ES284112A1 - Método y dispositivo para soldar hilos de conexión a un cuerpo semiconductor - Google Patents

Método y dispositivo para soldar hilos de conexión a un cuerpo semiconductor

Info

Publication number
ES284112A1
ES284112A1 ES284112A ES284112A ES284112A1 ES 284112 A1 ES284112 A1 ES 284112A1 ES 284112 A ES284112 A ES 284112A ES 284112 A ES284112 A ES 284112A ES 284112 A1 ES284112 A1 ES 284112A1
Authority
ES
Spain
Prior art keywords
semiconductor body
translation
machine
legally binding
google translate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES284112A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES284112A1 publication Critical patent/ES284112A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01032—Germanium [Ge]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
ES284112A 1962-01-15 1963-01-12 Método y dispositivo para soldar hilos de conexión a un cuerpo semiconductor Expired ES284112A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL273574 1962-01-15

Publications (1)

Publication Number Publication Date
ES284112A1 true ES284112A1 (es) 1963-07-01

Family

ID=19753534

Family Applications (1)

Application Number Title Priority Date Filing Date
ES284112A Expired ES284112A1 (es) 1962-01-15 1963-01-12 Método y dispositivo para soldar hilos de conexión a un cuerpo semiconductor

Country Status (6)

Country Link
US (1) US3205572A (es)
BE (1) BE627126A (es)
DE (1) DE1214327B (es)
ES (1) ES284112A1 (es)
GB (1) GB1010698A (es)
NL (1) NL273574A (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717742A (en) * 1970-06-26 1973-02-20 Circa Tran Inc Method and apparatus for forming printed circuit boards with infrared radiation
US3680199A (en) * 1970-07-06 1972-08-01 Texas Instruments Inc Alloying method
DE2105513C3 (de) * 1971-02-05 1973-09-27 Siemens Ag, 1000 Berlin U. 8000 Muenchen Infrarotlötverfahren für das Befestigen von Bauteilen durch Wiederaufschmelzen von Lot sowie Lötvorrichtung zur Durchführung des Verfahrens
US3742181A (en) * 1971-02-25 1973-06-26 Argus Eng Co Method and apparatus for heatbonding in a local area using combined heating techniques
US3797100A (en) * 1971-04-12 1974-03-19 L Browne Soldering method and apparatus for ceramic circuits
US3825994A (en) * 1972-11-15 1974-07-30 Rca Corp Method of soldering circuit components to a substrate
US6301436B1 (en) * 2000-10-12 2001-10-09 Yu-Ju Hsiao Photothermic desoldering unit
JP4759509B2 (ja) * 2004-03-30 2011-08-31 株式会社タムラ製作所 はんだバンプ形成方法及び装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB152821A (en) * 1919-08-15 1920-10-28 Oscar Kjellberg Improvements in or relating to the assembly of metal parts for electric or other welding, rivetting or like operations
US2346555A (en) * 1937-10-09 1944-04-11 Weston Electrical Instr Corp Method of producing magnetic structures
US2425127A (en) * 1943-12-20 1947-08-05 Nat Union Radio Corp Apparatus for assembly of mounts
US2616383A (en) * 1946-09-06 1952-11-04 Emerson Electric Mfg Co Apparatus for aligning and holding type blocks for soldering
US2532800A (en) * 1947-12-17 1950-12-05 Peter J Adinamis Light fixture
US2601011A (en) * 1948-09-21 1952-06-17 Westinghouse Electric Corp Heating apparatus
US2535500A (en) * 1949-12-01 1950-12-26 Looft Otto Plate and dish warming dining table
US2859368A (en) * 1951-10-20 1958-11-04 Sylvania Electric Prod Heat lamp
US2727301A (en) * 1952-02-04 1955-12-20 Continental Can Co Method of soldering a lap side seam in a can body
NL91691C (es) * 1952-02-07
DE1041700B (de) * 1954-07-30 1958-10-23 Siemens Ag Vorrichtung zum tiegellosen Zonenschmelzen von stabfoermigen Halbleiterwerkstuecken
NL111325C (es) * 1958-02-07
US3046651A (en) * 1958-03-14 1962-07-31 Honeywell Regulator Co Soldering technique
US3128544A (en) * 1959-04-28 1964-04-14 William D Allingham Method of making a panel
US3061919A (en) * 1959-07-13 1962-11-06 Clevite Corp Magnetic loading method and apparatus
US2991347A (en) * 1959-12-14 1961-07-04 Hoffman Electronics Corp Magnetic jig for alloying
US2987597A (en) * 1959-12-22 1961-06-06 Philco Corp Electrical component assembly
NL260810A (es) * 1961-02-03

Also Published As

Publication number Publication date
US3205572A (en) 1965-09-14
BE627126A (es) 1900-01-01
DE1214327B (de) 1966-04-14
GB1010698A (en) 1965-11-24
NL273574A (es) 1900-01-01

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