BE631489A - - Google Patents

Info

Publication number
BE631489A
BE631489A BE631489DA BE631489A BE 631489 A BE631489 A BE 631489A BE 631489D A BE631489D A BE 631489DA BE 631489 A BE631489 A BE 631489A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE631489A publication Critical patent/BE631489A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)
BE631489D 1962-04-27 BE631489A (US07122603-20061017-C00045.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US190664A US3189978A (en) 1962-04-27 1962-04-27 Method of making multilayer circuits

Publications (1)

Publication Number Publication Date
BE631489A true BE631489A (US07122603-20061017-C00045.png)

Family

ID=22702275

Family Applications (1)

Application Number Title Priority Date Filing Date
BE631489D BE631489A (US07122603-20061017-C00045.png) 1962-04-27

Country Status (3)

Country Link
US (1) US3189978A (US07122603-20061017-C00045.png)
BE (1) BE631489A (US07122603-20061017-C00045.png)
GB (1) GB1020061A (US07122603-20061017-C00045.png)

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US3546776A (en) * 1962-09-06 1970-12-15 Aerovox Corp Process for manufacturing a ceramic multilayer circuit module
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3514834A (en) * 1966-01-28 1970-06-02 Stolle Corp Method for securing an elongated metal member to a flat metal sheet
US3346951A (en) * 1966-02-24 1967-10-17 Talon Inc Method of making electrical contact elements
US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
DE1301378B (de) * 1966-03-30 1969-08-21 Ibm Verfahren zur Herstellung vielschichtiger elektrischer Schaltungselemente auf keramischer Basis
US3423517A (en) * 1966-07-27 1969-01-21 Dielectric Systems Inc Monolithic ceramic electrical interconnecting structure
US3835530A (en) * 1967-06-05 1974-09-17 Texas Instruments Inc Method of making semiconductor devices
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3520054A (en) * 1967-11-13 1970-07-14 Mitronics Inc Method of making multilevel metallized ceramic bodies for semiconductor packages
US3458930A (en) * 1967-12-07 1969-08-05 Zenith Radio Corp Leadless inverted device forming process
US3545079A (en) * 1968-05-02 1970-12-08 Vitramon Inc Method of making multilayer circuit system
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
US3852877A (en) * 1969-08-06 1974-12-10 Ibm Multilayer circuits
US3717487A (en) * 1970-06-17 1973-02-20 Sprague Electric Co Ceramic slip composition
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch
US3770529A (en) * 1970-08-25 1973-11-06 Ibm Method of fabricating multilayer circuits
US3978248A (en) * 1970-12-18 1976-08-31 Hitachi, Ltd. Method for manufacturing composite sintered structure
US3731005A (en) * 1971-05-18 1973-05-01 Metalized Ceramics Corp Laminated coil
US3893230A (en) * 1971-11-15 1975-07-08 Ford Motor Co Method of manufacture of an exhaust gas sensor for an air-fuel ratio sensing system
DE2324006A1 (de) * 1972-05-18 1973-12-06 Ericsson Telefon Ab L M Verfahren zur herstellung einer mehrschicht-dickfilmschaltung mit leitenden kreuzverbindungen
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing
US3864810A (en) * 1972-09-27 1975-02-11 Minnesota Mining & Mfg Process and composite leadless chip carriers with external connections
US3788722A (en) * 1973-04-18 1974-01-29 Panel Technology Process for producing a gaseous breakdown display device
US3956052A (en) * 1974-02-11 1976-05-11 International Business Machines Corporation Recessed metallurgy for dielectric substrates
US3918148A (en) * 1974-04-15 1975-11-11 Ibm Integrated circuit chip carrier and method for forming the same
JPS5328266A (en) * 1976-08-13 1978-03-16 Fujitsu Ltd Method of producing multilayer ceramic substrate
JPS5382170A (en) * 1976-12-28 1978-07-20 Ngk Insulators Ltd Method of producing coupled type ic ceramic package
US4445274A (en) * 1977-12-23 1984-05-01 Ngk Insulators, Ltd. Method of manufacturing a ceramic structural body
