BE627126A - - Google Patents

Info

Publication number
BE627126A
BE627126A BE627126DA BE627126A BE 627126 A BE627126 A BE 627126A BE 627126D A BE627126D A BE 627126DA BE 627126 A BE627126 A BE 627126A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of BE627126A publication Critical patent/BE627126A/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
BE627126D 1962-01-15 BE627126A (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL273574 1962-01-15

Publications (1)

Publication Number Publication Date
BE627126A true BE627126A (en:Method) 1900-01-01

Family

ID=19753534

Family Applications (1)

Application Number Title Priority Date Filing Date
BE627126D BE627126A (en:Method) 1962-01-15

Country Status (6)

Country Link
US (1) US3205572A (en:Method)
BE (1) BE627126A (en:Method)
DE (1) DE1214327B (en:Method)
ES (1) ES284112A1 (en:Method)
GB (1) GB1010698A (en:Method)
NL (1) NL273574A (en:Method)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717742A (en) * 1970-06-26 1973-02-20 Circa Tran Inc Method and apparatus for forming printed circuit boards with infrared radiation
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
DE2105513C3 (de) * 1971-02-05 1973-09-27 Siemens Ag, 1000 Berlin U. 8000 Muenchen Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
US3797100A (en) * 1971-04-12 1974-03-19 L Browne Soldering method and apparatus for ceramic circuits
US3825994A (en) * 1972-11-15 1974-07-30 Rca Corp Method of soldering circuit components to a substrate
US6301436B1 (en) * 2000-10-12 2001-10-09 Yu-Ju Hsiao Photothermic desoldering unit
EP1732118B1 (en) * 2004-03-30 2011-05-11 Tamura Corporation Heater, reflow apparatus with such heater

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB152821A (en) * 1919-08-15 1920-10-28 Oscar Kjellberg Improvements in or relating to the assembly of metal parts for electric or other welding, rivetting or like operations
US2346555A (en) * 1937-10-09 1944-04-11 Weston Electrical Instr Corp Method of producing magnetic structures
US2425127A (en) * 1943-12-20 1947-08-05 Nat Union Radio Corp Apparatus for assembly of mounts
US2616383A (en) * 1946-09-06 1952-11-04 Emerson Electric Mfg Co Apparatus for aligning and holding type blocks for soldering
US2532800A (en) * 1947-12-17 1950-12-05 Peter J Adinamis Light fixture
US2601011A (en) * 1948-09-21 1952-06-17 Westinghouse Electric Corp Heating apparatus
US2535500A (en) * 1949-12-01 1950-12-26 Looft Otto Plate and dish warming dining table
US2859368A (en) * 1951-10-20 1958-11-04 Sylvania Electric Prod Heat lamp
US2727301A (en) * 1952-02-04 1955-12-20 Continental Can Co Method of soldering a lap side seam in a can body
NL91691C (en:Method) * 1952-02-07
DE1041700B (de) * 1954-07-30 1958-10-23 Siemens Ag Vorrichtung zum tiegellosen Zonenschmelzen von stabfoermigen Halbleiterwerkstuecken
NL111325C (en:Method) * 1958-02-07
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US3128544A (en) * 1959-04-28 1964-04-14 William D Allingham Method of making a panel
US3061919A (en) * 1959-07-13 1962-11-06 Clevite Corp Magnetic loading method and apparatus
US2991347A (en) * 1959-12-14 1961-07-04 Hoffman Electronics Corp Magnetic jig for alloying
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
NL260810A (en:Method) * 1961-02-03

Also Published As

Publication number Publication date
GB1010698A (en) 1965-11-24
ES284112A1 (es) 1963-07-01
US3205572A (en) 1965-09-14
NL273574A (en:Method) 1900-01-01
DE1214327B (de) 1966-04-14

Similar Documents

Publication Publication Date Title
AT2567B (en:Method)
AT10914B (en:Method)
AT13369B (en:Method)
AT14210B (en:Method)
DE7600604U1 (en:Method)
AT14248B (en:Method)
AT2206B (en:Method)
AT12891B (en:Method)
AT12071B (en:Method)
AT2766B (en:Method)
AT2757B (en:Method)
AT2598B (en:Method)
AT2595B (en:Method)
AT2795B (en:Method)
AT2559B (en:Method)
AT2542B (en:Method)
AT2518B (en:Method)
AT2363B (en:Method)
AT13580B (en:Method)
AT2340B (en:Method)
AT13807B (en:Method)
AT2094B (en:Method)
AT18154B (en:Method)
AT1693B (en:Method)
AT13088B (en:Method)