BE621964A - - Google Patents
Info
- Publication number
- BE621964A BE621964A BE621964DA BE621964A BE 621964 A BE621964 A BE 621964A BE 621964D A BE621964D A BE 621964DA BE 621964 A BE621964 A BE 621964A
- Authority
- BE
- Belgium
Links
Classifications
-
- H10W76/60—
-
- H10P52/00—
-
- H10P95/00—
-
- H10P95/50—
-
- H10W72/071—
-
- H10W74/131—
-
- H10W76/10—
-
- H10W76/138—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES75519A DE1174930B (de) | 1961-08-31 | 1961-08-31 | Verfahren zum Laeppen der Oberflaechen von mit einem Lochueberzug versehenen Halbleiterkoerpern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE621964A true BE621964A (en:Method) |
Family
ID=7505414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE621964D BE621964A (en:Method) | 1961-08-31 |
Country Status (4)
| Country | Link |
|---|---|
| BE (1) | BE621964A (en:Method) |
| CH (1) | CH401275A (en:Method) |
| DE (1) | DE1174930B (en:Method) |
| GB (1) | GB996989A (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112435954B (zh) * | 2020-11-25 | 2024-01-26 | 西安奕斯伟材料科技股份有限公司 | 一种晶圆载体的处理方法和晶圆载体 |
-
0
- BE BE621964D patent/BE621964A/xx unknown
-
1961
- 1961-08-31 DE DES75519A patent/DE1174930B/de active Pending
-
1962
- 1962-06-27 CH CH770662A patent/CH401275A/de unknown
- 1962-08-31 GB GB33624/62A patent/GB996989A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CH401275A (de) | 1965-10-31 |
| DE1174930B (de) | 1964-07-30 |
| GB996989A (en) | 1965-06-30 |