BE630876A - - Google Patents

Info

Publication number
BE630876A
BE630876A BE630876DA BE630876A BE 630876 A BE630876 A BE 630876A BE 630876D A BE630876D A BE 630876DA BE 630876 A BE630876 A BE 630876A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of BE630876A publication Critical patent/BE630876A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/28Non-electron-emitting electrodes; Screens
    • H01J19/32Anodes
    • H01J19/36Cooling of anodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J7/00Details not provided for in the preceding groups and common to two or more basic types of discharge tubes or lamps
    • H01J7/24Cooling arrangements; Heating arrangements; Means for circulating gas or vapour within the discharge space
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00Discharge tubes and lamps
    • H01J2893/0001Electrodes and electrode systems suitable for discharge tubes or lamps
    • H01J2893/0012Constructional arrangements
    • H01J2893/0027Mitigation of temperature effects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BE630876D 1962-08-29 BE630876A (US06262066-20010717-C00424.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US220261A US3277346A (en) 1962-08-29 1962-08-29 Cooler package for electronic components

Publications (1)

Publication Number Publication Date
BE630876A true BE630876A (US06262066-20010717-C00424.png)

Family

ID=22822803

Family Applications (1)

Application Number Title Priority Date Filing Date
BE630876D BE630876A (US06262066-20010717-C00424.png) 1962-08-29

Country Status (7)

Country Link
US (1) US3277346A (US06262066-20010717-C00424.png)
JP (1) JPS4015780B1 (US06262066-20010717-C00424.png)
BE (1) BE630876A (US06262066-20010717-C00424.png)
CH (1) CH423994A (US06262066-20010717-C00424.png)
GB (1) GB976053A (US06262066-20010717-C00424.png)
NL (2) NL122287C (US06262066-20010717-C00424.png)
SE (1) SE310220B (US06262066-20010717-C00424.png)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3356902A (en) * 1966-10-20 1967-12-05 Lear Siegler Inc Mounting chassis for electrical components
CA828390A (en) * 1967-02-15 1969-11-25 Powercube Corporation Modular circuit package
US3434014A (en) * 1967-06-13 1969-03-18 Rca Corp Packaging of electrical equipment
US3961666A (en) * 1972-11-24 1976-06-08 Sony Corporation Heat dispersion device for use in an electronic apparatus
US3967874A (en) * 1975-09-30 1976-07-06 Calabro Anthony Denis Uniformly cooled printed circuit board mounting assembly
US4779031A (en) * 1985-12-30 1988-10-18 Intellico, Inc. Motor system
US5038088A (en) * 1985-12-30 1991-08-06 Arends Gregory E Stepper motor system
US4691274A (en) * 1986-04-29 1987-09-01 Modular Power Corporation Modular electronic power supply
US4730235A (en) * 1987-01-16 1988-03-08 Itek Corporation Cascadable carrier for high power semiconductors or other electronic components
DE4015030C1 (US06262066-20010717-C00424.png) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
US5749413A (en) * 1991-09-23 1998-05-12 Sundstrand Corporation Heat exchanger for high power electrical component and package incorporating same
GB9301049D0 (en) * 1993-01-20 1993-03-10 The Technology Partnership Plc Mounting assembly
US5353863A (en) * 1994-03-07 1994-10-11 Yu Chi T Pentium CPU cooling device
JP3942248B2 (ja) * 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
US6125920A (en) * 1997-10-16 2000-10-03 Herbert; Edward Fan with heat sink using stamped heat sink fins
JP2001210763A (ja) * 2000-01-27 2001-08-03 Mitsubishi Electric Corp 半導体モジュ−ル装置
US7017651B1 (en) * 2000-09-13 2006-03-28 Raytheon Company Method and apparatus for temperature gradient control in an electronic system
US7148452B2 (en) * 2001-04-03 2006-12-12 Emerson Electric Co. Heat sink for printed circuit board components
DE10140328B4 (de) * 2001-08-16 2006-02-02 Siemens Ag Kühlanordnung zur Kühlung elektronischer Bauelemente
US6580608B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Method and apparatus for thermally controlling multiple electronic components
TW545623U (en) * 2001-12-27 2003-08-01 Chin-Wen Wang Rotation type CPU cooling device
GB2388469A (en) * 2002-04-16 2003-11-12 Chin-Wen Wang Heat radiator
JP2005328659A (ja) * 2004-05-14 2005-11-24 Sansha Electric Mfg Co Ltd 電子負荷装置および電源装置の防塵冷却構造
EP1684344A3 (en) * 2005-01-25 2006-10-18 Coolit Systems Inc. Heat sink
CA2573941A1 (en) 2007-01-15 2008-07-15 Coolit Systems Inc. Computer cooling system
US7626822B2 (en) * 2007-12-12 2009-12-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink assembly for multiple electronic components
US7796388B2 (en) * 2008-03-17 2010-09-14 Ut-Battelle, Llc Direct cooled power electronics substrate
FI122215B (fi) * 2009-03-13 2011-10-14 Abb Oy Järjestely moottoriohjainta varten
US8279597B2 (en) 2010-05-27 2012-10-02 International Business Machines Corporation Heatsink allowing in-situ maintenance in a stackable module
US8174826B2 (en) 2010-05-27 2012-05-08 International Business Machines Corporation Liquid cooling system for stackable modules in energy-efficient computing systems
US8358503B2 (en) 2010-05-28 2013-01-22 International Business Machines Corporation Stackable module for energy-efficient computing systems
US8179674B2 (en) 2010-05-28 2012-05-15 International Business Machines Corporation Scalable space-optimized and energy-efficient computing system
JP5695115B2 (ja) * 2013-03-30 2015-04-01 三協立山株式会社 ヒートシンク及びその製造方法
US10389211B2 (en) * 2014-10-08 2019-08-20 Borgwarner Inc. Axially extending electric machine electronics cooling tower
WO2016057558A1 (en) * 2014-10-08 2016-04-14 Remy Technologies, Llc Centrally located control electronics for electric machine
EP3018709B1 (de) * 2014-11-04 2018-07-18 SEMIKRON Elektronik GmbH & Co. KG Stromrichtereinrichtung
TWI539894B (zh) * 2014-11-28 2016-06-21 財團法人工業技術研究院 功率模組
EP3113221B1 (en) * 2015-07-02 2020-03-18 Rohde & Schwarz GmbH & Co. KG Passive cooling module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE527420A (US06262066-20010717-C00424.png) * 1953-03-20
GB768103A (en) * 1954-08-17 1957-02-13 Gen Electric Co Ltd Improvements in or relating to semiconductor devices
US2998962A (en) * 1957-09-10 1961-09-05 Ind Co Kleinewefers Konst Cylindrical radiation recuperator with upper and lower air distributor
GB882788A (en) * 1958-07-05 1961-11-22 Reinold Hagen Process and apparatus for manufacturing bottles and the like neck-provided articles from thermoplastic material
US2999971A (en) * 1958-07-10 1961-09-12 Siemens Ag Power current rectifier with semiconducting rectifier units
US3149666A (en) * 1961-06-15 1964-09-22 Wakefield Eng Inc Cooler

Also Published As

Publication number Publication date
SE310220B (US06262066-20010717-C00424.png) 1969-04-21
JPS4015780B1 (US06262066-20010717-C00424.png) 1965-07-22
US3277346A (en) 1966-10-04
NL291309A (US06262066-20010717-C00424.png)
CH423994A (de) 1966-11-15
NL122287C (US06262066-20010717-C00424.png)
GB976053A (en) 1964-11-25

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