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Publication of BE685039ApublicationCriticalpatent/BE685039A/fr
Modelling of thermal and electrical interaction in solid state devices(Flowgraph models of thermal and electrical parameters interaction in solid state devices, examining performance characteristics, system stability, etc)
Study of the interdiffusion of titanium, copper, and other metals in soldered junctions(Interdiffusion of titanium, copper, silver, nickel and other metals to determine service time of soldered titanium junctions, using Kirkendall effect)
Dispositif pour la fixation d'au moins un boitier electrique, ensemble et armoire electrique comprenant un tel dispositif, et procede de fabrication d'une machine incluant un tel dispositif
Dispositif pour la surveillance, dans une machine électrique, du circuit à courantcontinu, alimenté par des mutateurs de courant tournant avec l'arbre de la machine