JPS594873B2 (ja) * 1978-09-26 1984-02-01 松下電器産業株式会社 印刷配線板
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4437141A (en) 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4626818A (en) * 1983-11-28 1986-12-02 Centralab, Inc. Device for programmable thick film networks
JPS60203442A (ja) * 1984-03-28 1985-10-15 株式会社村田製作所 セラミツクグリ−ンシ−ト積層体の製造装置
JPS61236192A (ja) * 1985-04-12 1986-10-21 株式会社日立製作所 セラミツク基板の電極形成方法
US4641221A (en) * 1985-08-02 1987-02-03 The Dow Chemical Company Thin tape for dielectric materials
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
US4786342A (en) * 1986-11-10 1988-11-22 Coors Porcelain Company Method for producing cast tape finish on a dry-pressed substrate
AU1346088A (en) * 1987-02-04 1988-08-24 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
US4890383A (en) * 1988-01-15 1990-01-02 Simens Corporate Research & Support, Inc. Method for producing displays and modular components
US4843280A (en) * 1988-01-15 1989-06-27 Siemens Corporate Research & Support, Inc. A modular surface mount component for an electrical device or led's
US4920640A (en) * 1988-01-27 1990-05-01 W. R. Grace & Co.-Conn. Hot pressing dense ceramic sheets for electronic substrates and for multilayer electronic substrates
US5028650A (en) * 1988-01-27 1991-07-02 W. R. Grace & Co.-Conn. Boron nitride sheets
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
US5013347A (en) * 1989-06-29 1991-05-07 Microelectronic Packaging Inc. Glass bonding method
NL8901872A (nl) * 1989-07-20 1991-02-18 Stamicarbon Dunne zelfdragende anorganische groenlingen, en werkwijze voor het bereiden van dergelijke groenlingen.
US5411563A (en) * 1993-06-25 1995-05-02 Industrial Technology Research Institute Strengthening of multilayer ceramic/glass articles
US5523920A (en) * 1994-01-03 1996-06-04 Motorola, Inc. Printed circuit board comprising elevated bond pads
US5849396A (en) * 1995-09-13 1998-12-15 Hughes Electronics Corporation Multilayer electronic structure and its preparation
US6690165B1 (en) 1999-04-28 2004-02-10 Hironori Takahashi Magnetic-field sensing coil embedded in ceramic for measuring ambient magnetic field
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
US6830622B2 (en) * 2001-03-30 2004-12-14 Lam Research Corporation Cerium oxide containing ceramic components and coatings in semiconductor processing equipment and methods of manufacture thereof
US7579681B2 (en) * 2002-06-11 2009-08-25 Micron Technology, Inc. Super high density module with integrated wafer level packages
US20110291256A1 (en) * 2010-06-01 2011-12-01 Rainer Steiner Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US9889306B2 (en) 2012-01-16 2018-02-13 Greatbatch Ltd. Hermetically sealed feedthrough with co-fired filled via and conductive insert for an active implantable medical device
US10881867B2 (en) 2012-01-16 2021-01-05 Greatbatch Ltd. Method for providing a hermetically sealed feedthrough with co-fired filled via for an active implantable medical device
EP2636427B1 (en) 2012-01-16 2019-02-27 Greatbatch Ltd. Elevated hermetic feedthrough insulator adapted for side attachment of electrical conductors on the body fluid side of an active implantable medical device
US10046166B2 (en) 2012-01-16 2018-08-14 Greatbatch Ltd. EMI filtered co-connected hermetic feedthrough, feedthrough capacitor and leadwire assembly for an active implantable medical device
US10420949B2 (en) 2012-01-16 2019-09-24 Greatbatch Ltd. Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
CN111517758A (zh) * 2019-02-03 2020-08-11 苏州艾福电子通讯股份有限公司 一种微波介质陶瓷粉及其制备方法、及其应用
CN112038297B (zh) * 2020-08-14 2022-10-25 中国电子科技集团公司第十三研究所 氧化铝瓷件及其制作方法、陶瓷外壳的制作方法

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US3040119A (en) * 1960-12-27 1962-06-19 Granzow Clarence Edward Electric circuit board

Also Published As

Publication number Publication date
US3189978A (en) 1965-06-22
GB1020061A (en) 1966-02-16

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