383-20030708-C00041.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61194467A 1967-01-26 1967-01-26

Publications (1)

Publication Number Publication Date
BE709226A true BE709226A (US06589383-20030708-C00041.png) 1968-07-11

Family

ID=24451036

Family Applications (1)

Application Number Title Priority Date Filing Date
BE709226D BE709226A (US06589383-20030708-C00041.png) 1967-01-26 1968-01-11

Country Status (6)

Country Link
US (1) US3469684A (US06589383-20030708-C00041.png)
BE (1) BE709226A (US06589383-20030708-C00041.png)
DE (1) DE1566981B2 (US06589383-20030708-C00041.png)
ES (1) ES349093A1 (US06589383-20030708-C00041.png)
FR (1) FR1548068A (US06589383-20030708-C00041.png)
GB (1) GB1165609A (US06589383-20030708-C00041.png)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3678385A (en) * 1969-09-26 1972-07-18 Amp Inc Assembly and test device for microelectronic circuit members
US3585272A (en) * 1969-10-01 1971-06-15 Fairchild Camera Instr Co Semiconductor package of alumina and aluminum
US3698075A (en) * 1969-11-05 1972-10-17 Motorola Inc Ultrasonic metallic sheet-frame bonding
US3668770A (en) * 1970-05-25 1972-06-13 Rca Corp Method of connecting semiconductor device to terminals of package
US3698074A (en) * 1970-06-29 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3698076A (en) * 1970-08-03 1972-10-17 Motorola Inc Method of applying leads to an integrated circuit
US3795492A (en) * 1970-10-09 1974-03-05 Motorola Inc Lanced and relieved lead strips
US4028722A (en) * 1970-10-13 1977-06-07 Motorola, Inc. Contact bonded packaged integrated circuit
US3698073A (en) * 1970-10-13 1972-10-17 Motorola Inc Contact bonding and packaging of integrated circuits
US3793714A (en) * 1971-05-27 1974-02-26 Texas Instruments Inc Integrated circuit assembly using etched metal patterns of flexible insulating film
US4012579A (en) * 1975-02-21 1977-03-15 Allen-Bradley Company Encapsulated microcircuit package and method for assembly thereof
US4056681A (en) * 1975-08-04 1977-11-01 International Telephone And Telegraph Corporation Self-aligning package for integrated circuits
NL189379C (nl) * 1977-05-05 1993-03-16 Richardus Henricus Johannes Fi Werkwijze voor inkapselen van micro-elektronische elementen.
US4139726A (en) * 1978-01-16 1979-02-13 Allen-Bradley Company Packaged microcircuit and method for assembly thereof
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof
US4470507A (en) * 1980-03-24 1984-09-11 National Semiconductor Corporation Assembly tape for hermetic tape packaging semiconductor devices
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
JPS5874399U (ja) * 1981-11-13 1983-05-19 アルプス電気株式会社 電気部品の取付構造
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
US4479298A (en) * 1983-07-26 1984-10-30 Storage Technology Partners Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
JPS6081654U (ja) * 1983-11-10 1985-06-06 山一電機工業株式会社 Icパツケ−ジのキヤリア
US4554404A (en) * 1984-03-26 1985-11-19 Gte Products Corporation Support for lead frame for IC chip carrier
US4591053A (en) * 1984-07-06 1986-05-27 Gibson-Egan Company Integrated circuit carrier
US4627533A (en) * 1984-10-29 1986-12-09 Hughes Aircraft Company Ceramic package for compensated crystal oscillator
US4760335A (en) * 1985-07-30 1988-07-26 Westinghouse Electric Corp. Large scale integrated circuit test system
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier
US4766520A (en) * 1986-12-05 1988-08-23 Capsonic Group, Inc. Injection molded circuit housing
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
JPS63306633A (ja) * 1987-06-08 1988-12-14 Toshiba Corp フイルムキヤリア
US5152057A (en) * 1987-11-17 1992-10-06 Mold-Pac Corporation Molded integrated circuit package
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
US4987100A (en) * 1988-05-26 1991-01-22 International Business Machines Corporation Flexible carrier for an electronic device
US4870224A (en) * 1988-07-01 1989-09-26 Intel Corporation Integrated circuit package for surface mount technology
US5061822A (en) * 1988-09-12 1991-10-29 Honeywell Inc. Radial solution to chip carrier pitch deviation
US5310055A (en) * 1990-08-21 1994-05-10 National Semiconductor Corporation Magazine and shipping tray for lead frames
FR2673765A1 (fr) * 1991-03-05 1992-09-11 Thomson Composants Militaires Boitier de circuit integre a connexion de puissance.
JP3424929B2 (ja) * 1992-09-16 2003-07-07 クレイトン,ジェイムズ,イー. 薄マルチチップ・モジュール
US5406699A (en) * 1992-09-18 1995-04-18 Matsushita Electric Industrial Co., Ltd. Method of manufacturing an electronics package
DE4404986B4 (de) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Einrichtung zur Kontaktierung elektrischer Leiter sowie Verfahren zur Herstellung einer derartigen Einrichtung
US5717163A (en) * 1994-12-02 1998-02-10 Wu; Conny Plastic material pouring device for forming electronic components
US5836454A (en) * 1996-01-17 1998-11-17 Micron Technology, Inc. Lead frame casing
US5834336A (en) * 1996-03-12 1998-11-10 Texas Instruments Incorporated Backside encapsulation of tape automated bonding device
US5986894A (en) * 1997-09-29 1999-11-16 Pulse Engineering, Inc. Microelectronic component carrier and method of its manufacture
WO2005036604A2 (en) * 2003-10-09 2005-04-21 E.I. Dupont De Nemours And Company Apparatus and method for supporting a flexible substrate during processing
US7049171B2 (en) * 2004-06-23 2006-05-23 Delphi Technologies, Inc. Electrical package employing segmented connector and solder joint
US8581113B2 (en) * 2007-12-19 2013-11-12 Bridgewave Communications, Inc. Low cost high frequency device package and methods
US8072764B2 (en) * 2009-03-09 2011-12-06 Apple Inc. Multi-part substrate assemblies for low profile portable electronic devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1048624B (US06589383-20030708-C00041.png) * 1959-01-15
US3050186A (en) * 1954-11-22 1962-08-21 Allen Bradley Co Packaging for small uniform articles
US3141999A (en) * 1959-06-08 1964-07-21 Burroughs Corp Cooling of modular electrical network assemblies
US3271634A (en) * 1961-10-20 1966-09-06 Texas Instruments Inc Glass-encased semiconductor
US3171187A (en) * 1962-05-04 1965-03-02 Nippon Electric Co Method of manufacturing semiconductor devices
US3239719A (en) * 1963-07-08 1966-03-08 Sperry Rand Corp Packaging and circuit connection means for microelectronic circuitry
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3292241A (en) * 1964-05-20 1966-12-20 Motorola Inc Method for connecting semiconductor devices
US3374537A (en) * 1965-03-22 1968-03-26 Philco Ford Corp Method of connecting leads to a semiconductive device
US3381372A (en) * 1966-07-13 1968-05-07 Sperry Rand Corp Method of electrically connecting and hermetically sealing packages for microelectronic circuits

Also Published As

Publication number Publication date
GB1165609A (en) 1969-10-01
ES349093A1 (es) 1969-04-01
DE1566981B2 (de) 1971-09-16
DE1566981A1 (de) 1970-10-01
FR1548068A (US06589383-20030708-C00041.png) 1968-11-29
US3469684A (en) 1969-09-30

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