BE690811A - - Google Patents

Info

Publication number
BE690811A
BE690811A BE690811DA BE690811A BE 690811 A BE690811 A BE 690811A BE 690811D A BE690811D A BE 690811DA BE 690811 A BE690811 A BE 690811A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE690811A publication Critical patent/BE690811A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/30Die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • H10N10/817Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/40Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/20Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/073Connecting or disconnecting of die-attach connectors
    • H10W72/07331Connecting techniques
    • H10W72/07336Soldering or alloying
BE690811D 1965-06-11 1966-12-07 BE690811A (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DES0097564 1965-06-11
DES0100912 1965-12-11

Publications (1)

Publication Number Publication Date
BE690811A true BE690811A (https=) 1967-05-16

Family

ID=25998118

Family Applications (2)

Application Number Title Priority Date Filing Date
BE681655D BE681655A (https=) 1965-06-11 1966-05-26
BE690811D BE690811A (https=) 1965-06-11 1966-12-07

Family Applications Before (1)

Application Number Title Priority Date Filing Date
BE681655D BE681655A (https=) 1965-06-11 1966-05-26

Country Status (7)

Country Link
US (2) US3441812A (https=)
BE (2) BE681655A (https=)
DE (2) DE1483298B1 (https=)
FR (1) FR1504284A (https=)
GB (2) GB1106287A (https=)
NL (2) NL6607137A (https=)
SE (1) SE321723B (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3664874A (en) * 1969-12-31 1972-05-23 Nasa Tungsten contacts on silicon substrates
US3989546A (en) * 1971-05-10 1976-11-02 Arco Medical Products Company Thermoelectric generator with hinged assembly for fins
DE2739242C2 (de) * 1977-08-31 1979-10-04 Siemens Ag, 1000 Berlin Und 8000 Muenchen Hochleistungsstromrichter
AU555193B2 (en) * 1980-11-10 1986-09-18 Edwin James Freeburn Cooling device
US5028988A (en) * 1989-12-27 1991-07-02 Ncr Corporation Method and apparatus for low temperature integrated circuit chip testing and operation
GB9015687D0 (en) * 1990-07-17 1990-09-05 Global Domestic Prod Ltd Peltier devices
EP0972335A2 (fr) * 1996-12-02 2000-01-19 Janick Simeray Convertisseur de puissance thermique permettant d'alimenter en electricite un appareil autonome a consommation reduite a partir d'une tres faible difference de temperature
US5936193A (en) * 1997-05-09 1999-08-10 Parise; Ronald J. Nighttime solar cell
US20060021648A1 (en) * 1997-05-09 2006-02-02 Parise Ronald J Device and method to transmit waste heat or thermal pollution into deep space
JP4446064B2 (ja) * 2004-07-07 2010-04-07 独立行政法人産業技術総合研究所 熱電変換素子及び熱電変換モジュール
CN104392933B (zh) 2007-08-21 2017-11-07 加州大学评议会 具有高性能热电性质的纳米结构
US20110114146A1 (en) * 2009-11-13 2011-05-19 Alphabet Energy, Inc. Uniwafer thermoelectric modules
US9240328B2 (en) 2010-11-19 2016-01-19 Alphabet Energy, Inc. Arrays of long nanostructures in semiconductor materials and methods thereof
US8736011B2 (en) 2010-12-03 2014-05-27 Alphabet Energy, Inc. Low thermal conductivity matrices with embedded nanostructures and methods thereof
US9051175B2 (en) 2012-03-07 2015-06-09 Alphabet Energy, Inc. Bulk nano-ribbon and/or nano-porous structures for thermoelectric devices and methods for making the same
US9257627B2 (en) 2012-07-23 2016-02-09 Alphabet Energy, Inc. Method and structure for thermoelectric unicouple assembly
US9082930B1 (en) 2012-10-25 2015-07-14 Alphabet Energy, Inc. Nanostructured thermolectric elements and methods of making the same
US9691849B2 (en) 2014-04-10 2017-06-27 Alphabet Energy, Inc. Ultra-long silicon nanostructures, and methods of forming and transferring the same
DE102016209683A1 (de) * 2016-06-02 2017-12-07 Mahle International Gmbh Thermoelektrisches Modul

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH328594A (fr) * 1954-07-03 1958-03-15 Csf Dispositif électronique comportant un élément semi-conducteur
NL98125C (https=) * 1954-08-26 1900-01-01
US2902392A (en) * 1954-09-18 1959-09-01 Siemens Planiawerke Ag Work pieces for high temperature operation and method of making them
DE1080313B (de) * 1954-09-18 1960-04-21 Siemens Planiawerke Ag Molybdaendisilizid enthaltende Werkstuecke fuer hohe Temperaturen, insbesondere elektrisches Heizelement
DE1189282B (de) * 1954-12-28 1965-03-18 Siemens Planiawerke Ag Verwendung einer Sinterlegierung aus Kohlenstoff, Silizium und Molybdaen als Werkstoff zur Herstellung von warmfesten, elektrisch leitenden Teilen
NL208617A (https=) * 1955-05-10 1900-01-01
US2898743A (en) * 1956-07-23 1959-08-11 Philco Corp Electronic cooling device and method for the fabrication thereof
DE1155609B (de) * 1956-12-04 1963-10-10 Union Carbide Corp Ausgangsmaterial zur Herstellung oxydationsbestaendiger und hochtemperaturfester Gegenstaende, insbesondere selbst regenerierende Schutzueberzuege fuer Metallkoerper
US2952786A (en) * 1957-04-12 1960-09-13 Minnesota Mining & Mfg Temperature compensated crystal device
DE1120154B (de) * 1958-04-29 1961-12-21 Union Carbide Corp Gesinterte feuerfeste Hartmetallegierung auf der Grundlage von Molybdaendisilicid
US3086886A (en) * 1958-06-04 1963-04-23 Schwarzkopf Dev Co Process of providing oxidizable refractory-metal bodies with a corrosion-resistant surface coating
SE175893C1 (https=) * 1958-07-16 1961-07-04 Kanthal Ab
US2955145A (en) * 1958-07-16 1960-10-04 Kanthal Ab Thermo-electric alloys
US2994203A (en) * 1960-01-14 1961-08-01 Westinghouse Electric Corp Thermoelectric cooling device
BE638315A (https=) * 1961-06-09
US3256699A (en) * 1962-01-29 1966-06-21 Monsanto Co Thermoelectric unit and process of using to interconvert heat and electrical energy
US3192065A (en) * 1962-06-01 1965-06-29 North American Aviation Inc Method of forming molybdenum silicide coating on molybdenum
US3342567A (en) * 1963-12-27 1967-09-19 Rca Corp Low resistance bonds to germaniumsilicon bodies and method of making such bonds

Also Published As

Publication number Publication date
GB1106260A (en) 1968-03-13
NL6617324A (https=) 1967-06-12
NL6607137A (https=) 1966-12-12
BE681655A (https=) 1966-10-31
SE321723B (https=) 1970-03-16
FR1504284A (fr) 1967-12-01
US3441812A (en) 1969-04-29
GB1106287A (en) 1968-03-13
DE1489283B2 (de) 1970-10-15
DE1489283A1 (de) 1970-02-26
DE1483298B1 (de) 1971-01-28
US3523832A (en) 1970-08-11

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